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公开(公告)号：US20230001723A1
公开(公告)日：2023-01-05
申请号：US17942513
申请日：2022-09-12
发明人： Friedrich Paul Lindner , Harald Zaglmayr , Christian Schon , Thomas Glinsner , Evelyn Reisinger , Peter Fischer , Othmar Luksch
摘要： An apparatus and a method for embossing micro- and/or nanostructures include the embossing of the micro- and/or nanostructures in an embossing material.
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公开(公告)号：US20220230849A1
公开(公告)日：2022-07-21
申请号：US17714290
申请日：2022-04-06
IPC分类号： H01J37/32 , C23C16/44 , C23C16/455
摘要： A method and a device for prefixing substrates, whereby at least one substrate surface of the substrates is amorphized in at least one surface area, characterized in that the substrates are aligned and then make contact and are prefixed on the amorphized surface areas.
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公开(公告)号：US11328939B2
公开(公告)日：2022-05-10
申请号：US16556511
申请日：2019-08-30
摘要： A method and a device for prefixing substrates, whereby at least one substrate surface of the substrates is amorphized in at least one surface area, characterized in that the substrates are aligned and then make contact and are prefixed on the amorphized surface areas.
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公开(公告)号：US11020953B2
公开(公告)日：2021-06-01
申请号：US16359157
申请日：2019-03-20
IPC分类号： B32B38/18 , H01L21/18 , B32B37/00 , B32B37/18 , B32B37/10 , B29C65/78 , H01L21/67 , H01L21/683 , B29C65/00
摘要： A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.
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公开(公告)号：US11020952B2
公开(公告)日：2021-06-01
申请号：US16358844
申请日：2019-03-20
IPC分类号： B32B38/18 , H01L21/18 , B32B37/00 , B32B37/18 , B32B37/10 , B29C65/78 , H01L21/67 , H01L21/683 , B29C65/00
摘要： A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.
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公开(公告)号：US11020950B2
公开(公告)日：2021-06-01
申请号：US16357729
申请日：2019-03-19
IPC分类号： B32B38/18 , H01L21/18 , B32B37/00 , B32B37/18 , B32B37/10 , B29C65/78 , H01L21/67 , H01L21/683 , B29C65/00
摘要： A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.
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公开(公告)号：US09653329B2
公开(公告)日：2017-05-16
申请号：US14439034
申请日：2013-11-19
CPC分类号： H01L21/67092 , B82Y10/00 , B82Y40/00 , G03F1/64 , G03F7/0002 , H01L21/302 , H01L21/52
摘要： A semiconductor processing device with bearing means for supporting a plate with one plate plane. The plate has a function region with evenness, a bearing region which surrounds the function region at least in sections, and an action region which is located outside the function region and outside the bearing region. The bearing means is made to support the plate in the bearing region and the action means is controllable such that by deformation of the function region the evenness can be adjusted and/or changed and/or influenced and/or re-set. The action means comprise at least one vacuum region which allows a deformation of the plate in the bearing region.
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公开(公告)号：US20230207513A1
公开(公告)日：2023-06-29
申请号：US17926737
申请日：2020-06-30
IPC分类号： H01L23/00
CPC分类号： H01L24/80 , H01L24/74 , H01L2224/74 , H01L2224/80894 , H01L2224/8013 , H01L2224/8016 , H01L2224/80986 , H01L2224/80908 , H01L2924/40
摘要： The invention relates to a device and a method for the alignment of substrates.
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公开(公告)号：US20190210349A1
公开(公告)日：2019-07-11
申请号：US16357729
申请日：2019-03-19
CPC分类号： B32B38/1833 , B32B37/0076 , B32B37/10 , B32B37/18 , B32B38/1866 , B32B2457/14 , H01L21/187 , Y10T156/17
摘要： A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.
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公开(公告)号：US20190210348A1
公开(公告)日：2019-07-11
申请号：US16356325
申请日：2019-03-18
CPC分类号： B32B38/1833 , B32B37/0076 , B32B37/10 , B32B37/18 , B32B38/1866 , B32B2457/14 , H01L21/187 , Y10T156/17
摘要： A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.
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