公开(公告)号：US20230163095A1

公开(公告)日：2023-05-25

申请号：US17988974

申请日：2022-11-17

申请人： Kulicke and Soffa Industries, Inc.

发明人： Andreas Marte ,  Daniel Buergi ,  Urban Ernst ,  Eirini Kakkava ,  Alexander Holzer ,  Mathias Moser ,  Fabian Schneider

IPC分类号： H01L23/00

CPC分类号： H01L24/74 ,  H01L24/80 ,  H01L24/08 ,  H01L2224/0213 ,  H01L2224/08221 ,  H01L2224/80007 ,  H01L2224/80986 ,  H01L2224/80894 ,  H01L2224/8017 ,  H01L2224/8018 ,  H01L2224/8013 ,  H01L2224/80132

摘要： A die bonding system including a bond head assembly for bonding a die to a substrate is provided. The die includes a first plurality of fiducial markings, and the substrate includes a second plurality of fiducial markings. The die bonding system also includes an imaging system configured for simultaneously imaging one of the first plurality of fiducial markings and one of the second plurality of fiducial markings along a first optical path while the die is carried by the bond head assembly. The imaging system is also configured for simultaneously imaging another of the first plurality of fiducial markings and another of the second plurality of fiducial markings along a second optical path while the die is carried by the bond head assembly. Each of the first and second optical paths are independently configurable to image any area of the die including one of the first plurality of fiducial markings.