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公开(公告)号：US12121858B2
公开(公告)日：2024-10-22
申请号：US16959896
申请日：2019-11-08
申请人： CATALER CORPORATION
发明人： Yuki Kido , Suguru Matsui , Etsuko Ohara , Kazuma Nakada
CPC分类号： B01D53/94 , B01J37/0228 , B05D7/24 , B05B1/18 , B05B12/26 , B05B12/32 , B05D1/02 , C23C16/45565 , H01L2224/75184 , Y10S4/903
摘要： A production method of an exhaust gas purification device includes the steps of supplying a solution containing a catalyst metal from a shower nozzle to an upper part of a honeycomb substrate, coating the honeycomb substrate with the solution, and firing the honeycomb substrate coated with the solution, wherein the shower nozzle has a plurality of discharge openings for discharging the solution and a guard which surrounds the plurality of discharge openings.
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公开(公告)号：US09613928B2
公开(公告)日：2017-04-04
申请号：US14904670
申请日：2014-07-16
发明人： Sunil Wickramanayaka
CPC分类号： H01L24/83 , H01L21/563 , H01L24/743 , H01L24/75 , H01L24/81 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/50 , H01L2224/13009 , H01L2224/13147 , H01L2224/16145 , H01L2224/27515 , H01L2224/2919 , H01L2224/32145 , H01L2224/73104 , H01L2224/73204 , H01L2224/7501 , H01L2224/75102 , H01L2224/7511 , H01L2224/75184 , H01L2224/75264 , H01L2224/753 , H01L2224/7598 , H01L2224/81002 , H01L2224/81093 , H01L2224/81097 , H01L2224/81193 , H01L2224/81209 , H01L2224/81903 , H01L2224/81907 , H01L2224/83002 , H01L2224/8309 , H01L2224/83093 , H01L2224/83097 , H01L2224/8312 , H01L2224/83193 , H01L2224/83209 , H01L2224/83855 , H01L2224/83856 , H01L2224/83862 , H01L2224/83907 , H01L2224/83911 , H01L2224/9205 , H01L2224/9211 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2225/06593 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/00014
摘要： An apparatus and a method for chip-to-wafer integration is provided. The apparatus includes a coating module, a bonding module and a cleaning module. The method includes the steps of placing at least one chip on a wafer to form an integrated product, forming a film on the integrated product, such that the integrated product is substantially fluid-tight, and exerting a predetermined positive pressure on the film during permanent bonding of the at least one chip to the wafer. The method further includes the step of removing the film from the integrated product after permanent bonding of the at least one chip to the wafer.
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3.发明授权Thermocompression bonders, methods of operating thermocompression bonders, and interconnect methods for fine pitch flip chip assembly 有权热压接合器，操作热压接合器的方法以及用于细间距倒装芯片组装的互连方法公开(公告)号：US09426898B2
公开(公告)日：2016-08-23
申请号：US14750186
申请日：2015-06-25
CPC分类号： H05K3/34 , B23K1/0016 , B23K1/203 , B23K3/04 , B23K3/082 , B23K2101/42 , H01L24/75 , H01L24/81 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16238 , H01L2224/75161 , H01L2224/75184 , H01L2224/75251 , H01L2224/75252 , H01L2224/81024 , H01L2224/81048 , H01L2224/81191 , H01L2224/81203 , H01L2224/81204 , H05K3/3489 , H05K3/3494 , H05K2201/10674 , H05K2203/04 , H01L2924/014
摘要： A thermocompression bonder is provided. The thermocompression bonder includes: a bond head including a heated bonding tool for bonding a semiconductor element to a substrate; and a flux application tool for applying a flux material to conductive contacts of the substrate prior to bonding of the semiconductor element to the substrate.
摘要翻译： 提供热压接机。 热压接机包括：接合头，其包括用于将半导体元件接合到衬底的加热焊接工具; 以及焊剂施加工具，用于在将半导体元件接合到衬底之前将焊剂材料施加到衬底的导电触点。
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公开(公告)号：US20160155720A1
公开(公告)日：2016-06-02
申请号：US14904670
申请日：2014-07-16
发明人： Sunil Wickramanayaka
IPC分类号： H01L23/00
CPC分类号： H01L24/83 , H01L21/563 , H01L24/743 , H01L24/75 , H01L24/81 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/50 , H01L2224/13009 , H01L2224/13147 , H01L2224/16145 , H01L2224/27515 , H01L2224/2919 , H01L2224/32145 , H01L2224/73104 , H01L2224/73204 , H01L2224/7501 , H01L2224/75102 , H01L2224/7511 , H01L2224/75184 , H01L2224/75264 , H01L2224/753 , H01L2224/7598 , H01L2224/81002 , H01L2224/81093 , H01L2224/81097 , H01L2224/81193 , H01L2224/81209 , H01L2224/81903 , H01L2224/81907 , H01L2224/83002 , H01L2224/8309 , H01L2224/83093 , H01L2224/83097 , H01L2224/8312 , H01L2224/83193 , H01L2224/83209 , H01L2224/83855 , H01L2224/83856 , H01L2224/83862 , H01L2224/83907 , H01L2224/83911 , H01L2224/9205 , H01L2224/9211 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2225/06593 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/00014
摘要： An apparatus and a method for chip-to-wafer integration is provided. The apparatus includes a coating module, a bonding module and a cleaning module. The method includes the steps of placing at least one chip on a wafer to form an integrated product, forming a film on the integrated product, such that the integrated product is substantially fluid-tight, and exerting a predetermined positive pressure on the film during permanent bonding of the at least one chip to the wafer. The method further includes the step of removing the film from the integrated product after permanent bonding of the at least one chip to the wafer.
摘要翻译： 提供了一种用于芯片到晶片集成的装置和方法。 该装置包括涂覆模块，粘合模块和清洁模块。 该方法包括以下步骤：将至少一个芯片放置在晶片上以形成集成的产品，在集成产品上形成膜，使得集成产品基本上是流体密封的，并且在永久性地在膜上施加预定的正压力 将至少一个芯片接合到晶片。 该方法还包括在将至少一个芯片永久地接合到晶片之后，从集成产品中去除膜的步骤。
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5.发明申请THERMOCOMPRESSION BONDERS, METHODS OF OPERATING THERMOCOMPRESSION BONDERS, AND INTERCONNECT METHODS FOR FINE PITCH FLIP CHIP ASSEMBLY 有权热变形接头，操作热转移接头的方法，以及精细切割片芯组件的互连方法公开(公告)号：US20150382480A1
公开(公告)日：2015-12-31
申请号：US14750186
申请日：2015-06-25
CPC分类号： H05K3/34 , B23K1/0016 , B23K1/203 , B23K3/04 , B23K3/082 , B23K2101/42 , H01L24/75 , H01L24/81 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16238 , H01L2224/75161 , H01L2224/75184 , H01L2224/75251 , H01L2224/75252 , H01L2224/81024 , H01L2224/81048 , H01L2224/81191 , H01L2224/81203 , H01L2224/81204 , H05K3/3489 , H05K3/3494 , H05K2201/10674 , H05K2203/04 , H01L2924/014
摘要： A thermocompression bonder is provided. The thermocompression bonder includes: a bond head including a heated bonding tool for bonding a semiconductor element to a substrate; and a flux application tool for applying a flux material to conductive contacts of the substrate prior to bonding of the semiconductor element to the substrate.
摘要翻译： 提供热压接机。 热压接机包括：接合头，其包括用于将半导体元件接合到衬底的加热焊接工具; 以及焊剂施加工具，用于在将半导体元件接合到衬底之前将焊剂材料施加到衬底的导电触点。
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