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公开(公告)号：US20230275062A1
公开(公告)日：2023-08-31
申请号：US18005392
申请日：2021-07-05
发明人： Toshifumi Inamasu , Tetsuya Maki
IPC分类号： H01L23/00
CPC分类号： H01L24/74 , H01L24/80 , H01L2924/401 , H01L2224/74 , H01L2224/80012 , H01L2224/80908 , H01L2224/80896 , H01L2224/80986 , H01L2224/8016 , H01L2224/8018
摘要： A bonding apparatus includes a first holder, a second holder, a moving unit, a housing, an interferometer, a first gas supply and a second gas supply. The first holder is configured to attract and hold a first substrate. The second holder is configured to attract and hold a second substrate. The moving unit is configured to move a first one of the first holder and the second holder in a horizontal direction with respect to a second one thereof. The interferometer is configured to radiate light to the first one or an object moved along with the first one to measure a horizontal distance thereto. The first gas supply is configured to supply a clean first gas to an inside of the housing. The second gas supply is configured to supply a second gas to a space between the interferometer and the first one or the object.
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公开(公告)号：US20230163094A1
公开(公告)日：2023-05-25
申请号：US17988469
申请日：2022-11-16
发明人： Euisun Choi , Huijae Kim , Mingu Lee , Hyeonggyun Cheong , Yunpyo Hong
IPC分类号： H01L23/00
CPC分类号： H01L24/74 , H01L24/80 , H01L24/08 , H01L24/32 , H01L24/75 , H01L24/83 , H01L2224/7592 , H01L2224/8018 , H01L2224/08221 , H01L2224/8318 , H01L2224/32221 , H01L2224/75304 , H01L2224/75312 , H01L2224/75745 , H01L2224/75824 , H01L2224/80093 , H01L2224/80201 , H01L2224/80894 , H01L2224/80908 , H01L2224/83093 , H01L2224/83201 , H01L2224/83908
摘要： A chip bonding apparatus, includes: a body; a substrate conveyor installed on the body to transfer a substrate; a bonding head conveyor disposed on an upper surface of the body; an alignment unit installed on the body and adjusting a position of the substrate and a position of a chip; and a bonding head installed in the bonding head conveyor and moved and attaching a chip therebelow, wherein the bonding head is provided with a chip bonding unit for attaching the chip in a lower end portion thereof, wherein the chip bonding unit, includes: a chip bonding unit body having an installation groove formed therein; a pushing module having one end portion inserted in the installation groove; and an attachment module having a deformable member deformed by the pushing module; wherein the deformable member is provided with a deformable portion which is deformed by being pressed by the pushing module, and having a bottom surface in contact and exerting a force on the chip to bond the chip to the substrate.
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公开(公告)号：US20240030179A1
公开(公告)日：2024-01-25
申请号：US17813649
申请日：2022-07-20
发明人： JEN-YUAN CHANG
IPC分类号： H01L23/00
CPC分类号： H01L24/80 , H01L24/74 , H01L24/08 , H01L2224/08145 , H01L2224/8018 , H01L2224/8013 , H01L2224/80006 , H01L2224/80907 , H01L2224/80203 , H01L2224/80895 , H01L2224/80896
摘要： A method includes configuring a bonding tool based on a first semiconductor die and a second semiconductor die, wherein the bonding tool includes a platform and a first bonding head and a second bonding head connected to the platform; attaching the first semiconductor die to the first bonding head; moving the first semiconductor die toward a semiconductor wafer to bond the first semiconductor die to the semiconductor wafer; releasing the first semiconductor die from the first bonding head; configuring the platform to cause the second bonding head to move the second semiconductor die to the location over the semiconductor wafer while keeping the first bonding head on the platform; and moving the second semiconductor die by the second bonding head toward the semiconductor wafer to bond the second semiconductor die to the semiconductor wafer.
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公开(公告)号：US20230360950A1
公开(公告)日：2023-11-09
申请号：US17662180
申请日：2022-05-05
发明人： Guilian Gao
IPC分类号： H01L21/683 , H01L23/00
CPC分类号： H01L21/6838 , H01L21/6833 , H01L24/80 , H01L21/6836 , H01L2221/68327 , H01L2221/68368 , H01L2224/8018 , H01L2224/8082 , H01L2224/80896 , H01L2224/80905 , H01L2224/80009 , H01L24/08 , H01L2224/08225 , H01L24/05 , H01L2224/05647
摘要： Embodiments of various systems, methods, and devices for gang flipping and individual picking dies are disclosed. The embodiments disclosed herein may be used, for example, in the manufacture of directly bonded devices.
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公开(公告)号：US20240170442A1
公开(公告)日：2024-05-23
申请号：US17989775
申请日：2022-11-18
发明人： Yiu Ming CHEUNG , Man Hon CHENG , Siu Cheung SO , So Ying KWOK , Ming LI
IPC分类号： H01L23/00
CPC分类号： H01L24/80 , H01L24/08 , H01L24/74 , H01L2224/0801 , H01L2224/08059 , H01L2224/08245 , H01L2224/80031 , H01L2224/80099 , H01L2224/8018 , H01L2224/80203 , H01L2224/80895 , H01L2224/80896 , H01L2224/80907 , H01L2224/80948 , H01L2924/10253 , H01L2924/1511 , H01L2924/1515 , H01L2924/15738
摘要： When locating a semiconductor die on a substrate, the die is picked up and carried with a die-holding surface of a bonding tool having a protrusion. The protrusion of the bonding tool is configured to be movable between a retracted position within the die-holding surface and an extended position protruding from the die-holding surface. When the protrusion is located in the extended position, the die is bent when the bonding tool is carrying the die. Thereafter, the bonding tool is moved to flatten the die against the substrate while the substrate urges the protrusion to retract from the extended position towards the retracted position.
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公开(公告)号：US20230343743A1
公开(公告)日：2023-10-26
申请号：US17726494
申请日：2022-04-21
发明人： Yi-Jung Chen , Tsung-Fu Tsai , Szu-Wei Lu
IPC分类号： H01L23/00
CPC分类号： H01L24/80 , H01L24/74 , H01L2224/80006 , H01L2224/80004 , H01L2224/80895 , H01L2224/80896 , H01L2224/80908 , H01L2224/8016 , H01L2224/8017 , H01L2224/8018 , H01L2224/8013 , H01L2224/80123 , H01L2224/80129 , H01L21/563
摘要： A flip-chip bonding method includes following operations. A wafer is provided with multiple semiconductor dies on an adhesive film held by a frame element. A semiconductor die is lifted up from the wafer by an ejector element. The semiconductor die is picked up with a collector element. The semiconductor die is flip-chipped with the collector element. An alignment check is performed to determine a position of the semiconductor die, so as to determine a process tolerance between a center of the collector element and a center of the semiconductor die. The semiconductor die with the collector element is transferred to a location underneath a bonder element based on the process tolerance of the alignment check. The semiconductor die is picked up from the collector element by the bonder element. The semiconductor die is bonded to a carrier by the bonder element.
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公开(公告)号：US20230163095A1
公开(公告)日：2023-05-25
申请号：US17988974
申请日：2022-11-17
发明人： Andreas Marte , Daniel Buergi , Urban Ernst , Eirini Kakkava , Alexander Holzer , Mathias Moser , Fabian Schneider
IPC分类号： H01L23/00
CPC分类号： H01L24/74 , H01L24/80 , H01L24/08 , H01L2224/0213 , H01L2224/08221 , H01L2224/80007 , H01L2224/80986 , H01L2224/80894 , H01L2224/8017 , H01L2224/8018 , H01L2224/8013 , H01L2224/80132
摘要： A die bonding system including a bond head assembly for bonding a die to a substrate is provided. The die includes a first plurality of fiducial markings, and the substrate includes a second plurality of fiducial markings. The die bonding system also includes an imaging system configured for simultaneously imaging one of the first plurality of fiducial markings and one of the second plurality of fiducial markings along a first optical path while the die is carried by the bond head assembly. The imaging system is also configured for simultaneously imaging another of the first plurality of fiducial markings and another of the second plurality of fiducial markings along a second optical path while the die is carried by the bond head assembly. Each of the first and second optical paths are independently configurable to image any area of the die including one of the first plurality of fiducial markings.
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