公开(公告)号：US09972736B2

公开(公告)日：2018-05-15

申请号：US14205839

申请日：2014-03-12

申请人： National Technology & Engineering Solutions of Sandia, LLC

发明人： Jeffrey P. Koplow ,  Vipin P. Gupta ,  Gregory N. Nielson ,  Murat Okandan ,  Jose Luis Cruz-Campa ,  Jeffrey S. Nelson

IPC分类号： H01L31/18 ,  H01L21/68

CPC分类号： H01L31/18 ,  Y10T29/49133 ,  Y10T29/53174 ,  Y10T29/53261

摘要： An apparatus, method, and system, the apparatus including a receiving member dimensioned to receive an array of microelectronic devices; and a linkage member coupled to the receiving member, the linkage member configured to move the receiving member in at least two dimensions so as to modify a spacing between the electronic devices within the array of microelectronic devices received by the receiving member. The method including coupling an array of microelectronic devices to an expansion assembly; and expanding the expansion assembly so as to expand the array of microelectronic devices in at least two directions within a single plane. The system including a support member; an expansion assembly coupled to the support member, the expansion assembly having a plurality of receiving members configured to move in at least two dimensions within a single plane; and a plurality of microelectronic devices coupled to each of the plurality of receiving members.

公开(公告)号：US09803847B2

公开(公告)日：2017-10-31

申请号：US14258985

申请日：2014-04-22

申请人： FPT Acquisition Corp.

发明人： John Popovich ,  Gregory W. Honegger

IPC分类号： F21V29/00 ,  F21V29/70 ,  A47C7/72 ,  F21K9/00 ,  F21V19/00 ,  G09F9/33 ,  G09F13/22 ,  H05K1/02 ,  F21V29/74 ,  F21K9/90 ,  H05K3/32 ,  F21K9/60 ,  F21V29/507 ,  F21V7/00 ,  H05K3/00 ,  F21Y115/10 ,  F21V29/89 ,  F21Y103/10

CPC分类号： F21V29/70 ,  A47C7/725 ,  F21K9/00 ,  F21K9/60 ,  F21K9/90 ,  F21V7/0025 ,  F21V7/005 ,  F21V19/001 ,  F21V29/507 ,  F21V29/74 ,  F21V29/89 ,  F21Y2103/10 ,  F21Y2115/10 ,  G09F9/33 ,  G09F13/22 ,  H05K1/0203 ,  H05K3/0061 ,  H05K3/32 ,  H05K2201/10106 ,  H05K2201/10446 ,  H05K2201/10598 ,  Y10S362/80 ,  Y10T29/49133 ,  Y10T29/49826

摘要： A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs to an adjacent heat sink. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. The LED modules can be used in a variety of illumination applications employing one or more modules.

公开(公告)号：US09572265B2

公开(公告)日：2017-02-14

申请号：US14406544

申请日：2013-06-12

申请人： Linxens Holding

发明人： Séverine Dieu-Gomont ,  Francois Lechleiter ,  Yannick De Maquillé

IPC分类号： H01L21/302 ,  H01L21/461 ,  H01B13/00 ,  C03C15/00 ,  C03C25/68 ,  H05K3/32 ,  H05K3/00 ,  H05K1/18 ,  H05K3/06 ,  H05K3/40

CPC分类号： H05K3/32 ,  H05K1/189 ,  H05K3/0017 ,  H05K3/002 ,  H05K3/06 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/10106 ,  Y10T29/49133

摘要： The invention concerns a method of producing a circuit including the step consisting of connecting, to a bottom wall of a cavity, an electronic component with or without an intermediate wired link, the method including a step prior to an etching step which consists of depositing a layer of protective material on a conductive layer in the bottom of the cavity, said material being a liquid material capable of hardening and, once hardened, resistant to the etching solution.

摘要翻译： 本发明涉及一种制造电路的方法，包括该步骤包括将空腔的底壁连接到具有或不具有中间有线链路的电子部件，所述方法包括在蚀刻步骤之前的步骤，该步骤包括： 在空腔底部的导电层上的保护材料层，所述材料是能够硬化并且一旦硬化的耐蚀刻溶液的液体材料。

公开(公告)号：US09491859B2

公开(公告)日：2016-11-08

申请号：US13901398

申请日：2013-05-23

申请人： Massachusetts Institute of Technology

发明人： Dmitry Tolpin ,  James H. Kelly ,  Roger M. Maurais

IPC分类号： H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34

CPC分类号： H05K3/301 ,  H01L2224/16225 ,  H01L2924/10253 ,  H01L2924/351 ,  H01L2924/381 ,  H05K1/111 ,  H05K1/18 ,  H05K1/181 ,  H05K3/30 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/068 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/10242 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49133 ,  H01L2924/00

摘要： Reliability is improved for the mechanical electrical connection formed between a grid array device, such as a pin grid array device (PGA) or a column grid array device (CGA), and a substrate such as a printed circuit board (PCB). Between adjacent PCB pads, a spacing pattern increases toward the periphery of the CGA, creating a misalignment between pads and columns. As part of the assembly method, columns align with the pads, resulting in column tilt that increases from the center to the periphery of the CGA. An advantage of this tilt is that it reduces the amount of contractions and expansions of columns during thermal cycling, thereby increasing the projected life of CGA. Another advantage of the method is that it reduces shear stress, further increasing the projected life of the CGA.

摘要翻译： 对于诸如针阵列阵列器件（PGA）或列格栅阵列器件（CGA）的栅格阵列器件和诸如印刷电路板（PCB）的衬底之间形成的机械电连接，可靠性得到改善。 在相邻的PCB焊盘之间，间隔图案朝向CGA的周边增加，导致焊盘和柱之间的未对准。 作为组装方法的一部分，列与焊盘对准，导致从CGA的中心到外围增加的列倾斜。 这种倾斜的一个优点是在热循环期间减少了柱的收缩量和膨胀量，从而增加了CGA的预计使用寿命。 该方法的另一个优点是降低了剪切应力，进一步提高了CGA的寿命。

公开(公告)号：US09335034B2

公开(公告)日：2016-05-10

申请号：US14040578

申请日：2013-09-27

申请人： Richard Speer ,  Adam Scotch ,  Jeffery Serre ,  Sridharan Venk

发明人： Richard Speer ,  Adam Scotch ,  Jeffery Serre ,  Sridharan Venk

IPC分类号： H05K1/00 ,  F21V21/14 ,  F21K99/00 ,  H05K1/02 ,  H05K1/18 ,  H01L33/62 ,  H05K1/03 ,  H05K3/28

CPC分类号： F21V21/14 ,  F21K9/90 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0066 ,  H05K1/0281 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0145 ,  H05K2201/10106 ,  H05K2201/2009 ,  Y10T29/49133 ,  H01L2924/00014

摘要： A flexible circuit board is described that includes a flexible substrate, at least one ridge defining a flexion zone and a component mounting area. The flexion zone acting to dissipate at least a portion of a force applied to the substrate, so as to insulate the component mounting area from the force. Light sources using such flexible circuit boards and methods for making such circuit boards are also described.

摘要翻译： 描述了一种柔性电路板，其包括柔性基板，限定弯曲区域的至少一个脊和部件安装区域。 所述屈曲区用于消散施加到所述基底的力的至少一部分，以使所述部件安装区域与所述力绝缘。 还描述了使用这种柔性电路板的光源和用于制造这种电路板的方法。

公开(公告)号：US09272130B2

公开(公告)日：2016-03-01

申请号：US14529913

申请日：2014-10-31

申请人： Seiko Instruments Inc. ,  NIHON KOHDEN CORPORATION

发明人： Ryo Sugawara ,  Tomoo Kobayashi ,  Jun Motogi

IPC分类号： A61N1/00 ,  A61N1/04 ,  A61B5/05 ,  A61B5/00 ,  H05K3/30

CPC分类号： A61N1/0456 ,  A61B5/05 ,  A61B5/4005 ,  A61B5/4047 ,  A61N1/0476 ,  A61N1/0488 ,  H05K3/306 ,  Y10T29/49133

摘要： Provided are a living body stimulating electrode, a living body stimulating electrode apparatus, and a method for producing a living body stimulating electrode. The living body stimulating electrode has a flexible circuit board (FPC) between a living body stimulating electrode and a resin part. The resin part and the FPC are fixed with the living body stimulating electrode. Specifically, the flexible circuit board is disposed between the living body stimulating electrode and the resin part, and one or both of a stimulating electrode and a contact electrode constituting the living body stimulating electrode have an engaging part having a pressing part and a fixing part. The pressing part presses the flexible circuit board onto the resin part. Simultaneously, the fixing part is penetrated through a through hole formed in the flexible circuit board and pressed into a hole formed in the resin part, thereby fixed to and held by the resin part. The engaging part may be subjected to a chamfering process (the edge may be chamfered into an angulated plane or a round plane) to form an inclined plane or a curved (round) plane.

摘要翻译： 本发明提供一种活体刺激电极，活体刺激电极装置，以及生物体刺激电极的制造方法。 生物体刺激电极在生物体刺激电极和树脂部分之间具有柔性电路板（FPC）。 树脂部和FPC与活体刺激电极固定。 具体地说，柔性电路板配置在生物体刺激电极和树脂部之间，构成生物体刺激电极的刺激电极和接触电极中的一个或两个具有具有按压部和固定部的卡合部。 按压部将柔性电路板按压到树脂部上。 同时，固定部分穿过形成在柔性电路板中的通孔，并被压入形成在树脂部分中的孔中，从而固定并保持在树脂部分上。 接合部分可以进行倒角处理（边缘可以被倒角成角度平面或圆形平面）以形成倾斜平面或弯曲（圆形）平面。

公开(公告)号：US20160041136A1

公开(公告)日：2016-02-11

申请号：US14887023

申请日：2015-10-19

申请人： Entegris, Inc.

发明人： James Dietz ,  Steven E. Bishop ,  James V. McManus ,  Steven M. Lurcott ,  Michael J. Wodjenski ,  Robert Kaim ,  Frank DiMeo, JR.

IPC分类号： G01N33/00 ,  H01L21/66

CPC分类号： G01N33/00 ,  F17C11/00 ,  G01F15/063 ,  G01F22/02 ,  G01F23/0076 ,  G01M3/32 ,  G01M3/3236 ,  G06Q10/087 ,  G06Q30/04 ,  G06Q50/04 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L22/10 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24011 ,  H01L2224/2518 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19042 ,  H05K1/185 ,  H05K3/4602 ,  H05K2203/0165 ,  H05K2203/085 ,  H05K2203/1469 ,  Y02P90/30 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49165 ,  Y10T29/53183 ,  H01L2224/45099

摘要： A monitoring system for monitoring fluid in a fluid supply vessel during operation including dispensing of fluid from the fluid supply vessel. The monitoring system includes (i) one or more sensors for monitoring a characteristic of the fluid supply vessel or the fluid dispensed therefrom, (ii) a data acquisition module operatively coupled to the one or more sensors to receive monitoring data therefrom and responsively generate an output correlative to the characteristic monitored by the one or more sensors, and (iii) a processor and display operatively coupled with the data acquisition module and arranged to process the output from the data acquisition module and responsively output a graphical representation of fluid in the fluid supply vessel, billing documents, usage reports, and/or resupply requests.

摘要翻译： 一种用于在操作期间监测流体供应容器中的流体的监测系统，包括从流体供应容器分配流体。 监测系统包括（i）用于监测流体供应容器或从其分配的流体的特性的一个或多个传感器，（ii）可操作地耦合到所述一个或多个传感器以从其接收监测数据的数据采集模块，并且响应地生成 输出与由一个或多个传感器监测的特性相关联，以及（iii）处理器和显示器，其与数据采集模块可操作地耦合并被布置成处理来自数据采集模块的输出并且响应地输出流体在流体中的图形表示 供应船，记帐单，使用报告和/或补货请求。

公开(公告)号：US20150181723A1

公开(公告)日：2015-06-25

申请号：US14406544

申请日：2013-06-12

申请人： Linxens Holding

发明人： Severine Dieu-Gomont ,  Francois Lechleiter ,  Yannick Maquille

IPC分类号： H05K3/32

CPC分类号： H05K3/32 ,  H05K1/189 ,  H05K3/0017 ,  H05K3/002 ,  H05K3/06 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/10106 ,  Y10T29/49133

摘要： The invention concerns a method of producing a circuit including the step consisting of connecting, to a bottom wall of a cavity, an electronic component with or without an intermediate wired link, the method including a step prior to an etching step which consists of depositing a layer of protective material on a conductive layer in the bottom of the cavity, said material being a liquid material capable of hardening and, once hardened, resistant to the etching solution.

摘要翻译： 本发明涉及一种制造电路的方法，包括该步骤包括将空腔的底壁连接到具有或不具有中间有线链路的电子部件，所述方法包括在蚀刻步骤之前的步骤，该步骤包括： 在空腔底部的导电层上的保护材料层，所述材料是能够硬化并且一旦硬化的耐蚀刻溶液的液体材料。

公开(公告)号：US20150181720A1

公开(公告)日：2015-06-25

申请号：US14568863

申请日：2014-12-12

申请人： UNIVERSAL INSTRUMENTS CORPORATION

发明人： KOENRAAD ALEXANDER GIESKES ,  JOHN EDWARD DANEK

IPC分类号： H05K3/30 ,  B25J19/02 ,  B25J11/00

CPC分类号： H05K13/0413 ,  B23P21/00 ,  B23P21/004 ,  B25J5/02 ,  B25J11/00 ,  B25J19/02 ,  B65G35/00 ,  G01C9/06 ,  H05K13/04 ,  H05K13/0404 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/53174 ,  Y10T29/53191 ,  Y10T29/53417

摘要： An assembly machine includes a plurality of track modules, each track module including a section of track, the plurality of track modules connectable to form a continuous circuitous track, the continuous circuitous track configured to receive a dispensing head, the dispensing head configured to rotate about the continuous circuitous track and at least partially assemble an unfinished product. The machine includes a first feeder module attached to a first length of the continuous circuitous track configured to feed a component to the dispensing head, and a first placement module attached to a second length of the continuous circuitous track configured to receive the unfinished product. The dispensing head is configured to place the component on the unfinished product. The assembly machine is reconfigurable by attaching or removing one or more of the plurality of track modules, the first feeder module and the first placement module.

公开(公告)号：US20150173194A1

公开(公告)日：2015-06-18

申请号：US14108943

申请日：2013-12-17

申请人： International Business Machines Corporation

发明人： Larry G. Pymento ,  Tony C. Sass

IPC分类号： H05K1/18 ,  H05K3/30 ,  H05K1/02

CPC分类号： H05K1/181 ,  H05K1/0201 ,  H05K3/303 ,  H05K2201/0191 ,  H05K2201/09709 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10545 ,  H05K2201/10568 ,  Y02P70/611 ,  Y10T29/49133

摘要： Embodiments of the invention relates to a process and assembly for a dual sided and staggered connector arrangement on a substrate. Surface mount connector technology is employed to enable a flush connection of connector leads to the surface of the substrate. Retaining pins are provided with each connector and are sized to be received by the substrate, but not to extend through the substrate. The retaining pins are sized and configured to hold each connector in a set position, while mitigating interference with an opposing side of the PCB.

摘要翻译： 本发明的实施例涉及一种用于衬底上的双面和交错连接器布置的工艺和组件。 使用表面贴装连接器技术来实现连接器引线与基板表面的平齐连接。 保持销设置有每个连接器，并且其尺寸被设计成被衬底接收，但不延伸通过衬底。 固定销的尺寸和构造适于将每个连接器固定在设定位置，同时减轻与PCB相对侧的干扰。