公开(公告)号：US20240206076A1

公开(公告)日：2024-06-20

申请号：US18591060

申请日：2024-02-29

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Henrik B. van Lengerich ,  Matthew S. Stay ,  Caleb T. Nelson ,  David J. Tarnowski ,  David J. Rowe ,  Edwin L. Kusilek

IPC: H05K3/04 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K3/048 ,  H05K1/028 ,  H05K3/0014 ,  H05K2201/09036 ,  H05K2203/0769

Abstract: Methods of making metal patterns on flexible substrates are provided. A releasable solid layer is selectively formed on a patterned surface of the flexible substrate by applying a liquid solution thereon. The releasable solid layer is transferred from the patterned surface to a transfer layer where the metal patterns are formed.

公开(公告)号：US20180311889A1

公开(公告)日：2018-11-01

申请号：US15770638

申请日：2016-10-25

Applicant: EV Group E. Thallner GmbH

Inventor： Gerald Mittendorfer

IPC: B29C63/00 ,  B32B27/28 ,  B32B27/30

CPC classification number: B29C63/0013 ,  B29C2063/006 ,  B32B3/30 ,  B32B7/06 ,  B32B7/12 ,  B32B9/04 ,  B32B27/06 ,  B32B27/08 ,  B32B27/16 ,  B32B27/281 ,  B32B27/283 ,  B32B27/285 ,  B32B27/308 ,  B32B27/34 ,  B32B27/38 ,  B32B2250/44 ,  B32B2307/51 ,  B32B2307/714 ,  B32B2307/748 ,  B32B2457/14 ,  H01L23/3135 ,  H05K3/007 ,  H05K3/0079 ,  H05K3/0085 ,  H05K3/0097 ,  H05K2203/0769 ,  H05K2203/1361 ,  H05K2203/1366 ,  H05K2203/1383 ,  H05K2203/1545 ,  H05K2203/1563

Abstract: A method for treating a substrate having millimeter and/or micrometer and/or nanometer structures. The method includes applying at least one protective material to the structures, wherein the at least one protective material can be dissolved in a solvent, and the structures are produced by an imprinting process.

公开(公告)号：US20180004318A1

公开(公告)日：2018-01-04

申请号：US15200949

申请日：2016-07-01

Applicant: Khaled Ahmed ,  Prashant Majhi

Inventor： Khaled Ahmed ,  Prashant Majhi

IPC: G06F3/041 ,  C23C14/34 ,  H05K1/09 ,  C23C16/50 ,  C23C14/14 ,  H05K1/02 ,  H01J37/32 ,  C23C16/24

CPC classification number: G06F3/041 ,  G06F2203/04102 ,  G06F2203/04103 ,  H01J37/32009 ,  H01J37/32532 ,  H01J2237/3321 ,  H01J2237/334 ,  H05K1/0271 ,  H05K1/0346 ,  H05K1/0393 ,  H05K1/09 ,  H05K3/0014 ,  H05K3/007 ,  H05K3/027 ,  H05K3/067 ,  H05K3/107 ,  H05K2201/0154 ,  H05K2201/0323 ,  H05K2201/0338 ,  H05K2201/0341 ,  H05K2201/0385 ,  H05K2201/0391 ,  H05K2203/0759 ,  H05K2203/0769 ,  H05K2203/107

Abstract: Systems, apparatuses, and/or methods to manufacture and/or implement a sensor film, a composite electrode, and/or a computing device such as a flexible device. The sensor film may include a random network of metal lines and graphene interconnecting the metal lines. The composite electrode may be formed from the sensor film. In addition, the composite electrode may include a first portion including a metal layer in a graphene layer, wherein the metal layer is randomly located in the graphene layer, and a second portion excluding the metal layer and including the graphene layer. The sensor film may be patterned to include any composite electrode configuration, such as an antenna electrode configuration, a touch electrode configuration, and so on. Thus, the flexible device may include a flexible touch screen.

公开(公告)号：US09611402B2

公开(公告)日：2017-04-04

申请号：US14989270

申请日：2016-01-21

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Krishna Balantrapu ,  Robert K. Barr

IPC: C09D11/34 ,  C09D11/10 ,  C09D133/10 ,  H05K3/06 ,  H05K3/00 ,  C09D11/101 ,  C09D11/12 ,  C09D11/38 ,  C09D133/08 ,  C09D135/02 ,  H05K3/18 ,  C09D11/107

CPC classification number: C09D11/34 ,  C09D11/101 ,  C09D11/107 ,  C09D11/12 ,  C09D11/38 ,  C09D133/08 ,  C09D133/10 ,  C09D135/02 ,  H05K3/002 ,  H05K3/0023 ,  H05K3/0076 ,  H05K3/0079 ,  H05K3/0082 ,  H05K3/061 ,  H05K3/18 ,  H05K3/181 ,  H05K2203/013 ,  H05K2203/0545 ,  H05K2203/0769 ,  H05K2203/0793 ,  H05K2203/122

Abstract: Hot melt compositions include non-aromatic cyclic (alkyl)acrylates and low acid number waxes. Upon application of actinic radiation, the hot melt compositions cure to form resists. They may be stripped from substrates with high alkaline strippers. The hot melt compositions may be used in the manufacture of printed circuit boards and photovoltaic devices.

公开(公告)号：US20160066430A1

公开(公告)日：2016-03-03

申请号：US14931143

申请日：2015-11-03

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Krishna BALANTRAPU ,  Robert K. BARR

IPC: H05K3/00 ,  H05K3/18 ,  C09D135/02 ,  C09D133/08 ,  C09D133/10

CPC classification number: C09D11/34 ,  C09D11/101 ,  C09D11/107 ,  C09D11/12 ,  C09D11/38 ,  C09D133/08 ,  C09D133/10 ,  C09D135/02 ,  H05K3/002 ,  H05K3/0023 ,  H05K3/0076 ,  H05K3/0079 ,  H05K3/0082 ,  H05K3/061 ,  H05K3/18 ,  H05K3/181 ,  H05K2203/013 ,  H05K2203/0545 ,  H05K2203/0769 ,  H05K2203/0793 ,  H05K2203/122

Abstract: Hot melt compositions include non-aromatic cyclic (alkyl)acrylates and low acid number waxes. Upon application of actinic radiation, the hot melt compositions cure to form resists. They may be stripped from substrates with high alkaline strippers. The hot melt compositions may be used in the manufacture of printed circuit boards and photovoltaic devices.

公开(公告)号：US20160050750A1

公开(公告)日：2016-02-18

申请号：US14818109

申请日：2015-08-04

Applicant: The Board of Trustees of the University of Illinois

Inventor： John A. ROGERS ,  Xian HUANG

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/11 ,  H05K1/18 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K1/0286 ,  A61B5/686 ,  H05K1/0212 ,  H05K1/0275 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/0386 ,  H05K1/095 ,  H05K1/097 ,  H05K1/144 ,  H05K3/1216 ,  H05K3/207 ,  H05K3/22 ,  H05K3/285 ,  H05K3/287 ,  H05K3/288 ,  H05K3/4626 ,  H05K2201/0133 ,  H05K2201/0266 ,  H05K2201/041 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/10196 ,  H05K2201/10212 ,  H05K2203/0271 ,  H05K2203/0292 ,  H05K2203/0514 ,  H05K2203/0769 ,  H05K2203/0776 ,  H05K2203/0786 ,  H05K2203/105 ,  H05K2203/1105 ,  H05K2203/1142 ,  H05K2203/175 ,  H05K2203/178 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T137/0318 ,  Y10T428/239

Abstract: The invention provides transient printed circuit board devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus.

Abstract translation: 本发明提供瞬时印刷电路板装置，包括在应用至少一个内部和/或外部刺激时电和/或物理变换的有源和无源装置。

公开(公告)号：US09049779B2

公开(公告)日：2015-06-02

申请号：US13686471

申请日：2012-11-27

Applicant: Tyco Electronics Corporation

Inventor： David Bruce Sarraf

IPC: H05K3/02 ,  H05K1/02 ,  C23C18/16 ,  H01Q1/36 ,  H05K3/24 ,  H01Q1/38 ,  H01Q7/00 ,  H05K1/16 ,  H05K3/04

CPC classification number: H05K3/02 ,  C23C18/1653 ,  C25D5/02 ,  C25D5/48 ,  C25D7/00 ,  C25D17/005 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q7/00 ,  H05K1/0296 ,  H05K1/16 ,  H05K3/048 ,  H05K3/242 ,  H05K2201/10098 ,  H05K2203/0769

Abstract: An electrical component includes a substrate having a circuit area and a sacrificial area. A lift-off layer is deposited on the substrate in the sacrificial area. A seed layer is deposited on the substrate in the circuit area and on the lift-off layer in the sacrificial area. A plating layer is electrodeposited on the seed layer. The plating layer forms a circuit in the circuit area. The plating layer forms plating electrodes in the sacrificial area. The lift-off layer is removable from the substrate. The seed layer and the plating layer on the lift-off layer are removed with the lift-off layer when the lift-off layer is removed from the substrate, leaving the circuit on the substrate. The lift-off layer may be dissolved after the plating layer is formed, where the plating layer deposited on the lift-off layer is removed as the lift-off layer is dissolved.

Abstract translation: 电气部件包括具有电路区域和牺牲区域的基板。 剥离层沉积在牺牲区域的基底上。 在电路区域和牺牲区域的剥离层上的基底上沉积种子层。 电镀层电沉积在种子层上。 电镀层在电路区域形成电路。 电镀层在牺牲区域中形成电镀电极。 剥离层可从衬底移除。 当剥离层从衬底上移除时，剥离层上的种子层和镀层被剥离层去除，从而将电路留在衬底上。 剥离层可以在形成镀层之后溶解，其中当剥离层溶解时，去除沉积在剥离层上的镀层。

公开(公告)号：US20140158414A1

公开(公告)日：2014-06-12

申请号：US13711092

申请日：2012-12-11

Applicant: CHRIS BALDWIN ,  MIHIR K. ROY

Inventor： CHRIS BALDWIN ,  MIHIR K. ROY

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K3/4697 ,  H01L2224/16225 ,  H05K1/183 ,  H05K3/0038 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2201/09472 ,  H05K2203/0126 ,  H05K2203/0264 ,  H05K2203/0384 ,  H05K2203/0769 ,  Y10T29/4913

Abstract: A method and device include an organic multiple layer substrate having patterned conductors disposed on a recessed layer of the organic multiple layer substrate. A discrete component is coupled to the recessed layer such that the component is recessed from a top layer of the organic multiple layer substrate.

Abstract translation: 一种方法和装置包括具有设置在有机多层基板的凹陷层上的图案化导体的有机多层基板。 分立组件耦合到凹陷层，使得组件从有机多层衬底的顶层凹陷。

公开(公告)号：US20140144674A1

公开(公告)日：2014-05-29

申请号：US13686471

申请日：2012-11-27

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： David Bruce Sarraf

IPC: H05K3/02 ,  H05K1/02

CPC classification number: H05K3/02 ,  C23C18/1653 ,  C25D5/02 ,  C25D5/48 ,  C25D7/00 ,  C25D17/005 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q7/00 ,  H05K1/0296 ,  H05K1/16 ,  H05K3/048 ,  H05K3/242 ,  H05K2201/10098 ,  H05K2203/0769

Abstract: An electrical component includes a substrate having a circuit area and a sacrificial area. A lift-off layer is deposited on the substrate in the sacrificial area. A seed layer is deposited on the substrate in the circuit area and on the lift-off layer in the sacrificial area. A plating layer is electrodeposited on the seed layer. The plating layer forms a circuit in the circuit area. The plating layer forms plating electrodes in the sacrificial area. The lift-off layer is removable from the substrate. The seed layer and the plating layer on the lift-off layer are removed with the lift-off layer when the lift-off layer is removed from the substrate, leaving the circuit on the substrate. The lift-off layer may be dissolved after the plating layer is formed, where the plating layer deposited on the lift-off layer is removed as the lift-off layer is dissolved.

Abstract translation: 电气部件包括具有电路区域和牺牲区域的基板。 剥离层沉积在牺牲区域的基底上。 在电路区域和牺牲区域的剥离层上的基底上沉积种子层。 电镀层电沉积在种子层上。 电镀层在电路区域形成电路。 电镀层在牺牲区域中形成电镀电极。 剥离层可从衬底移除。 当剥离层从衬底上移除时，剥离层上的种子层和镀层被剥离层去除，从而将电路留在衬底上。 剥离层可以在形成镀层之后溶解，其中当剥离层溶解时，去除沉积在剥离层上的镀层。

公开(公告)号：US08635761B2

公开(公告)日：2014-01-28

申请号：US13236265

申请日：2011-09-19

Applicant: Yiliang Wu

Inventor： Yiliang Wu

IPC: H01R43/00

CPC classification number: H05K3/048 ,  G06K19/07773 ,  H01Q1/2225 ,  H01Q9/26 ,  H05K1/0386 ,  H05K2203/013 ,  H05K2203/0769 ,  H05K2203/0783 ,  Y10T29/49016 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: A method for printing an electrical conductor on a substrate has been developed. In the method, a reverse image of the electrical conductor pattern is printed on a substrate with an electrically non-conductive material to form a second pattern that exposes a portion of the surface area of the substrate. The entire surface area of the substrate is then covered with an electrically conductive material. The non-conductive material of the reverse image electrically isolates the electrically conductive material covering the reverse image from the electrically conductive material covering the second pattern.

Abstract translation: 已经开发了在基板上印刷电导体的方法。 在该方法中，电导体图案的反向图像被印刷在具有非导电材料的基板上，以形成暴露基板表面积的一部分的第二图案。 然后用导电材料覆盖基板的整个表面积。 反向图像的非导电材料将覆盖反向图像的导电材料与覆盖第二图案的导电材料电隔离。