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公开(公告)号：US12069808B2
公开(公告)日：2024-08-20
申请号：US17634019
申请日：2020-08-18
CPC classification number: H05K1/189 , H05K1/0283 , H05K1/038 , H05K1/0393 , H05K3/321 , H05K2201/0129 , H05K2201/0323 , H05K2203/0278
Abstract: An electronic component (1) is connected to a conductive track (2) on a flexible substrate (3). A connection layer (4) of a composition comprising a thermoplastic material (TPM1) is provided on the conductive track (2). The connection layer (4) has at least one cutout (5) aligned to overlap the conductive track (2). A thermosetting material (TSM1) in liquid state is used to fill the cutout (5). The electronic component (1) is provided on top of the connection layer (4). By applying heat, a temperature of the connection layer (4) is raised to above a softening temperature of the thermoplastic material (TPM1). Pressure is applied to form a mechanical connection. By the application of heat (H) a temperature of the thermosetting material (TSM1) is raised above its thermosetting temperature for solidifying the thermosetting material (TSM1) and forming an electrical connection (E).
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公开(公告)号：US20240121932A1
公开(公告)日：2024-04-11
申请号：US17963486
申请日：2022-10-11
Applicant: Cisco Technology, Inc.
Inventor： Robert Gregory Twiss
CPC classification number: H05K13/046 , H05K3/303 , H05K2201/066 , H05K2201/10265 , H05K2201/10409 , H05K2201/10598 , H05K2203/0278
Abstract: Apparatuses, systems, and methods for a controlled-force thermal management device installation that helps thermal management of emerging, next-generation devices are provided. An apparatus includes at least two compression interfaces, each for compressing a mounting assembly of a thermal management device to a predetermined loading point. The apparatus further includes a frame configured to apply a preload force to the at least two compression interfaces. The frame has a pivoting joint at an assembly point for each of the at least two compression interfaces to balance the preload force between the at least two compression interfaces.
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公开(公告)号：US20230199945A1
公开(公告)日：2023-06-22
申请号：US17923424
申请日：2021-06-11
Applicant: LG ENERGY SOLUTION, LTD.
Inventor： Ga Young WOO , Seog Jin YOON
CPC classification number: H05K1/028 , H05K1/0266 , H05K3/0014 , H05K3/0047 , H05K3/0023 , H05K3/381 , H05K3/384 , H05K13/04 , H05K2203/0278 , H05K2203/0264 , H05K2201/05 , H05K2201/09936
Abstract: The present disclosure relates to a flexible printed circuit board (FPCB) and a method for manufacturing a flexible printed circuit board, which is capable of minimizing a process tolerance generated when an outer shape of a board is processed by forming a reference mark in the FPCB and performing an outer shape processing by using the reference mark as a reference point among a series of processes for manufacturing the board.
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公开(公告)号：US20180162111A1
公开(公告)日：2018-06-14
申请号：US15575442
申请日：2016-06-03
Applicant: Nikko-Materials Co., Ltd.
Inventor： Kazutoshi IWATA , Yoshiaki HONMA
CPC classification number: B32B37/1054 , B29C43/28 , B29C43/58 , B29C2043/5808 , B29C2043/5833 , B29K2905/00 , B29L2031/34 , B29L2031/3425 , B32B37/1018 , B32B41/00 , B32B2457/08 , H05K3/4655 , H05K2203/0278 , H05K2203/063 , H05K2203/085 , H05K2203/163
Abstract: A laminating apparatus includes workpiece transport units, a vacuum laminating device and a flat press device. The flat press device includes a ball screw having a screw shaft and supporting a first one of a pair of pressing elements, a servomotor connected to the screw shaft of the ball screw, a gap measuring device (linear scale) for measuring a distance between the first pressing element and the second pressing element, and a pressing gap control system for moving the first pressing element to a position in which a predetermined gap is defined between the first pressing element and the second pressing element to stop the first pressing element at that position. The pressing gap control system changes the RPM of the servomotor, based on information on the distance between the first and second pressing elements which is provided from the gap measuring device.
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5.发明授权
公开(公告)号：US09997491B2
公开(公告)日：2018-06-12
申请号：US14406958
申请日：2014-04-16
Applicant: Sony Corporation
Inventor： Takeshi Ichimura
CPC classification number: H01L24/81 , H01L21/563 , H01L21/565 , H01L23/293 , H01L23/3142 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/83 , H01L24/91 , H01L2224/131 , H01L2224/16238 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81193 , H01L2224/81203 , H01L2224/83192 , H01L2224/83203 , H01L2224/83862 , H01L2224/9211 , H01L2924/0665 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H05K1/144 , H05K3/305 , H05K3/3436 , H05K3/363 , H05K2201/041 , H05K2201/10977 , H05K2203/0278 , H05K2203/1105 , H05K2203/1305 , Y02P70/613 , H01L2924/00014 , H01L2924/014 , H01L2224/81 , H01L2224/83
Abstract: A method of determining curing conditions is for determining the curing conditions of a thermosetting resin to seal a conductive part between a substrate and an electronic component. A curing degree curve is created. The curing degree curve indicates, with respect to each of heating temperatures, relationship between heating time and curing degree of the thermosetting resin. On the basis of the created curing degree curve, a void removal time of a void naturally moving upward in the thermosetting resin, at a first heating temperature, is calculated. The first heating temperature is one of the heating temperatures.
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公开(公告)号：US09949376B2
公开(公告)日：2018-04-17
申请号：US14563778
申请日：2014-12-08
Applicant: Second Sight Medical Products, Inc.
Inventor： Robert J Greenberg , Neil H Talbot , James S Little
IPC: A61N1/375 , A61N1/05 , A61N1/36 , A61N1/372 , H05K3/28 , H05K1/11 , H05K1/14 , A61B5/00 , A61B5/0478 , H05K1/18 , H01L23/055 , H05K1/02 , H05K1/03 , H05K1/09 , H05K3/00 , H05K3/32 , H05K3/36 , H05K3/40
CPC classification number: H05K3/282 , A61B5/0006 , A61B5/0478 , A61B5/4836 , A61B5/6868 , A61B2562/0209 , A61B2562/046 , A61B2562/125 , A61N1/0529 , A61N1/0531 , A61N1/0534 , A61N1/3606 , A61N1/36071 , A61N1/36082 , A61N1/36139 , A61N1/375 , A61N1/3752 , A61N1/3754 , H01L23/055 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H05K1/02 , H05K1/0271 , H05K1/028 , H05K1/0281 , H05K1/0306 , H05K1/092 , H05K1/11 , H05K1/111 , H05K1/145 , H05K1/147 , H05K1/189 , H05K3/0044 , H05K3/005 , H05K3/0058 , H05K3/28 , H05K3/321 , H05K3/363 , H05K3/4015 , H05K3/4061 , H05K2201/0245 , H05K2201/053 , H05K2201/055 , H05K2201/09063 , H05K2201/09145 , H05K2201/09163 , H05K2201/097 , H05K2201/09981 , H05K2201/10303 , H05K2201/10318 , H05K2201/10674 , H05K2201/10795 , H05K2201/10931 , H05K2201/2009 , H05K2203/0195 , H05K2203/025 , H05K2203/0278 , H05K2203/0307 , H05K2203/068 , H05K2203/082 , H05K2203/1322 , H05K2203/1327 , H05K2203/1394 , H05K2203/1461 , H05K2203/1476 , H05K2203/162 , H05K2203/304 , H01L2924/00014 , H01L2924/00
Abstract: The present invention consists of an implantable device with at least one package that houses electronics that sends and receives data or signals, and optionally power, from an external system through at least one coil attached to at least one package and processes the data, including recordings of neural activity, and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that are attached to the at least one package. The device is adapted to electrocorticographic (ECoG) and local field potential (LFP) signals. A brain stimulator, preferably a deep brain stimulator, stimulates the brain in response to neural recordings in a closed feedback loop. The device is advantageous in providing neuromodulation therapies for neurological disorders such as chronic pain, post traumatic stress disorder (PTSD), major depression, or similar disorders. The invention and components thereof are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain.
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7.发明申请
公开(公告)号：US20180067573A1
公开(公告)日：2018-03-08
申请号：US15807998
申请日：2017-11-09
Applicant: FUJIFILM Corporation
Inventor： Haruhiko MIYAMOTO
CPC classification number: G06F3/041 , G06F2203/04103 , G06F2203/04112 , H05K1/119 , H05K3/0014 , H05K3/28 , H05K2201/09736 , H05K2203/0278 , H05K2203/085 , H05K2203/302
Abstract: The conductor for a touch panel is manufactured by forming, on an insulating transparent cover member, at least one the thickness changed part obtained by changing a thickness of a portion to be deformed during forming with respect to a thickness of other portion in advance, forming a conductive film laminate by disposing a conductive member on a surface of the cover member, and performing collective forming into a three-dimensional shape such that the conductive film laminate is deformed at a portion where the thickness changed part is formed.
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公开(公告)号：US20180044558A1
公开(公告)日：2018-02-15
申请号：US15729162
申请日：2017-10-10
Applicant: DEXERIALS CORPORATION
Inventor： Seiichiro SHINOHARA
IPC: C09J9/02 , H01R4/04 , C09J7/00 , H05K3/32 , H01R43/00 , H05K3/30 , C09J11/04 , C08K3/04 , C08K3/08 , H01R12/62
CPC classification number: C09J9/02 , C08K3/04 , C08K3/08 , C08K2201/001 , C09J7/10 , C09J11/04 , C09J2201/602 , C09J2203/326 , C09J2205/102 , H01R4/04 , H01R12/62 , H01R43/007 , H05K3/323 , H05K2201/0224 , H05K2203/0139 , H05K2203/0278
Abstract: A step of scattering electrically conductive particles on a wiring board having wiring that is formed in accordance with an array pattern of the electrically conductive particles and prevented from being charged, and charging the electrically conductive particles; a step of aligning the charged electrically conductive particles in a predetermined array pattern corresponding to the wiring pattern by moving a squeegee on the wiring board; and a step of bonding a transfer film having an adhesive material layer formed thereon to the wiring board and transferring the electrically conductive particles aligned in a predetermined array pattern to the adhesive layer.
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公开(公告)号：US20170374747A1
公开(公告)日：2017-12-28
申请号：US15622733
申请日：2017-06-14
Inventor： Dror Hurwitz , Alex Huang
CPC classification number: H05K3/4007 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L2224/13111 , H01L2224/16225 , H01L2224/81192 , H01L2224/81805 , H01L2924/00011 , H01L2924/01322 , H05K1/112 , H05K3/0041 , H05K3/108 , H05K3/26 , H05K3/3473 , H05K3/4647 , H05K2201/09436 , H05K2201/10674 , H05K2203/025 , H05K2203/0278 , H05K2203/043 , H05K2203/0465 , H01L2924/00014
Abstract: A method of attaching a chip to the substrate with an outer layer comprising via pillars embedded in a dielectric such as solder mask, with ends of the via pillars flush with said dielectric, the method comprising the steps of: (o) optionally removing organic varnish, (p) positioning a chip having legs terminated with solder bumps in contact with exposed ends of the via pillars, and (q) applying heat to melt the solder bumps and to wet the ends of the vias with solder.
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公开(公告)号：US09816012B2
公开(公告)日：2017-11-14
申请号：US14904456
申请日：2014-07-28
Applicant: DEXERIALS CORPORATION
Inventor： Seiichiro Shinohara
IPC: B32B3/00 , C09J9/02 , C09J7/00 , C09J11/04 , H01R4/04 , H01R43/00 , H05K3/32 , H05K3/30 , C08K3/04 , C08K3/08 , H01R12/62
CPC classification number: C09J9/02 , C08K3/04 , C08K3/08 , C08K2201/001 , C09J7/00 , C09J7/10 , C09J11/04 , C09J2201/602 , C09J2203/326 , C09J2205/102 , H01R4/04 , H01R12/62 , H01R43/007 , H05K3/303 , H05K3/323 , H05K2201/0224 , H05K2203/0139 , H05K2203/0278
Abstract: A step of scattering electrically conductive particles on a wiring board having wiring that is formed in accordance with an array pattern of the electrically conductive particles and prevented from being charged, and charging the electrically conductive particles; a step of aligning the charged electrically conductive particles in a predetermined array pattern corresponding to the wiring pattern by moving a squeegee on the wiring board; and a step of bonding a transfer film having an adhesive material layer formed thereon to the wiring board and transferring the electrically conductive particles aligned in a predetermined array pattern to the adhesive layer.
