公开(公告)号：US06809405B2

公开(公告)日：2004-10-26

申请号：US10299768

申请日：2002-11-20

Applicant: Fujio Ito ,  Hiromicti Suzuki

Inventor： Fujio Ito ,  Hiromicti Suzuki

IPC: H01L23495

CPC classification number: H01L24/85 ,  H01L21/4821 ,  H01L21/561 ,  H01L21/565 ,  H01L23/49503 ,  H01L23/49506 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/06 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48664 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/82181 ,  H01L2224/85001 ,  H01L2224/85181 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2224/85464 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/20647 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00012

Abstract: As a means for promoting the increase of the number of pins in a QFN (Quad Non-leaded package), a semiconductor die mounted on a die pad is arranged at the center of a plastic package, and a plurality of leads made of the same metal as the die pad and die pad supports are arranged around the die pad so as to surround the die pad. Lead tips on one side near the semiconductor die are electrically connected to bonding pads on a main surface of the semiconductor die via gold wires, and lead tips on the other side are ended at a side surface of the plastic package. In order to reduce the length between the semiconductor die and the leads, the lead tips on the one side are extended to positions close to the die pad, and the intervals between adjoining leads on the one side are smaller than those on the other side.

Abstract translation: 作为用于促进QFN（四极非引线封装）中引脚数量增加的手段，安装在管芯焊盘上的半导体管芯设置在塑料封装的中心，并且由其制成的多个引线 作为管芯焊盘和管芯焊盘支撑件的金属被布置在管芯焊盘周围，以围绕管芯焊盘。 在半导体管芯附近的一侧的引线尖端通过金线电连接到半导体管芯的主表面上的接合焊盘，另一侧的引线端在塑料封装的侧表面处结束。 为了减小半导体管芯和引线之间的长度，一侧的引线端延伸到靠近管芯焊盘的位置，并且一侧的相邻引线之间的间隔小于另一侧的间隔。

公开(公告)号：US07061125B2

公开(公告)日：2006-06-13

申请号：US10667474

申请日：2003-09-23

Applicant: Sung-Dae Cho ,  Sang-Jun Kim ,  Joo-Hyung Lee

Inventor： Sung-Dae Cho ,  Sang-Jun Kim ,  Joo-Hyung Lee

IPC: H01L23/29

CPC classification number: H01L24/82 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/2512 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76152 ,  H01L2224/82007 ,  H01L2224/82181 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00

Abstract: A semiconductor package utilizing insulating peripheral sealing portions and pattern leads and methods for manufacturing such semiconductor packages are provided. The semiconductor package includes a substrate on which a semiconductor chip is mounted. The substrate includes a plurality of substrate pads and the semiconductor chip includes a plurality of chip pads on an active surface. The semiconductor chip is surrounded by one or more peripheral sealing layers and conductive lead patterns are formed across the peripheral sealing layer(s) to connect the chip pads to corresponding substrate pads. The chip and lead patterns may be encapsulated and the substrate may also be provided with external connection structures such as solder balls to complete the package.

Abstract translation: 提供利用绝缘外围密封部分和图案引线的半导体封装以及用于制造这种半导体封装件的方法。 半导体封装包括其上安装有半导体芯片的基板。 衬底包括多个衬底焊盘，并且半导体芯片在有源表面上包括多个芯片焊盘。 半导体芯片由一个或多个外围密封层围绕，并且跨越周边密封层形成导电引线图案，以将芯片焊盘连接到相应的衬底焊盘。 可以封装芯片和引线图案，并且衬底也可以设置有外部连接结构，例如焊球以完成封装。

公开(公告)号：US20030111717A1

公开(公告)日：2003-06-19

申请号：US10299768

申请日：2002-11-20

Inventor： Fujio Ito ,  Hiromicti Suzuki

IPC: H01L023/02

CPC classification number: H01L24/85 ,  H01L21/4821 ,  H01L21/561 ,  H01L21/565 ,  H01L23/49503 ,  H01L23/49506 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/06 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48664 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/82181 ,  H01L2224/85001 ,  H01L2224/85181 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2224/85464 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/20647 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00012

Abstract: As a means for promoting the increase of the number of pins in a QFN (Quad Non-leaded package), a semiconductor die mounted on a die pad is arranged at the center of a plastic package, and a plurality of leads made of the same metal as the die pad and die pad supports are arranged around the die pad so as to surround the die pad. Lead tips on one side near the semiconductor die are electrically connected to bonding pads on a main surface of the semiconductor die via gold wires, and lead tips on the other side are ended at a side surface of the plastic package. In order to reduce the length between the semiconductor die and the leads, the lead tips on the one side are extended to positions close to the die pad, and the intervals between adjoining leads on the one side are smaller than those on the other side.

公开(公告)号：US5373188A

公开(公告)日：1994-12-13

申请号：US3422

申请日：1993-01-12

Applicant: Kazunari Michii ,  Koichi Nakagawa

Inventor： Kazunari Michii ,  Koichi Nakagawa

IPC: H01L21/56 ,  H01L21/60 ,  H01L23/28 ,  H01L23/495 ,  H01L23/50 ,  H01L23/538 ,  H01L23/48 ,  H01L29/44 ,  H01L29/52 ,  H01L29/60

CPC classification number: H01L24/06 ,  H01L23/4951 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/32 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/06136 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/82181 ,  H01L2224/85181 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/30107

Abstract: A resin-molded multi-chip package semiconductor device includes a lead frame having a plurality of leads including crossing leads that extend over an obverse or a reverse side of one semiconductor element separated from electrical contact with the element by an interposed insulating material. The electrodes of one element and of another element are electrically connected in common to the crossing lead by bonding wires. The device may comprise a TAB tape having leads on an insulating tape, electrically connecting the electrodes of the neighboring elements together. The TAB tape may include crossing leads that cross another TAB lead.

Abstract translation: 树脂模制的多芯片封装半导体器件包括引线框架，该引线框架具有多个引线，引线包括跨越一个半导体元件的正面或反面的交叉引线，该半导体元件通过插入的绝缘材料与元件电接触而分离。 一个元件的电极和另一个元件的电极通过接合线电连接到交叉引线。 该装置可以包括在绝缘带上具有引线的TAB带，将相邻元件的电极电连接在一起。 TAB带可以包括穿过另一TAB引线的交叉引线。

公开(公告)号：US5259548A

公开(公告)日：1993-11-09

申请号：US901418

申请日：1992-06-19

Applicant: Nobuto Yamazaki ,  Kazuo Sugiura ,  Minoru Torihata ,  Kuniyuki Takahashi ,  Tatsunari Mii

Inventor： Nobuto Yamazaki ,  Kazuo Sugiura ,  Minoru Torihata ,  Kuniyuki Takahashi ,  Tatsunari Mii

IPC: H01L21/60 ,  H01L21/607 ,  H01L20/60

CPC classification number: H01L24/85 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/78301 ,  H01L2224/82181 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L24/78 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14

Abstract: In order to avoid an excessive wire loop curvature at a second bonding point, a wire bonding is performed with the steps of: moving the capillary, after the wire is connected to a first bonding point, toward the second bonding point, and right before the capillary comes above the second bonding point, the capillary is moved down obliquely so that the capillary is positioned exactly above the second bonding point, and then the capillary is moved down straight so that the wire is pressed against the second bonding point.

Abstract translation: 为了避免第二接合点处的线环弯曲过度，以下步骤进行引线接合：在将导线连接到第一接合点之后，将毛细管移动到第二接合点， 毛细管位于第二结合点之上，毛细管倾斜地向下移动，使得毛细管位于第二结合点的正上方，然后毛细管被直线向下移动，使得金属丝压靠第二结合点。

公开(公告)号：USRE43443E1

公开(公告)日：2012-06-05

申请号：US09987978

申请日：2001-11-16

Applicant: Yujiro Kajihara ,  Kazunari Suzuki ,  Kunihiro Tsubosaki ,  Hiromichi Suzuki ,  Yoshinori Miyaki ,  Takahiro Naito ,  Sueo Kawai

Inventor： Yujiro Kajihara ,  Kazunari Suzuki ,  Kunihiro Tsubosaki ,  Hiromichi Suzuki ,  Yoshinori Miyaki ,  Takahiro Naito ,  Sueo Kawai

IPC: H01L23/495

CPC classification number: H01L24/743 ,  H01L21/4842 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/02166 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/82181 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2224/85181 ,  H01L2224/859 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  Y10T29/49121 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599

Abstract: In order to improve the package body cracking resistance of an LSI package at the reflow soldering and to provide both a leadframe suitable for fabricating the LSI package according to the flexible manufacturing system and an LSI using the leadframe, the adhered area between a semiconductor chip 2 and a resin is enlarged by making the external size of a die pad 3 smaller than that of the semiconductor chip to be mounted thereon. Moreover, a variety of semiconductor chips 2 having different external sizes can be mounted on the die pad 3 by cutting the leading ends of leads 5 to a suitable length in accordance with the external sizes of the semiconductor chips 2.

Abstract translation: 为了提高回流焊时的LSI封装的封装体抗开裂性，并且提供适用于制造根据柔性制造系统的LSI封装的引线框和使用引线框的LSI，半导体芯片2 并且通过使管芯焊盘3的外部尺寸小于要安装在其上的半导体芯片的外部尺寸来扩大树脂。 此外，通过根据半导体芯片2的外部尺寸将引线5的前端切割成合适的长度，可以将不同的外部尺寸的各种半导体芯片2安装在管芯焊盘3上。

公开(公告)号：US07507606B2

公开(公告)日：2009-03-24

申请号：US11474332

申请日：2006-06-26

Applicant: Fujio Ito ,  Hiromicti Suzuki

Inventor： Fujio Ito ,  Hiromicti Suzuki

IPC: H01L21/48 ,  H01L21/44 ,  H01L21/50

CPC classification number: H01L24/85 ,  H01L21/4821 ,  H01L21/561 ,  H01L21/565 ,  H01L23/49503 ,  H01L23/49506 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/06 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48664 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/82181 ,  H01L2224/85001 ,  H01L2224/85181 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2224/85464 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/20647 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00012

Abstract: As a means for promoting the increase of the number of pins in a QFN (Quad Non-leaded package), a semiconductor die mounted on a die pad is arranged at the center of a plastic package, and a plurality of leads made of the same metal as the die pad and die pad supports are arranged around the die pad so as to surround the die pad. Lead tips on one side near the semiconductor die are electrically connected to bonding pads on a main surface of the semiconductor die via gold wires, and lead tips on the other side are ended at a side surface of the plastic package. In order to reduce the length between the semiconductor die and the leads, the lead tips on the one side are extended to positions close to the die pad, and the intervals between adjoining leads on the one side are smaller than those on the other side.

Abstract translation: 作为用于促进QFN（四极非引线封装）中引脚数量增加的手段，安装在管芯焊盘上的半导体管芯设置在塑料封装的中心，并且由其制成的多个引线 作为管芯焊盘和管芯焊盘支撑件的金属被布置在管芯焊盘周围，以围绕管芯焊盘。 在半导体管芯附近的一侧的引线尖端通过金线电连接到半导体管芯的主表面上的接合焊盘，另一侧的引线端在塑料封装的侧表面处结束。 为了减小半导体管芯和引线之间的长度，一侧的引线端延伸到靠近管芯焊盘的位置，并且一侧的相邻引线之间的间隔小于另一侧的间隔。

公开(公告)号：US20040232528A1

公开(公告)日：2004-11-25

申请号：US10878269

申请日：2004-06-29

Inventor： Fujio Ito ,  Hiromicti Suzuki

IPC: H01L023/495

CPC classification number: H01L24/85 ,  H01L21/4821 ,  H01L21/561 ,  H01L21/565 ,  H01L23/49503 ,  H01L23/49506 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/06 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48664 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/82181 ,  H01L2224/85001 ,  H01L2224/85181 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2224/85464 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/20647 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00012

Abstract: As a means for promoting the increase of the number of pins in a QFN (Quad Non-leaded package), a semiconductor die mounted on a die pad is arranged at the center of a plastic package, and a plurality of leads made of the same metal as the die pad and die pad supports are arranged around the die pad so as to surround the die pad. Lead tips on one side near the semiconductor die are electrically connected to bonding pads on a main surface of the semiconductor die via gold wires, and lead tips on the other side are ended at a side surface of the plastic package. In order to reduce the length between the semiconductor die and the leads, the lead tips on the one side are extended to positions close to the die pad, and the intervals between adjoining leads on the one side are smaller than those on the other side.

公开(公告)号：US5637913A

公开(公告)日：1997-06-10

申请号：US311021

申请日：1994-09-22

Applicant: Yujiro Kajihara ,  Kazunari Suzuki ,  Kunihiro Tsubosaki ,  Hiromichi Suzuki ,  Yoshinori Miyaki ,  Takahiro Naito ,  Sueo Kawai

Inventor： Yujiro Kajihara ,  Kazunari Suzuki ,  Kunihiro Tsubosaki ,  Hiromichi Suzuki ,  Yoshinori Miyaki ,  Takahiro Naito ,  Sueo Kawai

IPC: H01L23/50 ,  H01L21/48 ,  H01L21/52 ,  H01L21/60 ,  H01L23/495 ,  H01L23/48

CPC classification number: H01L24/743 ,  H01L21/4842 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/02166 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/82181 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2224/85181 ,  H01L2224/859 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  Y10T29/49121

Abstract: In order to improve the package body cracking resistance of an LSI package at the reflow soldering and to provide both a leadframe suitable for fabricating the LSI package according to the flexible manufacturing system and an LSI using the leadframe, the adhered area between a semiconductor chip 2 and a resin is enlarged by making the external size of a die pad 3 smaller than that of the semiconductor chip to be mounted thereon. Moreover, a variety of semiconductor chips 2 having different external sizes can be mounted on the die pad 3 by cutting the leading ends of leads 5 to a suitable length in accordance with the external sizes of the semiconductor chips 2.

Abstract translation: 为了提高回流焊时的LSI封装的封装体抗开裂性，并且提供适用于制造根据柔性制造系统的LSI封装的引线框和使用引线框的LSI，半导体芯片2 并且通过使管芯焊盘3的外部尺寸小于要安装在其上的半导体芯片的外部尺寸来扩大树脂。 此外，通过根据半导体芯片2的外部尺寸将引线5的前端切割成合适的长度，可以将不同的外部尺寸的各种半导体芯片2安装在管芯焊盘3上。

公开(公告)号：US20170171958A1

公开(公告)日：2017-06-15

申请号：US14965039

申请日：2015-12-10

Applicant: Palo Alto Research Center Incorporated

Inventor： Tse Nga Ng ,  Ping Mei ,  Brent S. Krusor ,  Gregory L. Whiting ,  Steven E. Ready ,  Janos Veres

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/14 ,  H05K1/18

CPC classification number: H05K1/028 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/76 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24105 ,  H01L2224/24991 ,  H01L2224/76151 ,  H01L2224/76155 ,  H01L2224/76252 ,  H01L2224/82051 ,  H01L2224/82181 ,  H01L2224/8285 ,  H01L2224/82986 ,  H05K1/0326 ,  H05K1/185 ,  H05K3/14 ,  Y10T29/4913

Abstract: Provided is a manufacturing process for electronic circuit components such as bare dies, and packaged integrated chips, among other configurations, to form electronic assemblies. The surface of the electronic circuit component carries electronic elements such as conductive traces and/or other configurations including contact pads. A method for forming an electronic assembly includes providing a tacky layer. Then an electronic circuit component is provided having a first side and a second side, where the first side carries the electronic elements. The first side of the electronic circuit component is positioned into contact with the tacky layer. A bonding material is then deposited to a portion of the adhesive layer that is not covered by the first side of the electronic circuit component, to a depth which is sufficient to cover at least a portion of the electronic circuit component. The bonding material is then fixed or cured into a fixed or cured bonding material, and the tacky layer is removed. By these operations, the electronic circuit component is held in a secure attachment by the fixed or cured bonding material, and circuit connections may be made.