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公开(公告)号：US12106993B2
公开(公告)日：2024-10-01
申请号：US17783163
申请日：2019-12-10
发明人： Jozsef Krol
IPC分类号： G03F7/20 , G01B11/27 , H01L21/68 , H01L23/544
CPC分类号： H01L21/681 , G01B11/272 , H01L23/544 , H01L2223/54426
摘要： A device and a method for aligning substrates. The method includes the steps of detecting alignment marks and aligning substrates with respect to one another in dependence on the detection of the alignment marks. At least two alignment marks are arranged parallel to a direction of a linear movement of the substrates, wherein the alignment of the substrates takes place along a single alignment axis, the alignment axis running parallel to the loading and unloading direction of the substrates.
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公开(公告)号：US11955339B2
公开(公告)日：2024-04-09
申请号：US17550008
申请日：2021-12-14
IPC分类号： H01L21/20 , H01L21/67 , H01L21/683 , H01L23/32
CPC分类号： H01L21/2007 , H01L21/67092 , H01L21/67288 , H01L21/6838 , H01L23/32
摘要： A method and a corresponding device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates. The method includes holding of the first substrate to a first holding surface of a first holding device and holding of the second substrate to a second holding surface of a second holding device. A change in curvature of the contact face of the first substrate and/or a change in curvature of the contact face of the second substrate are controlled during the bonding.
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公开(公告)号：US11865824B2
公开(公告)日：2024-01-09
申请号：US17919771
申请日：2020-04-20
CPC分类号： B32B37/025 , C23C14/0005 , C23C14/0605 , C23C16/01 , C23C16/26
摘要： The invention relates to a device for the transfer of a transfer layer from a substrate, in particular from a growth substrate, to a carrier substrate.
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公开(公告)号：US11862466B2
公开(公告)日：2024-01-02
申请号：US17174692
申请日：2021-02-12
IPC分类号： H01L21/20 , H01L21/02 , H01L21/268
CPC分类号： H01L21/2007 , H01L21/02356 , H01L21/268
摘要： A method for bonding a first substrate with a second substrate, with the following sequence: production of a first amorphous layer on the first substrate and/or production of a second amorphous layer on the second substrate, bonding of the first substrate with the second substrate at the amorphous layer or at the amorphous layers to form a substrate stack, irradiation of the amorphous layer or the amorphous layers with radiation in such a way that the amorphous layer or the amorphous layers is/are transformed into a crystalline layer or crystalline layers.
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公开(公告)号：US11756818B2
公开(公告)日：2023-09-12
申请号：US17735239
申请日：2022-05-03
IPC分类号： H01L21/68 , H01L21/683 , H01L21/67 , H01L21/66
CPC分类号： H01L21/68 , H01L21/67288 , H01L21/683 , H01L21/67092 , H01L22/12
摘要： A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer.
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公开(公告)号：US20230211592A1
公开(公告)日：2023-07-06
申请号：US17919771
申请日：2020-04-20
CPC分类号： B32B37/025 , C23C14/0005 , C23C14/0605 , C23C16/01 , C23C16/26
摘要： The invention relates to a device for the transfer of a transfer layer from a substrate, in particular from a growth substrate, to a carrier substrate.
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公开(公告)号：US20230207379A1
公开(公告)日：2023-06-29
申请号：US17928134
申请日：2020-06-29
IPC分类号： H01L21/687 , H01L23/00
CPC分类号： H01L21/68785 , H01L24/83 , H01L2224/83894
摘要： A substrate holder for curving a substrate
the substrate holding including a fixing plate for fixing the substrate,
curving means for curving the fixing plate,
wherein the fixing plate is constituted such that the curvature of the substrate can be adjusted in a targeted manner, as well as a corresponding method.-
公开(公告)号：US20230187259A1
公开(公告)日：2023-06-15
申请号：US17922505
申请日：2020-06-29
发明人： Thomas PLACH
IPC分类号： H01L21/687
CPC分类号： H01L21/68728
摘要： A substrate holder for mounting a substrate, comprising fixing elements for fixing the substrate, wherein the fixing elements can be grouped into zones, and a corresponding method.
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公开(公告)号：US20230001723A1
公开(公告)日：2023-01-05
申请号：US17942513
申请日：2022-09-12
发明人： Friedrich Paul Lindner , Harald Zaglmayr , Christian Schon , Thomas Glinsner , Evelyn Reisinger , Peter Fischer , Othmar Luksch
摘要： An apparatus and a method for embossing micro- and/or nanostructures include the embossing of the micro- and/or nanostructures in an embossing material.
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公开(公告)号：US20220390356A1
公开(公告)日：2022-12-08
申请号：US17774612
申请日：2019-11-28
摘要： The invention relates to a method for measuring a multilayered substrate (1, 1′, 1″), particularly with at least one structure (7, 7′, 7″, 7′″, 7IV, 7V) with critical dimensions, particularly with a surface structure (7, 7′, 7″, 7′″, 7IV, 7V) with critical dimensions, characterized in that the method has at least the following steps, particularly the following procedure:
producing (110) the substrate (1, 1′, 1″) with a plurality of layers (2, 3, 4, 5, 6, 6′, 6″), particularly with a structure (7, 7′, 7″, 7′″, 7IV, 7V), particularly with a structure (7, 7′, 7″, 7″′, 7IV, 7V) on a surface (6o, 6′o, 6″o) of an uppermost layer (6, 6′, 6″), wherein the dimensions of the layers and in particular the structures are known,
measuring (120) the substrate (1, 1′, 1″), and in particular the structure (7, 7′, 7″, 7′″, 71IV, 7V)) using at least one measuring technology,
creating (130) a simulation of the substrate using the measurement results from the measurement of the substrate (1, 1′, 1″),
comparing (140) the measurement results with simulation results from the simulation of the substrate (1, 1′, 1″),
optimizing the simulation (130) and renewed creation (130) of a simulation of the substrate using the measurement results from the measurement of the substrate (1, 1′, 1″), in the event that there is a deviation of the measurement results from the simulation results, or calculating (150) parameters of further substrates, in the event that the measurement results correspond to the simulation results.
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