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公开(公告)号：US20250031357A1
公开(公告)日：2025-01-23
申请号：US18223594
申请日：2023-07-19
Applicant: ASMPT Singapore Pte. Ltd.
Inventor： Chi Wah CHENG , Wan Yin YAU , Hok Man WAN
IPC: H05K13/04
Abstract: A bonding tool with a decoupling mechanism includes a shaft, a rotary module coupled to a first portion of the shaft, a rotary motion actuator operatively connected to the rotary module and operative to drive the rotary module and the shaft to rotate about a rotary axis extending substantially along a central axis of the shaft, a linear motion module coupled to a second portion of the shaft separate from the first portion, and a linear motion actuator operatively connected to the linear motion module and operative to drive the linear motion module and the shaft to move in directions parallel to the rotary axis.
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公开(公告)号：US20240359329A1
公开(公告)日：2024-10-31
申请号：US18139611
申请日：2023-04-26
Applicant: ASMPT Singapore Pte. Ltd.
Inventor： Wai Lam NG , Chi Piu WONG , Hon Keung LEE , Yuen Wai LEE , Yin Fun NG
CPC classification number: B25J9/1679 , B25J11/005 , B25J15/0028 , B25J15/0033 , B25J15/0616
Abstract: A method of picking an electronic component from an adhesive tape on which the electronic component is mounted which includes selecting a electronic component from a plurality of electronic components arranged on the adhesive tape, each electronic component being located on the adhesive tape over an associated support upstanding from a support bed; displacing the adhesive tape towards the support bed to peel the adhesive tape from edges of the electronic component; and displacing a gripper to detach the electronic component from the adhesive tape.
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公开(公告)号：US12081868B2
公开(公告)日：2024-09-03
申请号：US17412406
申请日：2021-08-26
Applicant: ASMPT SINGAPORE PTE. LTD.
Inventor： Man Yip Lee , Fan Leuk Lai , Po Lam Au
CPC classification number: H04N23/6811 , G01M11/08
Abstract: To align an optical module to an image sensor module comprising at least an image sensor, a test image is received with a reference optical element along a first reference optical path, before reflecting the test image along a second reference optical path with the reference optical element towards the image sensor module. An alignment orientation of the image sensor module is first corrected with respect to the reference optical element in order to receive the test image over the second reference optical path onto the image sensor. The reference optical element is subsequently replaced with the optical module. Next, an orientation of the optical module is manipulated such that the second optical path coincides with the second reference optical path so as to optically align the optical module with the image sensor module, before the optical module is finally attached to the image sensor module.
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4.发明公开公开(公告)号：US20240264524A1
公开(公告)日：2024-08-08
申请号：US18107093
申请日：2023-02-08
Applicant: ASMPT Singapore Pte. Ltd.
Inventor： Kai Siu LAM , Nim Tak WONG , Xiaodong CHEN , Kui Kam LAM
CPC classification number: G03F7/0002 , G03F7/70616 , G03F7/70716 , G03F7/70775 , G03F7/70825 , G03F7/70975
Abstract: An apparatus for applying an adhesive fluid onto a bonding surface during a bonding process includes a positioning table, a dispensing device, a stamping device and a switching member which are mounted on the positioning table. The dispensing device is configured to be positionable by the positioning table to dispense the adhesive fluid onto the bonding surface. The stamping device is configured to be positionable by the positioning table to stamp the adhesive fluid onto the bonding surface. The dispensing device and stamping device are operative to apply the adhesive fluid onto different bonding positions on the bonding surface. The switching member coupled to the stamping device is configured to move the stamping device to a first standby position when the dispensing device is dispensing the adhesive fluid and to a second standby position when the stamping device is stamping the adhesive fluid.
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公开(公告)号：US20240262019A1
公开(公告)日：2024-08-08
申请号：US18107121
申请日：2023-02-08
Applicant: ASMPT Singapore Pte. Ltd.
Inventor： Teng Hock KUAH , Kai Yew LEE , Ji Yuan HAO , Jian Jun CHEN , Yi LIN
CPC classification number: B29C43/183 , B29C43/003 , B29C2043/182 , B29C2043/3602 , B29L2031/34
Abstract: A molding apparatus includes a mold and a wedge structure. The mode has a first mold member and a second mold member configured to be movable towards the first mold member along a first direction, the first and second mold members cooperating in use to form a molding cavity for encapsulating an electronic component. The wedge structure has a first wedge member attached to the second mold member and a second wedge member configured to be in contact with the first wedge member and movable in a second direction perpendicular to the first direction to adjust contacting portions between a first contacting surface of the first wedge member and a second contacting surface of the second wedge member, thereby biasing the second mold member towards the first mold member to form the molding cavity, wherein at least one of the first and second contacting surfaces includes a first protection film attached thereon.
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Patent Agency Ranking
公开(公告)号：US11600516B2
公开(公告)日：2023-03-07
申请号：US15930533
申请日：2020-05-13
Applicant: ASMPT SINGAPORE PTE. LTD.
Inventor： Chi Wah Cheng , Wan Yin Yau , Kwok Pun Law
IPC: H01L21/687 , H01L21/683 , H01L21/67 , H01L21/68 , B65G49/06 , B29C45/40
Abstract: A die ejection apparatus operable to eject a die from a support has at least two ejector components configured to lift a die located on the support. The ejector components are moveable to a position in which a lifting force is exertable by the ejector components on the support, so as to lift a die located on the support. Movement of the die ejector components is initiated towards the support, and a moment when each of the die ejector components reaches the position is determined. A height offset of each die ejector component relative to a height of another die ejector component is determined upon reaching the said position, and relative heights of the die ejector components are adjusted in dependence upon the evaluated height offset.
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公开(公告)号：US11552031B2
公开(公告)日：2023-01-10
申请号：US16817880
申请日：2020-03-13
Applicant: ASMPT SINGAPORE PTE. LTD.
Inventor： Ming Yeung Luke Wan , Wai Kin Cheung , Yu Fu Cheung
IPC: H01L23/00 , H01L21/68 , H05K13/04 , H01L21/683
Abstract: A bonding apparatus includes a bond head structure, an optical unit and an actuator unit. The bond head structure includes a bond head collet, a connecting unit to which the bond head collet is attached and a look-through passage extending through the bond head collet and the connecting unit along a central axis of the bond head structure. In use, the bond head collet holds an electrical component to be bonded to a bonding area of a base member and the optical unit is positioned relative to the bond head structure to view and inspect the electrical component through the look-through passage of the bond head structure. The actuator unit moves the connecting unit of the bond head structure based on the inspection of the electrical component by the optical unit, to align the electrical component with the bonding area of the base member.
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公开(公告)号：US11548273B2
公开(公告)日：2023-01-10
申请号：US16778429
申请日：2020-01-31
Applicant: ASMPT SINGAPORE PTE. LTD.
Inventor： Ji Yuan Hao , Patrocinio Jr Go Torres , Teng Hock Kuah , Kai Wu , Moung Kai Kong
IPC: B32B43/00 , H01L21/56 , H01L21/687 , H01L21/67
Abstract: After molding a substrate located between first and second molds of a molding system, a used release film that is in contact with the substrate during molding is removed from the molding system with a gripper assembly, which is reciprocally movable between a retracted position outside the molding system and an extended position in a space between the first and second molds when the first and second molds are opened. A carriage mechanism on which the gripper assembly is mounted moves the gripper assembly towards the first or second mold until the gripper assembly contacts the used release film, before an actuator actuates the gripper assembly to clamp onto a part of the used release film. The carriage mechanism also conveys the gripper assembly away from the first mold or second mold to remove the used release film from the molding system.
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公开(公告)号：US11543362B2
公开(公告)日：2023-01-03
申请号：US16848919
申请日：2020-04-15
Applicant: ASMPT SINGAPORE PTE. LTD.
Inventor： Keng Yew Song , Chi Kwan Park , Jiang Huang , Ya Ping Zhu , Mow Huat Goh
Abstract: A height of a vertical wire interconnection bonded onto a substrate is measured by first capturing a top view of the vertical wire interconnection and identifying a position of a tip end of the vertical wire interconnection from the top view. A conductive probe is located over the tip end of the vertical wire interconnection, and is lowered towards the vertical wire interconnection until an electrical connection is made between the conductive probe and the tip end of the vertical wire interconnection. A contact height at which the electrical connection is made may thus be determined, wherein the contact height corresponds to the height of the vertical wire interconnection.
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公开(公告)号：US20240347500A1
公开(公告)日：2024-10-17
申请号：US18133565
申请日：2023-04-12
Applicant: ASMPT Singapore Pte. Ltd.
Inventor： Keng Yew SONG , Yue ZHANG , Chonghao CHEN , Heqing CHEN
IPC: H01L23/00
CPC classification number: H01L24/78 , H01L2224/78611
Abstract: A wire path plate for a wire bonding apparatus includes a first conductive plate coupled to a second conductive plate. Each conductive plate has an upper portion, a lower portion and a middle portion located between the upper and lower portions. A bonding wire is configured to be passed through a gap formed between the first and second conductive plates. At least one non-conductive strip is mounted along the upper and/or lower portions of at least one of the conductive plates for insulating the bonding wire from conductive surfaces of the at least one conductive plate at the position of the at least one non-conductive strip.
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