公开(公告)号：US20240326148A1

公开(公告)日：2024-10-03

申请号：US18616505

申请日：2024-03-26

申请人： Siemens Healthineers AG

发明人： Harald Geyer

IPC分类号： B23K3/08 ,  B23K1/20

CPC分类号： B23K3/082 ,  B23K1/203

摘要： An apparatus for at least partially wetting a component with a flux. The apparatus includes a flux reservoir that includes a recess that is filled with the flux. The apparatus further includes a viscosity reduction unit that is configured, when the flux reservoir is filled with flux, to reduce the viscosity of the flux at least in a localized region by excitation of the flux.

公开(公告)号：US20180185967A1

公开(公告)日：2018-07-05

申请号：US15563017

申请日：2015-03-30

申请人： Senju Metal Industry Co., Ltd.

发明人： Manabu Muraoka ,  Takeo Saitoh ,  Shigeyuki Sekine ,  Takashi Obayashi ,  Kaichi Tsuruta ,  Takashi Hagiwara ,  Hiroyuki Yamasaki ,  Kota Kikuchi ,  Naoto Kameda

IPC分类号： B23K35/02 ,  B23K35/40 ,  B23K3/08

CPC分类号： B23K35/0238 ,  B05C3/125 ,  B05C9/12 ,  B05C9/14 ,  B23K3/082 ,  B23K3/085 ,  B23K35/0233 ,  B23K35/40 ,  B23K35/404

摘要： A flux applying device for applying flux to a surface of solder, wherein the flux applying device includes: a dipping means that applies the flux to the surface of the solder by dipping the solder into the flux; a load applying means that applies a predetermined load to the solder, the load applying means being provided at a upstream side of the dipping means; a constant speed conveying means that conveys the solder at a predetermined speed with being under load by the load applying means; a drying means that dries the solder to which the flux is applied; a cooling means that cools the dried solder; a conveying speed measurement means that measures a conveying speed of the solder; and a control means that controls the conveying speed of the solder.

公开(公告)号：US20180117695A1

公开(公告)日：2018-05-03

申请号：US15795387

申请日：2017-10-27

申请人： Kulicke and Soffa Industries, Inc.

发明人： Daniel P. Buergi ,  Thomas J. Colosimo, JR. ,  Edward T. Laurent ,  Michael P. Schmidt-Lange

IPC分类号： B23K3/08 ,  B23K1/20 ,  H01L23/00

CPC分类号： B23K3/082 ,  B23K1/0016 ,  B23K1/203 ,  B23K2101/42 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/7501 ,  H01L2224/753 ,  H01L2224/755 ,  H01L2224/759 ,  H01L2224/81024 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81207

摘要： A fluxing system for a bonding machine is provided. The fluxing system includes a flux holder defining a cavity for holding flux, and a fluid source for providing a cooling fluid to cool the flux holder.

公开(公告)号：US20180052443A1

公开(公告)日：2018-02-22

申请号：US15552923

申请日：2016-02-24

申请人： INTERFLUX SINGAPORE PTE LTD

发明人： Willem Jeanne V. Van Riet ,  Erik Poortman

IPC分类号： G05B19/4065 ,  B05B12/08 ,  B23K3/08

CPC分类号： G05B19/4065 ,  B05B12/08 ,  B05B12/082 ,  B05B13/041 ,  B05B15/40 ,  B05B15/55 ,  B23K3/082 ,  G05B2219/45235 ,  H05K3/3489 ,  H05K2203/0746

摘要： A control system for a fluxer, the control system comprising: a variable speed pump configured to provide pressurised flow of liquid flux from a flux supply tank; a pulse-width-modulated (PWM) valve coupled to the variable speed pump; a jet nozzle coupled to the PWM valve and configured to eject a jet of flux drops onto a substrate to form flux points, lines or areas thereon; and a controller coupled to the variable speed pump and the PWM valve; wherein the controller is configured to generate PWM signals to control the PWM valve, and pump speed signals to control the variable speed pump, to thereby selectively and individually control volume of individual flux drops, and pressure and flow of the liquid flux, to form the flux points, lines or areas on the substrate.

公开(公告)号：US20170189981A1

公开(公告)日：2017-07-06

申请号：US15281687

申请日：2016-09-30

申请人： ERSA GmbH

发明人： Rainer KURTZ ,  Michael Schaefer

IPC分类号： B23K3/06 ,  H05K13/04 ,  B23K3/08

CPC分类号： B23K3/0638 ,  B23K1/085 ,  B23K3/0653 ,  B23K3/082 ,  B23K2101/42 ,  H05K3/34 ,  H05K13/0465

摘要： A soldering module for a soldering system for selective wave soldering, having at least one first and one second solder pot, wherein the solder pots are displaceable along an x-axis by means of an x-axis drive, along a y-axis by means of a y-axis drive, and along a z-axis by means of a z-axis drive, wherein the axes are all arranged orthogonally in relation to each other; wherein two y-axis drives and two moving devices are provided on which the solder pots are displaceable along the y-axis by means of the y-axis drives; wherein a first moving device is associated with the first solder pot, and wherein a second moving device which is different from the first moving device is associated with the second solder pot.

公开(公告)号：US20170127532A1

公开(公告)日：2017-05-04

申请号：US14931056

申请日：2015-11-03

申请人： GM GLOBAL TECHNOLOGY OPERATIONS LLC

发明人： Nicholas W. Pinto, IV ,  Nancy L. Johnson ,  Nicholas P. Irish ,  Michael P. Balogh ,  Daad B. Haddad

IPC分类号： H05K3/34 ,  B23K35/362 ,  B23K35/36 ,  B23K1/19 ,  B23K1/20

CPC分类号： H05K3/3489 ,  B23K1/0016 ,  B23K1/19 ,  B23K1/203 ,  B23K3/025 ,  B23K3/027 ,  B23K3/047 ,  B23K3/082 ,  B23K35/3605 ,  B23K35/362 ,  B23K2101/42 ,  B23K2103/14 ,  B23K2103/18 ,  B23K2103/26 ,  H05K3/341 ,  H05K3/3457 ,  H05K2201/10287

摘要： A method of soldering a shape memory alloy (SMA) element to a component includes positioning a tinned end of the SMA element with respect to a surface of the component, and then directly soldering the tinned end to the surface using solder material having a low liquidus temperature of 500° F. or less when an oxide layer is not present on the SMA element. The end may be soldered using lead-based solder material at a higher temperature when an oxide layer is present. The end may be tinned with flux material containing phosphoric acid or tin fluoride prior to soldering the SMA element. The SMA element may be submersed in an acid bath to remove the oxide layer. The solder material may contain tin and silver, antimony, or zinc, or other materials sufficient for achieving the low liquidus temperature. Heat penetrating the SMA element is controlled to protect shape memory abilities.

公开(公告)号：US09485872B2

公开(公告)日：2016-11-01

申请号：US14654956

申请日：2013-12-20

申请人： Senju Metal Industry Co., Ltd.

发明人： Tsutomu Hiyama

IPC分类号： B23K37/00 ,  H05K3/34 ,  B23K1/008 ,  B23K3/04 ,  B23K1/00 ,  B23K3/08 ,  B23K1/012

CPC分类号： H05K3/3494 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/012 ,  B23K3/04 ,  B23K3/082 ,  B23K2101/42 ,  H05K2203/04 ,  H05K2203/081

摘要： In a gas-blowing-hole array structure, which enables gas to be blown to the whole surface of the conveyed member such as a printed circuit board, a semiconductor wafer or the like almost concentrically and allows the whole surface of conveyed member to be very uniformly heated or cooled, a nozzle pattern P2 of blowing nozzles 2 is arranged to be line symmetry with a nozzle pattern P1 of the blowing nozzles 2 in upper and lower divided sections of one side of the nozzle cover 3 relative to a center portion thereof that is orthogonal to a conveying direction, as shown in FIG. 1. In order for the arrangement patterns diagonally arranged in the nozzle cover 3 to become identical, the nozzle pattern P1 is arranged to be line symmetry with the nozzle pattern P2 of the blowing nozzles 2 in upper and lower divided sections of the other side of the nozzle cover 3.

摘要翻译： 在气体吹出孔阵列结构中，能够将气体吹送到诸如印刷电路板，半导体晶片等的输送部件的整个表面，几乎同心地被吹送，并且允许被输送部件的整个表面非常 均匀地加热或冷却，喷嘴2的喷嘴图案P2被布置成与喷嘴盖3的一侧的上分离部分和下分割部分相对于其中心部分与喷嘴2的喷嘴图案P1线对称， 与输送方向正交，如图1所示。 为了使喷嘴盖3中对角地配置的排列图形变得相同，喷嘴图案P1配置成与喷嘴2的喷嘴图案P2在另一侧的上下分割部分的线对称 喷嘴盖3。

公开(公告)号：US09452486B2

公开(公告)日：2016-09-27

申请号：US13586429

申请日：2012-08-15

申请人： Timothy Andrecheck ,  Luis F. Avila ,  Jeffrey L. Jones

发明人： Timothy Andrecheck ,  Luis F. Avila ,  Jeffrey L. Jones

IPC分类号： B23K1/00 ,  B23K1/20 ,  B23K3/08

CPC分类号： B23K1/0012 ,  B23K1/203 ,  B23K3/082

摘要： An automatic fluxing machine is provided and includes a dispensing section including a surface having through holes formed therein through which flux material is dispensable toward a braze joint and a plugging section disposed below the braze joint to prevent downward flow of dispensed flux material.

摘要翻译： 提供了一种自动熔化机，包括一个分配部分，该分配部分包括一个表面，该表面具有形成在其中的通孔，通过该表面焊剂材料可分配给钎焊接头;以及插入部分，设置在钎焊接头下方，以防止分配的焊剂材料向下流动。

公开(公告)号：US09373603B2

公开(公告)日：2016-06-21

申请号：US14194057

申请日：2014-02-28

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Ai-Tee Ang ,  Hsiu-Jen Lin ,  Cheng-Ting Chen ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC分类号： H01L21/50 ,  H01L23/00 ,  B23K1/00 ,  B23K1/20 ,  B23K3/04 ,  B23K3/08 ,  H01L25/10 ,  H01L25/00

CPC分类号： H01L24/75 ,  B23K1/0016 ,  B23K1/203 ,  B23K3/04 ,  B23K3/082 ,  H01L24/13 ,  H01L24/16 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/2101 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/75101 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75283 ,  H01L2224/755 ,  H01L2224/7565 ,  H01L2224/759 ,  H01L2224/7598 ,  H01L2224/81065 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/812 ,  H01L2224/8121 ,  H01L2224/8123 ,  H01L2224/81815 ,  H01L2224/95 ,  H01L2924/01007 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/2026 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/75

摘要： Reflow processes and apparatuses are disclosed. A process includes enclosing a package workpiece in an enclosed environment of a chamber of a reflow tool; causing an oxygen content of the enclosed environment of the chamber to be less than 40 ppm; and performing a reflow process in the enclosed environment of the chamber while the oxygen content is less than 40 ppm. An apparatus includes a reflow chamber, a door to the reflow chamber, an energy source in the reflow chamber, and gas supply equipment coupled to the chamber. The door is operable to enclose an environment in the reflow chamber. The energy source is operable to increase a temperature in the environment in the reflow chamber. The gas supply equipment is operable to provide a gas to the reflow chamber.

摘要翻译： 公开了回流处理和装置。 一种方法包括将包装工件封闭在回流工具的室的封闭环境中; 导致室的封闭环境的氧含量小于40ppm; 并且在氧气含量小于40ppm时，在室的封闭环境中进行回流处理。 一种装置包括回流室，回流室的门，回流室中的能量源，以及耦合到该室的气体供应设备。 门可操作以将环境包围在回流室中。 能量源可操作以增加回流室中环境中的温度。 气体供应设备可操作以向回流室提供气体。

公开(公告)号：US09289841B2

公开(公告)日：2016-03-22

申请号：US14004204

申请日：2012-04-16

申请人： Katsumori Taniguro

发明人： Katsumori Taniguro

IPC分类号： B23K31/02 ,  B23K3/06 ,  B23K1/08 ,  B23K1/20 ,  B23K35/26 ,  H05K3/28 ,  H05K3/34 ,  B23K3/08 ,  B23K1/00 ,  H01L23/00 ,  H05K3/00

CPC分类号： B23K3/0607 ,  B23K1/0016 ,  B23K1/08 ,  B23K1/20 ,  B23K1/203 ,  B23K3/0646 ,  B23K3/0669 ,  B23K3/082 ,  B23K35/262 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/741 ,  H01L24/742 ,  H01L2224/03312 ,  H01L2224/03418 ,  H01L2224/036 ,  H01L2224/0381 ,  H01L2224/03821 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05111 ,  H01L2224/05147 ,  H01L2224/05582 ,  H01L2224/05611 ,  H01L2224/05647 ,  H01L2224/0569 ,  H01L2224/11312 ,  H01L2224/116 ,  H01L2224/11821 ,  H01L2224/13111 ,  H01L2224/1369 ,  H01L2224/741 ,  H01L2924/381 ,  H05K3/0085 ,  H05K3/282 ,  H05K3/3468 ,  H05K2203/081 ,  H05K2203/122 ,  H05K2203/1366 ,  H05K2203/1518 ,  Y10T428/31678 ,  H01L2224/1141 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01083 ,  H01L2924/0103 ,  H01L2924/01051 ,  H01L2224/03

摘要： Provided are a soldering device and method which allow for soldering at low cost with high yield and high reliability. To solve the above problems, the soldering device has: a first processing section that immerses workpiece member 10 having copper electrode 2 in organic fatty acid-containing solution, and horizontally move immersed workpiece member 10 in organic fatty acid-containing solution 31; a second processing section having ejection unit 33 to spray a jet stream of molten solder 5a to workpiece member 10 while pulling out workpiece member 10 processed in the first processing section to space section 24 that has a pressurized steam atmosphere and is provided above organic fatty acid-containing solution 31; a third processing section having ejection unit 34 to spray organic fatty acid-containing solution 31 to excess molten solder 5a on workpiece member 10 for removal while pulling down workpiece member 10 processed in the second processing section after horizontally moving in space section 24; and a fourth processing section that picks up workpiece member 10 processed in the third processing section by pulling out from organic fatty acid-containing solution 31 after horizontally moving in organic fatty acid-containing solution 31.

摘要翻译： 提供了一种以高成本和高可靠性以低成本实现焊接的焊接装置和方法。 为了解决上述问题，焊接装置具有：将具有铜电极2的工件10浸渍在含有有机脂肪酸的溶液中的水平移动浸渍的有机脂肪酸溶液31中的工件10的第一处理部; 第二处理部分具有喷射单元33，以将熔融焊料5a的喷射流喷射到工件10上，同时将在第一处理部分中加工的工件10拉出到具有加压蒸汽气氛的空间部分24并且设置在有机脂肪酸之上 含有溶液31; 具有喷射单元34的喷射单元34，用于在空间部24中水平移动之后，将在第二处理部中处理的工件10拉下的同时，将含有机脂肪酸的溶液31喷射到工件10上的多余的熔融焊料5a以进行除去; 以及第四处理部，其通过在含有有机脂肪酸的溶液31中水平移动之后从含有机脂肪酸的溶液31中拉出而拾取在第三处理部中处理的工件10。