公开(公告)号：US20230275062A1

公开(公告)日：2023-08-31

申请号：US18005392

申请日：2021-07-05

Applicant: Tokyo Electron Limited

Inventor： Toshifumi Inamasu ,  Tetsuya Maki

IPC: H01L23/00

CPC classification number: H01L24/74 ,  H01L24/80 ,  H01L2924/401 ,  H01L2224/74 ,  H01L2224/80012 ,  H01L2224/80908 ,  H01L2224/80896 ,  H01L2224/80986 ,  H01L2224/8016 ,  H01L2224/8018

Abstract: A bonding apparatus includes a first holder, a second holder, a moving unit, a housing, an interferometer, a first gas supply and a second gas supply. The first holder is configured to attract and hold a first substrate. The second holder is configured to attract and hold a second substrate. The moving unit is configured to move a first one of the first holder and the second holder in a horizontal direction with respect to a second one thereof. The interferometer is configured to radiate light to the first one or an object moved along with the first one to measure a horizontal distance thereto. The first gas supply is configured to supply a clean first gas to an inside of the housing. The second gas supply is configured to supply a second gas to a space between the interferometer and the first one or the object.

公开(公告)号：US20230343743A1

公开(公告)日：2023-10-26

申请号：US17726494

申请日：2022-04-21

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Yi-Jung Chen ,  Tsung-Fu Tsai ,  Szu-Wei Lu

IPC: H01L23/00

CPC classification number: H01L24/80 ,  H01L24/74 ,  H01L2224/80006 ,  H01L2224/80004 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/80908 ,  H01L2224/8016 ,  H01L2224/8017 ,  H01L2224/8018 ,  H01L2224/8013 ,  H01L2224/80123 ,  H01L2224/80129 ,  H01L21/563

Abstract: A flip-chip bonding method includes following operations. A wafer is provided with multiple semiconductor dies on an adhesive film held by a frame element. A semiconductor die is lifted up from the wafer by an ejector element. The semiconductor die is picked up with a collector element. The semiconductor die is flip-chipped with the collector element. An alignment check is performed to determine a position of the semiconductor die, so as to determine a process tolerance between a center of the collector element and a center of the semiconductor die. The semiconductor die with the collector element is transferred to a location underneath a bonder element based on the process tolerance of the alignment check. The semiconductor die is picked up from the collector element by the bonder element. The semiconductor die is bonded to a carrier by the bonder element.

公开(公告)号：US20230207513A1

公开(公告)日：2023-06-29

申请号：US17926737

申请日：2020-06-30

Applicant: EV Group E. Thallner GmbH

Inventor： Dominik Zinner ,  Friedrich Paul Lindner ,  Thomas Plach ,  Peter Starzengruber

IPC: H01L23/00

CPC classification number: H01L24/80 ,  H01L24/74 ,  H01L2224/74 ,  H01L2224/80894 ,  H01L2224/8013 ,  H01L2224/8016 ,  H01L2224/80986 ,  H01L2224/80908 ,  H01L2924/40

Abstract: The invention relates to a device and a method for the alignment of substrates.