公开(公告)号：US09202800B2

公开(公告)日：2015-12-01

申请号：US13939635

申请日：2013-07-11

申请人： Infineon Technologies AG

发明人： Tao Hong

IPC分类号： H05K3/00 ,  H01L23/00 ,  H01L25/07

CPC分类号： H01L24/89 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/04026 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/27418 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/7511 ,  H01L2224/75251 ,  H01L2224/75315 ,  H01L2224/7532 ,  H01L2224/81005 ,  H01L2224/81209 ,  H01L2224/83054 ,  H01L2224/83055 ,  H01L2224/83093 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83222 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/8381 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2924/1203 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15787 ,  Y10T29/49117 ,  Y10T156/10 ,  H01L2924/00

摘要： A pressure chamber has first and second housing elements and first and second chamber regions. The pressure chamber is loaded with a first part, a second part, a connecting means and a sealing means. The connecting means is arranged in the first chamber region. The loaded pressure chamber is placed into a receiving region. The first housing element is pressed against the second housing element so that the pressure chamber is clamped with the aid of a working cylinder between the working cylinder and a holding frame. In the clamped state, a second gas pressure, which is higher than a first gas pressure in the first chamber region, is generated in the second chamber region. In this way, the first part, the second part and the connecting means are pressed against one another within the pressure chamber.

摘要翻译： 压力室具有第一和第二壳体元件以及第一和第二腔室区域。 压力室装有第一部分，第二部分，连接装置和密封装置。 连接装置设置在第一室区域中。 负载的压力室被放置在接收区域中。 第一壳体元件被压靠在第二壳体元件上，使得压力室借助于在工作缸和保持框架之间的工作缸被夹紧。 在夹紧状态下，在第二室区域中产生高于第一室区域中的第一气体压力的第二气体压力。 以这种方式，第一部分，第二部分和连接装置在压力室内彼此压靠。

公开(公告)号：US20160155720A1

公开(公告)日：2016-06-02

申请号：US14904670

申请日：2014-07-16

申请人： AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH

发明人： Sunil Wickramanayaka

IPC分类号： H01L23/00

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L24/743 ,  H01L24/75 ,  H01L24/81 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/13009 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/27515 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/7501 ,  H01L2224/75102 ,  H01L2224/7511 ,  H01L2224/75184 ,  H01L2224/75264 ,  H01L2224/753 ,  H01L2224/7598 ,  H01L2224/81002 ,  H01L2224/81093 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/81209 ,  H01L2224/81903 ,  H01L2224/81907 ,  H01L2224/83002 ,  H01L2224/8309 ,  H01L2224/83093 ,  H01L2224/83097 ,  H01L2224/8312 ,  H01L2224/83193 ,  H01L2224/83209 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/83911 ,  H01L2224/9205 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06593 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00014

摘要： An apparatus and a method for chip-to-wafer integration is provided. The apparatus includes a coating module, a bonding module and a cleaning module. The method includes the steps of placing at least one chip on a wafer to form an integrated product, forming a film on the integrated product, such that the integrated product is substantially fluid-tight, and exerting a predetermined positive pressure on the film during permanent bonding of the at least one chip to the wafer. The method further includes the step of removing the film from the integrated product after permanent bonding of the at least one chip to the wafer.

摘要翻译： 提供了一种用于芯片到晶片集成的装置和方法。 该装置包括涂覆模块，粘合模块和清洁模块。 该方法包括以下步骤：将至少一个芯片放置在晶片上以形成集成的产品，在集成产品上形成膜，使得集成产品基本上是流体密封的，并且在永久性地在膜上施加预定的正压力 将至少一个芯片接合到晶片。 该方法还包括在将至少一个芯片永久地接合到晶片之后，从集成产品中去除膜的步骤。

公开(公告)号：US20230163094A1

公开(公告)日：2023-05-25

申请号：US17988469

申请日：2022-11-16

申请人： Samsung Electronics Co., Ltd.

发明人： Euisun Choi ,  Huijae Kim ,  Mingu Lee ,  Hyeonggyun Cheong ,  Yunpyo Hong

IPC分类号： H01L23/00

CPC分类号： H01L24/74 ,  H01L24/80 ,  H01L24/08 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/7592 ,  H01L2224/8018 ,  H01L2224/08221 ,  H01L2224/8318 ,  H01L2224/32221 ,  H01L2224/75304 ,  H01L2224/75312 ,  H01L2224/75745 ,  H01L2224/75824 ,  H01L2224/80093 ,  H01L2224/80201 ,  H01L2224/80894 ,  H01L2224/80908 ,  H01L2224/83093 ,  H01L2224/83201 ,  H01L2224/83908

摘要： A chip bonding apparatus, includes: a body; a substrate conveyor installed on the body to transfer a substrate; a bonding head conveyor disposed on an upper surface of the body; an alignment unit installed on the body and adjusting a position of the substrate and a position of a chip; and a bonding head installed in the bonding head conveyor and moved and attaching a chip therebelow, wherein the bonding head is provided with a chip bonding unit for attaching the chip in a lower end portion thereof, wherein the chip bonding unit, includes: a chip bonding unit body having an installation groove formed therein; a pushing module having one end portion inserted in the installation groove; and an attachment module having a deformable member deformed by the pushing module; wherein the deformable member is provided with a deformable portion which is deformed by being pressed by the pushing module, and having a bottom surface in contact and exerting a force on the chip to bond the chip to the substrate.

公开(公告)号：US20160190091A1

公开(公告)日：2016-06-30

申请号：US14879581

申请日：2015-10-09

申请人： Semprius, Inc. ,  The Board of Trustees of the University of Illinois

发明人： Etienne Menard ,  Matthew Meitl ,  John A. Rogers

IPC分类号： H01L23/00 ,  H01L21/78

CPC分类号： H01L27/1266 ,  H01L21/6835 ,  H01L21/76898 ,  H01L21/7806 ,  H01L23/481 ,  H01L23/544 ,  H01L24/02 ,  H01L24/05 ,  H01L24/08 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/799 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L24/98 ,  H01L27/1214 ,  H01L27/14618 ,  H01L31/0203 ,  H01L31/043 ,  H01L31/048 ,  H01L31/1892 ,  H01L2221/68318 ,  H01L2221/68322 ,  H01L2221/6835 ,  H01L2221/68368 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0239 ,  H01L2224/04026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/08238 ,  H01L2224/24011 ,  H01L2224/24137 ,  H01L2224/24147 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/24998 ,  H01L2224/2731 ,  H01L2224/29078 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/3012 ,  H01L2224/32104 ,  H01L2224/32146 ,  H01L2224/32227 ,  H01L2224/73267 ,  H01L2224/75263 ,  H01L2224/75314 ,  H01L2224/7598 ,  H01L2224/76155 ,  H01L2224/80203 ,  H01L2224/80224 ,  H01L2224/82007 ,  H01L2224/821 ,  H01L2224/82102 ,  H01L2224/82106 ,  H01L2224/83093 ,  H01L2224/83121 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83224 ,  H01L2224/83805 ,  H01L2224/83815 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83859 ,  H01L2224/83862 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/92244 ,  H01L2224/9512 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01S5/02236 ,  H01S5/02276 ,  H05K1/18 ,  H05K13/04 ,  H05K13/046 ,  Y02E10/50 ,  Y10T29/49124 ,  Y10T29/51 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13111

摘要： A method of printing transferable components includes pressing a stamp including at least one transferable semiconductor component thereon on a target substrate such that the at least one transferable component and a surface of the target substrate contact opposite surfaces of a conductive eutectic layer. During pressing of the stamp on the target substrate, the at least one transferable component is exposed to electromagnetic radiation that is directed through the transfer stamp to reflow the eutectic layer. The stamp is then separated from the target substrate to delaminate the at least one transferable component from the stamp and print the at least one transferable component onto the surface of the target substrate. Related systems and methods are also discussed.

摘要翻译： 打印可转移部件的方法包括在目标基板上按压包括至少一个可转移半导体部件的印模，使得至少一个可转印部件和目标基板的表面接触导电共晶层的相对表面。 在压印目标基板上的印模时，将至少一个可转印部件暴露于电磁辐射，该电磁辐射被引导通过传送印模以回流共晶层。 然后将印模与目标基材分离，以将印模中的至少一种可转移组分分层，并将该至少一种可转移组分印刷到目标基材的表面上。 还讨论了相关系统和方法。

公开(公告)号：US09016342B2

公开(公告)日：2015-04-28

申请号：US13184084

申请日：2011-07-15

申请人： Kazuhiko Kobayashi

发明人： Kazuhiko Kobayashi

IPC分类号： B32B37/10 ,  H01L23/00

CPC分类号： H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/95 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75102 ,  H01L2224/75252 ,  H01L2224/753 ,  H01L2224/75313 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/7532 ,  H01L2224/755 ,  H01L2224/75502 ,  H01L2224/75704 ,  H01L2224/75755 ,  H01L2224/75756 ,  H01L2224/75804 ,  H01L2224/7598 ,  H01L2224/75984 ,  H01L2224/81048 ,  H01L2224/8109 ,  H01L2224/81093 ,  H01L2224/83048 ,  H01L2224/8309 ,  H01L2224/83093 ,  H01L2224/83855 ,  H01L2224/9211 ,  H01L2224/95093 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/00

摘要： The bonding apparatus is capable of effectively increasing temperature of a substrate and reducing occurrence of position gaps and poor connection in a process of flip-chip-bonding semiconductor devices to the substrate. The bonding apparatus comprises: a supporting unit for supporting the substrate, on which the semiconductor devices have been adhered by a non-conductive; and a heating/pressing unit for heating and pressing the substrate, the heating/pressing unit having a built-in heat source and a clamping face, onto which the substrate supported by the supporting unit is pressed. The substrate supported by the supporting unit is moved toward the clamping face of the heating/pressing unit so as to preheat the substrate and the semiconductor devices by radiation heat. Then, the semiconductor devices are pressed onto the clamping face of the heating/pressing unit so as to cure the non-conductive adhesive and bond bumps of the semiconductor devices to terminal sections of the substrate.

摘要翻译： 接合装置能够有效地增加衬底的温度并减少在将半导体器件倒装芯片接合到衬底的工艺中位置间隙的发生和连接不良。 接合装置包括：用于支撑基板的支撑单元，半导体器件已经通过非导电粘附在该基板上; 以及用于加热和加压基板的加热/加压单元，加热/加压单元具有内置的热源和夹紧面，由支撑单元支撑的基板被压在该加热/加压单元上。 由支撑单元支撑的基板朝向加热/加压单元的夹紧面移动，以便通过辐射热预热基板和半导体器件。 然后，将半导体器件按压到加热/加压单元的夹紧面上，以固化不导电粘合剂并将半导体器件的凸起接合到衬底的端子部分。

公开(公告)号：US20240170450A1

公开(公告)日：2024-05-23

申请号：US18283972

申请日：2022-03-28

申请人： SAFRAN ELECTRONICS & DEFENSE

发明人： Jean-Christophe RIOU ,  Corinne PONS ,  Alain JAUSSENT

IPC分类号： H01L23/00 ,  H01L25/065

CPC分类号： H01L24/83 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L25/0655 ,  H01L2224/29139 ,  H01L2224/33181 ,  H01L2224/75272 ,  H01L2224/7555 ,  H01L2224/7592 ,  H01L2224/83093 ,  H01L2224/83097 ,  H01L2224/83203 ,  H01L2224/83908

摘要： The method comprises the following successive steps: — depositing sintering material (26) onto one of an electronic component (28) and a substrate (30); — heating the material (26) so as to bring a temperature of the material to a preliminary exothermic peak, which precedes an exothermic sintering peak, without the temperature of the material reaching a maximum of the preliminary exothermic peak; — fastening the other of the component (28) and the substrate (30) to the material (26) so that the material is interposed between the component and the substrate; and— pressing the material (26) while hot so as to cause it to creep.

公开(公告)号：US09049797B2

公开(公告)日：2015-06-02

申请号：US13638040

申请日：2011-03-22

申请人： Etienne Menard ,  Christopher Bower ,  Matthew Meitl ,  Philip Garrou

发明人： Etienne Menard ,  Christopher Bower ,  Matthew Meitl ,  Philip Garrou

IPC分类号： H05K7/00 ,  H05K1/16 ,  B23K31/00 ,  H05K1/18 ,  H01L21/683 ,  H01L21/768 ,  H01L23/48 ,  H01L27/12 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/048 ,  H05K13/04 ,  H01L23/00 ,  H01S5/022

CPC分类号： H05K7/06 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/02 ,  H01L24/05 ,  H01L24/08 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L27/1214 ,  H01L27/1266 ,  H01L27/14618 ,  H01L31/0203 ,  H01L31/048 ,  H01L2221/6835 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0239 ,  H01L2224/04026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/08238 ,  H01L2224/24011 ,  H01L2224/24137 ,  H01L2224/24147 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/24998 ,  H01L2224/2731 ,  H01L2224/29078 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/3012 ,  H01L2224/32104 ,  H01L2224/32146 ,  H01L2224/32227 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/80203 ,  H01L2224/80224 ,  H01L2224/81192 ,  H01L2224/82007 ,  H01L2224/821 ,  H01L2224/82102 ,  H01L2224/82106 ,  H01L2224/83093 ,  H01L2224/83121 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/83815 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83859 ,  H01L2224/83862 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/92143 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01S5/02236 ,  H01S5/02276 ,  H05K1/18 ,  H05K3/0058 ,  H05K3/10 ,  H05K13/04 ,  H05K13/046 ,  Y02E10/50 ,  Y10T29/41 ,  Y10T29/4913 ,  Y10T29/49139 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13111

摘要： An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed.

摘要翻译： 有源元件阵列包括具有形成在目标基板一侧上的一个或多个触点的目标基板和分布在目标基板上的一个或多个可印刷的有源元件。 每个有源部件包括有源层，其具有形成在有源层的顶侧上或其中的上侧和相对的底侧以及一个或多个有源元件。 有源元件电连接到触点，并且底侧粘附到目标基板。 还讨论了相关的制造方法。

公开(公告)号：US20130153277A1

公开(公告)日：2013-06-20

申请号：US13638040

申请日：2011-03-22

申请人： Etienne Menard ,  Christopher Bower ,  Matthew Meitl ,  Philip Garrou

发明人： Etienne Menard ,  Christopher Bower ,  Matthew Meitl ,  Philip Garrou

IPC分类号： H05K1/18 ,  H05K13/04

CPC分类号： H05K7/06 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/02 ,  H01L24/05 ,  H01L24/08 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L27/1214 ,  H01L27/1266 ,  H01L27/14618 ,  H01L31/0203 ,  H01L31/048 ,  H01L2221/6835 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0239 ,  H01L2224/04026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/08238 ,  H01L2224/24011 ,  H01L2224/24137 ,  H01L2224/24147 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/24998 ,  H01L2224/2731 ,  H01L2224/29078 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/3012 ,  H01L2224/32104 ,  H01L2224/32146 ,  H01L2224/32227 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/80203 ,  H01L2224/80224 ,  H01L2224/81192 ,  H01L2224/82007 ,  H01L2224/821 ,  H01L2224/82102 ,  H01L2224/82106 ,  H01L2224/83093 ,  H01L2224/83121 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/83815 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83859 ,  H01L2224/83862 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/92143 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01S5/02236 ,  H01S5/02276 ,  H05K1/18 ,  H05K3/0058 ,  H05K3/10 ,  H05K13/04 ,  H05K13/046 ,  Y02E10/50 ,  Y10T29/41 ,  Y10T29/4913 ,  Y10T29/49139 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13111

摘要： An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed.

摘要翻译： 有源元件阵列包括具有形成在目标基板一侧上的一个或多个触点的目标基板和分布在目标基板上的一个或多个可印刷的有源元件。 每个有源部件包括有源层，其具有形成在有源层的顶侧上或其中的上侧和相对的底侧以及一个或多个有源元件。 有源元件电连接到触点，并且底侧粘附到目标基板。 还讨论了相关的制造方法。

公开(公告)号：US20120247664A1

公开(公告)日：2012-10-04

申请号：US13184084

申请日：2011-07-15

申请人： Kazuhiko KOBAYASHI

发明人： Kazuhiko KOBAYASHI

IPC分类号： B29C65/18 ,  B32B37/02

CPC分类号： H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/95 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75102 ,  H01L2224/75252 ,  H01L2224/753 ,  H01L2224/75313 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/7532 ,  H01L2224/755 ,  H01L2224/75502 ,  H01L2224/75704 ,  H01L2224/75755 ,  H01L2224/75756 ,  H01L2224/75804 ,  H01L2224/7598 ,  H01L2224/75984 ,  H01L2224/81048 ,  H01L2224/8109 ,  H01L2224/81093 ,  H01L2224/83048 ,  H01L2224/8309 ,  H01L2224/83093 ,  H01L2224/83855 ,  H01L2224/9211 ,  H01L2224/95093 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/00

摘要： The bonding apparatus is capable of effectively increasing temperature of a substrate and reducing occurrence of position gaps and poor connection in a process of flip-chip-bonding semiconductor devices to the substrate. The bonding apparatus comprises: a supporting unit for supporting the substrate, on which the semiconductor devices have been adhered by a non-conductive; and a heating/pressing unit for heating and pressing the substrate, the heating/pressing unit having a built-in heat source and a clamping face, onto which the substrate supported by the supporting unit is pressed. The substrate supported by the supporting unit is moved toward the clamping face of the heating/pressing unit so as to preheat the substrate and the semiconductor devices by radiation heat. Then, the semiconductor devices are pressed onto the clamping face of the heating/pressing unit so as to cure the non-conductive adhesive and bond bumps of the semiconductor devices to terminal sections of the substrate.

摘要翻译： 接合装置能够有效地增加衬底的温度并减少在将半导体器件倒装芯片接合到衬底的工艺中位置间隙的发生和连接不良。 接合装置包括：用于支撑基板的支撑单元，半导体器件已经通过非导电粘附在该基板上; 以及用于加热和加压基板的加热/加压单元，加热/加压单元具有内置的热源和夹紧面，由支撑单元支撑的基板被压在该加热/加压单元上。 由支撑单元支撑的基板朝向加热/加压单元的夹紧面移动，以便通过辐射热预热基板和半导体器件。 然后，将半导体器件按压到加热/加压单元的夹紧面上，以固化不导电粘合剂并将半导体器件的凸起接合到衬底的端子部分。

公开(公告)号：US20120115262A1

公开(公告)日：2012-05-10

申请号：US13352876

申请日：2012-01-18

申请人： Etienne Menard ,  Matthew Meitl ,  John A. Rogers

发明人： Etienne Menard ,  Matthew Meitl ,  John A. Rogers

IPC分类号： H01L33/48 ,  H05K13/00 ,  H05K3/00 ,  H01L31/02

CPC分类号： H01L27/1266 ,  H01L21/6835 ,  H01L21/76898 ,  H01L21/7806 ,  H01L23/481 ,  H01L23/544 ,  H01L24/02 ,  H01L24/05 ,  H01L24/08 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/799 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L24/98 ,  H01L27/1214 ,  H01L27/14618 ,  H01L31/0203 ,  H01L31/043 ,  H01L31/048 ,  H01L31/1892 ,  H01L2221/68318 ,  H01L2221/68322 ,  H01L2221/6835 ,  H01L2221/68368 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0239 ,  H01L2224/04026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/08238 ,  H01L2224/24011 ,  H01L2224/24137 ,  H01L2224/24147 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/24998 ,  H01L2224/2731 ,  H01L2224/29078 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/3012 ,  H01L2224/32104 ,  H01L2224/32146 ,  H01L2224/32227 ,  H01L2224/73267 ,  H01L2224/75263 ,  H01L2224/75314 ,  H01L2224/7598 ,  H01L2224/76155 ,  H01L2224/80203 ,  H01L2224/80224 ,  H01L2224/82007 ,  H01L2224/821 ,  H01L2224/82102 ,  H01L2224/82106 ,  H01L2224/83093 ,  H01L2224/83121 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83224 ,  H01L2224/83805 ,  H01L2224/83815 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83859 ,  H01L2224/83862 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/92244 ,  H01L2224/9512 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01S5/02236 ,  H01S5/02276 ,  H05K1/18 ,  H05K13/04 ,  H05K13/046 ,  Y02E10/50 ,  Y10T29/49124 ,  Y10T29/51 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13111

摘要： A method of printing transferable components includes pressing a stamp including at least one transferable semiconductor component thereon on a target substrate such that the at least one transferable component and a surface of the target substrate contact opposite surfaces of a conductive eutectic layer. During pressing of the stamp on the target substrate, the at least one transferable component is exposed to electromagnetic radiation that is directed through the transfer stamp to reflow the eutectic layer. The stamp is then separated from the target substrate to delaminate the at least one transferable component from the stamp and print the at least one transferable component onto the surface of the target substrate. Related systems and methods are also discussed.

摘要翻译： 打印可转移部件的方法包括在目标基板上按压包括至少一个可转移半导体部件的印模，使得至少一个可转印部件和目标基板的表面接触导电共晶层的相对表面。 在压印目标基板上的印模时，将至少一个可转印部件暴露于电磁辐射，该电磁辐射被引导通过传送印模以回流共晶层。 然后将印模与目标基材分离，以将印模中的至少一种可转移组分分层，并将该至少一种可转移组分印刷到目标基材的表面上。 还讨论了相关系统和方法。