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1.
公开(公告)号:US20190225837A1
公开(公告)日:2019-07-25
申请号:US16254990
申请日:2019-01-23
Applicant: Kulicke and Soffa Industries, Inc.
Inventor: Urban Ernst
Abstract: A bonding tool for bonding a first workpiece to a second workpiece on a bonding machine is provided. The bonding tool includes a body portion for bonding the first workpiece to the second workpiece on the bonding machine. The bonding tool also includes a curing system for curing an adhesive provided between the first workpiece and the second workpiece.
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公开(公告)号:US20230163095A1
公开(公告)日:2023-05-25
申请号:US17988974
申请日:2022-11-17
Applicant: Kulicke and Soffa Industries, Inc.
Inventor: Andreas Marte , Daniel Buergi , Urban Ernst , Eirini Kakkava , Alexander Holzer , Mathias Moser , Fabian Schneider
IPC: H01L23/00
CPC classification number: H01L24/74 , H01L24/80 , H01L24/08 , H01L2224/0213 , H01L2224/08221 , H01L2224/80007 , H01L2224/80986 , H01L2224/80894 , H01L2224/8017 , H01L2224/8018 , H01L2224/8013 , H01L2224/80132
Abstract: A die bonding system including a bond head assembly for bonding a die to a substrate is provided. The die includes a first plurality of fiducial markings, and the substrate includes a second plurality of fiducial markings. The die bonding system also includes an imaging system configured for simultaneously imaging one of the first plurality of fiducial markings and one of the second plurality of fiducial markings along a first optical path while the die is carried by the bond head assembly. The imaging system is also configured for simultaneously imaging another of the first plurality of fiducial markings and another of the second plurality of fiducial markings along a second optical path while the die is carried by the bond head assembly. Each of the first and second optical paths are independently configurable to image any area of the die including one of the first plurality of fiducial markings.
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公开(公告)号:US11608453B2
公开(公告)日:2023-03-21
申请号:US16254990
申请日:2019-01-23
Applicant: Kulicke and Soffa Industries, Inc.
Inventor: Urban Ernst
Abstract: A bonding tool for bonding a first workpiece to a second workpiece on a bonding machine is provided. The bonding tool includes a body portion for bonding the first workpiece to the second workpiece on the bonding machine. The bonding tool also includes a curing system for curing an adhesive provided between the first workpiece and the second workpiece.
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