公开(公告)号：US20180334708A1

公开(公告)日：2018-11-22

申请号：US15949456

申请日：2018-04-10

申请人： LIFE TECHNOLOGIES CORPORATION

发明人： Jonathan ROTHBERG ,  Wolfgang HINZ ,  Kim JOHNSON ,  James BUSTILLO

IPC分类号： C12Q1/6869 ,  G01N27/414 ,  H01L27/088 ,  H01L23/00 ,  C12Q1/6874 ,  H01L21/306 ,  H01L29/78

CPC分类号： C12Q1/6869 ,  C12Q1/6874 ,  G01N27/414 ,  G01N27/4145 ,  G01N27/4148 ,  H01L21/306 ,  H01L24/18 ,  H01L24/20 ,  H01L24/82 ,  H01L27/088 ,  H01L29/78 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01056 ,  H01L2924/01059 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  C12Q2565/607 ,  C12Q2565/301 ,  C12Q2533/101 ,  H01L2924/00

摘要： Methods and apparatus relating to very large scale FET arrays for analyte measurements. ChemFET (e.g., ISFET) arrays may be fabricated using conventional CMOS processing techniques based on improved FET pixel and array designs that increase measurement sensitivity and accuracy, and at the same time facilitate significantly small pixel sizes and dense arrays. Improved array control techniques provide for rapid data acquisition from large and dense arrays. Such arrays may be employed to detect a presence and/or concentration changes of various analyte types in a wide variety of chemical and/or biological processes. In one example, chemFET arrays facilitate DNA sequencing techniques based on monitoring changes in hydrogen ion concentration (pH), changes in other analyte concentration, and/or binding events associated with chemical processes relating to DNA synthesis.

公开(公告)号：US20170171958A1

公开(公告)日：2017-06-15

申请号：US14965039

申请日：2015-12-10

申请人： Palo Alto Research Center Incorporated

发明人： Tse Nga Ng ,  Ping Mei ,  Brent S. Krusor ,  Gregory L. Whiting ,  Steven E. Ready ,  Janos Veres

IPC分类号： H05K1/02 ,  H05K1/03 ,  H05K3/14 ,  H05K1/18

CPC分类号： H05K1/028 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/76 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24105 ,  H01L2224/24991 ,  H01L2224/76151 ,  H01L2224/76155 ,  H01L2224/76252 ,  H01L2224/82051 ,  H01L2224/82181 ,  H01L2224/8285 ,  H01L2224/82986 ,  H05K1/0326 ,  H05K1/185 ,  H05K3/14 ,  Y10T29/4913

摘要： Provided is a manufacturing process for electronic circuit components such as bare dies, and packaged integrated chips, among other configurations, to form electronic assemblies. The surface of the electronic circuit component carries electronic elements such as conductive traces and/or other configurations including contact pads. A method for forming an electronic assembly includes providing a tacky layer. Then an electronic circuit component is provided having a first side and a second side, where the first side carries the electronic elements. The first side of the electronic circuit component is positioned into contact with the tacky layer. A bonding material is then deposited to a portion of the adhesive layer that is not covered by the first side of the electronic circuit component, to a depth which is sufficient to cover at least a portion of the electronic circuit component. The bonding material is then fixed or cured into a fixed or cured bonding material, and the tacky layer is removed. By these operations, the electronic circuit component is held in a secure attachment by the fixed or cured bonding material, and circuit connections may be made.

公开(公告)号：US20160300811A1

公开(公告)日：2016-10-13

申请号：US15190466

申请日：2016-06-23

申请人： Infineon Technologies Americas Corp.

发明人： Martin Standing

IPC分类号： H01L23/00 ,  H01L23/495

CPC分类号： H01L24/40 ,  H01L23/04 ,  H01L23/06 ,  H01L23/13 ,  H01L23/14 ,  H01L23/492 ,  H01L23/4924 ,  H01L23/49548 ,  H01L23/49558 ,  H01L23/49582 ,  H01L23/4985 ,  H01L24/24 ,  H01L24/34 ,  H01L24/36 ,  H01L24/37 ,  H01L24/82 ,  H01L24/83 ,  H01L24/84 ,  H01L25/165 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/37012 ,  H01L2224/37147 ,  H01L2224/37639 ,  H01L2224/37644 ,  H01L2224/40225 ,  H01L2224/73153 ,  H01L2224/73253 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/05432 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/0715 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49174 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device copackaged with the power semiconductor device inside the can.

公开(公告)号：US09418328B2

公开(公告)日：2016-08-16

申请号：US14559695

申请日：2014-12-03

申请人： RUIZHANG TECHNOLOGY LIMITED COMPANY

发明人： Glenn W. Gengel ,  Mark A. Hadley ,  Tom Pounds ,  Kenneth D. Schatz ,  Paul S. Drzaic

IPC分类号： G08B13/14 ,  G06K19/077 ,  G06K19/02 ,  H01L23/00

CPC分类号： G06K19/07749 ,  D10B2401/18 ,  G06K19/027 ,  G06K19/07722 ,  G06K19/07758 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82039 ,  H01L2224/82102 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3011 ,  Y10T29/49018 ,  Y10T29/49155 ,  H01L2924/00

摘要： A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.

公开(公告)号：US20160218088A1

公开(公告)日：2016-07-28

申请号：US15086693

申请日：2016-03-31

申请人： Invensas Corporation

发明人： Simon J. S. McElrea ,  Marc E. Robinson ,  Lawrence Douglas Andrews, JR.

IPC分类号： H01L25/065

CPC分类号： H01L25/0657 ,  H01L21/56 ,  H01L23/48 ,  H01L24/24 ,  H01L24/80 ,  H01L24/82 ,  H01L29/0657 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01067 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/00

摘要： Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.

摘要翻译： 堆叠的模具组件电连接到任何支撑件上的连接部位，而不与任何插入的基板或引线框架电连接，并且没有焊料。

公开(公告)号：US09391003B2

公开(公告)日：2016-07-12

申请号：US14716780

申请日：2015-05-19

申请人： Infineon Technologies Americas Corp.

发明人： Martin Standing

IPC分类号： H01L23/10 ,  H01L23/12 ,  H01L23/492 ,  H01L23/13 ,  H01L23/498 ,  H01L23/00 ,  H01L25/16 ,  H01L23/04 ,  H01L23/06 ,  H01L23/14 ,  H01L23/495

CPC分类号： H01L24/40 ,  H01L23/04 ,  H01L23/06 ,  H01L23/13 ,  H01L23/14 ,  H01L23/492 ,  H01L23/4924 ,  H01L23/49548 ,  H01L23/49558 ,  H01L23/49582 ,  H01L23/4985 ,  H01L24/24 ,  H01L24/34 ,  H01L24/36 ,  H01L24/37 ,  H01L24/82 ,  H01L24/83 ,  H01L24/84 ,  H01L25/165 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/37012 ,  H01L2224/37147 ,  H01L2224/37639 ,  H01L2224/37644 ,  H01L2224/40225 ,  H01L2224/73153 ,  H01L2224/73253 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/05432 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/0715 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49174 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device copackaged with the power semiconductor device inside the can.

摘要翻译： 包括导电罐的半导体封装，电气和机械地附接到罐的内表面的功率半导体器件，以及与罐内的功率半导体器件复合封装的IC半导体器件。

公开(公告)号：US09338894B2

公开(公告)日：2016-05-10

申请号：US13990823

申请日：2011-12-02

申请人： Jeroen Van Den Brand ,  Roel Henry Louis Kusters ,  Andreas Heinrich Dietzel

发明人： Jeroen Van Den Brand ,  Roel Henry Louis Kusters ,  Andreas Heinrich Dietzel

IPC分类号： H05K1/00 ,  H05K3/30 ,  H05K3/32 ,  H01L23/498 ,  H01L23/00 ,  H05K1/18 ,  H05K1/02 ,  H05K3/12

CPC分类号： H05K3/32 ,  H01L23/4985 ,  H01L24/24 ,  H01L24/76 ,  H01L24/82 ,  H01L2224/2405 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/25171 ,  H01L2224/25175 ,  H01L2224/76155 ,  H01L2224/76261 ,  H01L2224/766 ,  H01L2224/767 ,  H01L2224/82102 ,  H01L2224/82104 ,  H01L2224/82106 ,  H01L2224/82874 ,  H01L2224/9202 ,  H01L2224/92144 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/0283 ,  H05K1/189 ,  H05K3/12 ,  H05K3/305 ,  H05K2201/10674 ,  H05K2203/107 ,  H05K2203/1469 ,  H05K2203/1545 ,  H05K2203/175 ,  Y10T29/49133 ,  Y10T29/53178 ,  H01L2924/00

摘要： A method is presented for assembling a component (30) with a flexible substrate (10), the component having electric contacts (31). The method comprises the steps of placing the component (30) on a first main side (11) of the substrate, applying a machine vision step to estimate a position of the electric contacts, depositing one or more layers (32) of an electrically conductive material or a precursor thereof, said layer extending over an area of the substrate defined by the component to laterally beyond said area, calculating partitioning lines depending on the estimated position of the electric contacts, partitioning the layer into mutually insulated areas (32d) by locally removing material from said layer along said partitioning lines. Also an apparatus is presented that is suitable for carrying out the method.In addition an assembly is present that can be obtained by the method and the apparatus according to the invention.

摘要翻译： 提出了一种用于将组件（30）与柔性基板（10）组装的方法，该部件具有电触点（31）。 该方法包括以下步骤：将组件（30）放置在衬底的第一主侧（11）上，施加机器视觉步骤以估计电触点的位置，沉积导电的一个或多个层（32） 材料或其前体，所述层在由所述部件限定的衬底的区域上延伸到横向超过所述区域，根据所述电触点的估计位置计算划分线，通过局部将所述层划分为相互绝缘的区域（32d） 沿着所述分隔线从所述层去除材料。 还提出了适合于执行该方法的装置。 此外，存在可以通过根据本发明的方法和装置获得的组件。

公开(公告)号：US20150329904A1

公开(公告)日：2015-11-19

申请号：US14703565

申请日：2015-05-04

申请人： LIFE TECHNOLOGIES CORPORATION

发明人： Jonathan M. ROTHBERG ,  Wolfgang Hinz ,  Kim L. Johnson ,  James Bustillo

IPC分类号： C12Q1/68

CPC分类号： C12Q1/6869 ,  C12Q1/6874 ,  G01N27/414 ,  G01N27/4145 ,  G01N27/4148 ,  H01L21/306 ,  H01L24/18 ,  H01L24/20 ,  H01L24/82 ,  H01L27/088 ,  H01L29/78 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01056 ,  H01L2924/01059 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  C12Q2565/607 ,  C12Q2565/301 ,  C12Q2533/101 ,  H01L2924/00

摘要： Methods and apparatus relating to very large scale FET arrays for analyte measurements. ChemFET (e.g., ISFET) arrays may be fabricated using conventional CMOS processing techniques based on improved FET pixel and array designs that increase measurement sensitivity and accuracy, and at the same time facilitate significantly small pixel sizes and dense arrays. Improved array control techniques provide for rapid data acquisition from large and dense arrays. Such arrays may be employed to detect a presence and/or concentration changes of various analyte types in a wide variety of chemical and/or biological processes. In one example, chemFET arrays facilitate DNA sequencing techniques based on monitoring changes in hydrogen ion concentration (pH), changes in other analyte concentration, and/or binding events associated with chemical processes relating to DNA synthesis.

摘要翻译： 与用于分析物测量的非常大规模的FET阵列相关的方法和装置。 可以使用基于提高测量灵敏度和精度的改进的FET像素和阵列设计的传统CMOS处理技术来制造ChemFET（例如，ISFET）阵列，并且同时促进显着小的像素尺寸和致密阵列。 改进的阵列控制技术提供了从大型和密集阵列的快速数据采集。 可以使用这样的阵列来检测各种化学和/或生物过程中各种分析物类型的存在和/或浓度变化。 在一个实例中，chemFET阵列基于监测氢离子浓度（pH），其他分析物浓度变化和/或与DNA合成相关的化学过程相关联的结合事件的变化来促进DNA测序技术。

公开(公告)号：US09153517B2

公开(公告)日：2015-10-06

申请号：US13109996

申请日：2011-05-17

申请人： Reynaldo Co ,  Jeffrey S. Leal ,  Suzette K. Pangrle ,  Scott McGrath ,  DeAnn Eileen Melcher ,  Keith L. Barrie ,  Grant Villavicencio ,  Elmer M. del Rosario ,  John R. Bray

发明人： Reynaldo Co ,  Jeffrey S. Leal ,  Suzette K. Pangrle ,  Scott McGrath ,  DeAnn Eileen Melcher ,  Keith L. Barrie ,  Grant Villavicencio ,  Elmer M. del Rosario ,  John R. Bray

IPC分类号： H01L21/00 ,  H01L23/31 ,  H01L25/065 ,  H01L23/00 ,  H01L21/683 ,  H01L25/00

CPC分类号： H01L25/0657 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3171 ,  H01L23/3185 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/18 ,  H01L24/24 ,  H01L24/82 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/0235 ,  H01L2224/02371 ,  H01L2224/03002 ,  H01L2224/03318 ,  H01L2224/0332 ,  H01L2224/03632 ,  H01L2224/03848 ,  H01L2224/05016 ,  H01L2224/05017 ,  H01L2224/0529 ,  H01L2224/05553 ,  H01L2224/24051 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/94 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/03

摘要： Methods for forming connectors on die pads at a wafer level of processing include forming spots of a curable electrically conductive material over die pads and extending to or over the interconnect die edge; curing the conductive material; and in a wafer cutting procedure thereafter severing the spots. Also, die pad to z-interconnect connectors formed by the methods, and shaped and dimensioned accordingly. Also, stacked die assemblies and stacked die packages containing die prepared according to the methods and having die pad to z-interconnect connectors formed by the methods and shaped and dimensioned accordingly.

摘要翻译： 在晶片级处理中在芯片焊盘上形成连接器的方法包括在芯片焊盘上形成可固化的导电材料的点并且延伸到互连芯片边缘上或之上; 固化导电材料; 并且在切割步骤之后切断斑点。 而且，通过这些方法形成的管芯焊盘到z-互连连接器，并相应地成形和尺寸。 而且，堆叠的模具组件和包含根据方法制备的模具的堆叠模具组件，并且具有通过所述方法形成并且形状和尺寸的模具垫到z互连连接器。

公开(公告)号：US09147583B2

公开(公告)日：2015-09-29

申请号：US12913529

申请日：2010-10-27

申请人： Jeffrey S. Leal

发明人： Jeffrey S. Leal

IPC分类号： H01L21/31 ,  H01L21/469 ,  H01L21/56 ,  H01L21/02 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L24/82 ,  H01L21/02282 ,  H01L21/02288 ,  H01L21/31 ,  H01L21/324 ,  H01L21/56 ,  H01L21/76801 ,  H01L21/76828 ,  H01L24/19 ,  H01L24/24 ,  H01L24/25 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/19 ,  H01L2224/24145 ,  H01L2224/76155 ,  H01L2224/82051 ,  H01L2224/82101 ,  H01L2224/82102 ,  H01L2224/82355 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/14

摘要： Additive processes are employed for electrically insulating selected surface regions on a stack of die; and methods for electrically interconnecting die in a stack of die, include additive processes for electrically insulating selected surface regions of the die. Regions that are not insulated according to the invention are available for electrical connection using electrically conductive material applied in flowable form to make electrically conductive traces.

摘要翻译： 使用添加剂方法来电绝缘模具堆叠上的选定表面区域; 以及用于在管芯堆叠中电互连管芯的方法包括用于电绝缘管芯的选定表面区域的添加工艺。 根据本发明不是绝缘的区域可用于使用以可流动形式施加的导电材料进行电连接以制造导电迹线。