公开(公告)号：US20160271715A1

公开(公告)日：2016-09-22

申请号：US14392168

申请日：2013-06-26

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Kaichi Tsuruta ,  Takeo Saito ,  Manabu Muraoka ,  Hiroki Oshima

IPC: B23K3/06 ,  B23K1/00

Abstract: A solder-ball-supplying method, a solder-ball-supplying device and a solder-bump-forming method, which are flux-less and capable of being also applied to electrodes having a fine pitch. A substrate on which a resist with openings is positioned on electrode(s), which has a diameter of 10 through 30 μm, of the substrate is prepared. Next, plural solder balls SBL each having a grain diameter of 1 through 10 μm are shaken down to the opening(s) of the resist from a hopper and filled therein. Next, by sliding and moving a squeegee on an upper surface of the resist along X-Y direction, the solder balls SBL shaken down to the resist other than the openings are scrapped and removed and the solder balls SBL in the openings and around them are pushed into the openings by the squeegee.

Abstract translation: 焊球提供方法，焊球供给装置和焊料凸块形成方法，其无磁通，并且也可以应用于具有细间距的电极。 制备其上具有开口的抗蚀剂位于基板的直径为10至30μm的电极上的基板。 接下来，将具有1〜10μm的粒径的多个焊球SBL从料斗中摇动到抗蚀剂的开口部并填充。 接下来，通过沿着XY方向滑动并移动抗蚀剂的上表面上的刮板，将焊球SBL摇动到除了开口之外的抗蚀剂被废弃和去除，并且将开口周围的焊球SBL推入 橡皮刮板的开口。

公开(公告)号：US20160254103A1

公开(公告)日：2016-09-01

申请号：US15151088

申请日：2016-05-10

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Katsuji Nakamura ,  Kaichi Tsuruta ,  Yuji Ozaki ,  Shigeaki Watarai ,  Hidenori Takagi ,  Yutaka Ohori

IPC: H01G11/50 ,  H01M2/26 ,  C25D3/22 ,  C25D3/30 ,  C25D3/56 ,  H01G11/30 ,  C25D3/12 ,  C23C18/16 ,  C23C18/31 ,  C23C18/32 ,  C23C18/48 ,  H01G11/06 ,  C25D5/12 ,  C25D3/60

CPC classification number: H01G11/50 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1827 ,  C23C18/31 ,  C23C18/32 ,  C23C18/36 ,  C23C18/48 ,  C23C18/52 ,  C23C18/54 ,  C25D3/12 ,  C25D3/22 ,  C25D3/30 ,  C25D3/565 ,  C25D3/60 ,  C25D5/12 ,  C25D5/44 ,  H01B1/023 ,  H01B13/32 ,  H01G11/06 ,  H01G11/24 ,  H01G11/30 ,  H01G11/66 ,  H01M2/202 ,  H01M2/26 ,  H01M2/30 ,  H01M2004/028 ,  Y02E60/13 ,  Y10T29/49147

Abstract: An electrode for an energy storage device including a Zn layer or Zn alloy layer, a Ni layer, and a Sn layer or Sn alloy layer formed by plating on a connecting terminal part of a positive electrode composed of Al so that the resistance value at the contacting point is reduced and the voltage of the energy storage device can be effectively supplied without any drop. Accordingly, this electrode can be soldered to a Cu negative electrode, which is composed of metal that is different species from Al, through a Sn layer or a Sn alloy layer so that jointing strength of the Al positive electrode and the Cu negative electrode can be enhanced. The contacting area is increased in comparison with the conventional jointing by spot-welding or conventional fastening by a bolt so that the resistance value at the contacting point is reduced.

Abstract translation: 1.一种蓄电装置用电极，其特征在于，包括Zn层或Zn合金层，Ni层以及通过电镀在由Al构成的正极的连接端子部分上形成的Sn层或Sn合金层， 接触点减小，并且可以有效地提供能量存储装置的电压而没有任何下落。 因此，该电极可以通过Sn层或Sn合金层焊接到由与Al不同的金属构成的Cu负极上，使得Al正极和Cu负极的接合强度可以 增强。 与通过点焊的常规接合或通过螺栓的常规紧固相比，接触面积增加，使得接触点处的电阻值降低。

公开(公告)号：US10780531B2

公开(公告)日：2020-09-22

申请号：US16677011

申请日：2019-11-07

Applicant: Senju Metal Industry Co., Ltd.

Inventor： Hiroyoshi Kawasaki ,  Yuri Nakamura ,  Osamu Munekata ,  Kaichi Tsuruta

IPC: B23K35/00 ,  B23K35/26 ,  C22C13/00 ,  B23K35/02 ,  B23K101/42 ,  H01L23/00

Abstract: A solder ball includes 0.1% by mass or more and 10% by mass or less of In and a remainder of Sn. The ball has a yellowness (b*) in an L*a*b* color system of 2.8 or more and 15.0 or less and a lightness (L*) of 60 or more and 100 or less. The ball further includes at least one element selected from a group of 0% by mass or more and 4% by mass or less of Ag, 0% by mass or more and 1.0% by mass or less of Cu, 0% to 3% by mass in total of Bi and/or Sb, and 0% to 0.1% by mass in total of an element selected from a group of Ni, Co, Fe, Ge, and P, excluding a solder ball including 3% by mass of Ag, 0.5% by mass of Cu, 0.2% by mass of In and a remainder of Sn.

公开(公告)号：US10391589B2

公开(公告)日：2019-08-27

申请号：US15563017

申请日：2015-03-30

Applicant: Senju Metal Industry Co., Ltd.

Inventor： Manabu Muraoka ,  Takeo Saitoh ,  Shigeyuki Sekine ,  Takashi Obayashi ,  Kaichi Tsuruta ,  Takashi Hagiwara ,  Hiroyuki Yamasaki ,  Kota Kikuchi ,  Naoto Kameda

IPC: B23K3/00 ,  B23K35/02 ,  B23K35/40 ,  B23K3/08 ,  B05C3/12 ,  B05C9/14 ,  B05C9/12

Abstract: A flux applying device for applying flux to a surface of solder, wherein the flux applying device includes: a dipping means that applies the flux to the surface of the solder by dipping the solder into the flux; a load applying means that applies a predetermined load to the solder, the load applying means being provided at a upstream side of the dipping means; a constant speed conveying means that conveys the solder at a predetermined speed with being under load by the load applying means; a drying means that dries the solder to which the flux is applied; a cooling means that cools the dried solder; a conveying speed measurement means that measures a conveying speed of the solder; and a control means that controls the conveying speed of the solder.

公开(公告)号：US20180185967A1

公开(公告)日：2018-07-05

申请号：US15563017

申请日：2015-03-30

Applicant: Senju Metal Industry Co., Ltd.

Inventor： Manabu Muraoka ,  Takeo Saitoh ,  Shigeyuki Sekine ,  Takashi Obayashi ,  Kaichi Tsuruta ,  Takashi Hagiwara ,  Hiroyuki Yamasaki ,  Kota Kikuchi ,  Naoto Kameda

IPC: B23K35/02 ,  B23K35/40 ,  B23K3/08

CPC classification number: B23K35/0238 ,  B05C3/125 ,  B05C9/12 ,  B05C9/14 ,  B23K3/082 ,  B23K3/085 ,  B23K35/0233 ,  B23K35/40 ,  B23K35/404

Abstract: A flux applying device for applying flux to a surface of solder, wherein the flux applying device includes: a dipping means that applies the flux to the surface of the solder by dipping the solder into the flux; a load applying means that applies a predetermined load to the solder, the load applying means being provided at a upstream side of the dipping means; a constant speed conveying means that conveys the solder at a predetermined speed with being under load by the load applying means; a drying means that dries the solder to which the flux is applied; a cooling means that cools the dried solder; a conveying speed measurement means that measures a conveying speed of the solder; and a control means that controls the conveying speed of the solder.

公开(公告)号：US20170354042A1

公开(公告)日：2017-12-07

申请号：US15539341

申请日：2015-12-21

Applicant: Senju Metal Industry Co., Ltd. ,  NITTA CORPORATION

Inventor： Kaichi Tsuruta ,  Takeo Saitoh ,  Manabu Muraoka ,  Hiroki Oshima ,  Koji Yamashita ,  Shinichiro Kawahara

IPC: H05K3/34 ,  H01L23/492 ,  H01L21/60 ,  C09J201/02 ,  C09J11/04 ,  C09J7/02

CPC classification number: H05K3/3457 ,  C08K3/10 ,  C09J7/30 ,  C09J11/04 ,  C09J201/02 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2467/006 ,  H01L23/4928 ,  H01L2021/60015 ,  H05K3/321 ,  H05K3/34 ,  H05K3/341 ,  H05K3/3478

Abstract: Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheet 1A includes a base material 5, an adhesive layer 4 formed on the surface of the base material 5, a solder powder-containing adhesive layer 3 formed on the surface of the adhesive layer 4, and a solder powder layer 2 formed on the surface of the solder powder-containing adhesive layer 3. In the solder powder layer 2, particles of solder powder 20 are arranged in a one-layer sheet form. In the solder powder-containing adhesive layer 3, solder powder 30 and an adhesive component 31 are mixed so as to have such a thickness that two or more layers of the solder powder 30 are stacked.

公开(公告)号：US11712760B2

公开(公告)日：2023-08-01

申请号：US17793866

申请日：2021-03-19

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Naoto Kameda ,  Masato Tsuchiya ,  Katsuji Nakamura ,  Osamu Munekata ,  Kaichi Tsuruta

IPC: B23K35/02 ,  B23K35/26 ,  B32B15/01 ,  H01L23/367 ,  H01L23/00 ,  B23K101/40

CPC classification number: B23K35/0238 ,  B23K35/262 ,  B32B15/01 ,  H01L23/3672 ,  H01L24/29 ,  H01L24/32 ,  B23K2101/40 ,  B32B2307/732 ,  H01L2224/2908 ,  H01L2224/2918 ,  H01L2224/29111 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29184 ,  H01L2224/32225

Abstract: In a layered bonding material 10, a coefficient of linear expansion of a base material 11 is 5.5 to 15.5 ppm/K and a first surface and a second surface of the base material 11 are coated with pieces of lead-free solder 12a and 12b.

公开(公告)号：US10722965B2

公开(公告)日：2020-07-28

申请号：US14392168

申请日：2013-06-26

Applicant: Senju Metal Industry Co., Ltd.

Inventor： Kaichi Tsuruta ,  Takeo Saito ,  Manabu Muraoka ,  Hiroki Oshima

IPC: B23K3/06 ,  B23K1/00

Abstract: A solder-ball-supplying method, a solder-ball-supplying device and a solder-bump-forming method, which are flux-less and capable of being also applied to electrodes having a fine pitch. A substrate on which a resist with openings is positioned on electrode(s), which has a diameter of 10 through 30 μm, of the substrate is prepared. Next, plural solder balls SBL each having a grain diameter of 1 through 10 μm are shaken down to the opening(s) of the resist from a hopper and filled therein. Next, by sliding and moving a squeegee on an upper surface of the resist along X-Y direction, the solder balls SBL shaken down to the resist other than the openings are scrapped and removed and the solder balls SBL in the openings and around them are pushed into the openings by the squeegee.

公开(公告)号：US10675719B2

公开(公告)日：2020-06-09

申请号：US15539323

申请日：2015-12-24

Applicant: Senju Metal Industry Co., Ltd.

Inventor： Hiroyoshi Kawasaki ,  Shigeki Kondo ,  Atsushi Ikeda ,  Takahiro Roppongi ,  Takashi Hagiwara ,  Daisuke Soma ,  Kaichi Tsuruta ,  Isamu Sato ,  Yuji Kawamata

IPC: B23K35/00 ,  B23K35/26 ,  C22C13/00 ,  C25D3/60 ,  B23K35/22 ,  B23K35/02 ,  B23K1/00 ,  C25D3/56 ,  C22C9/00 ,  C25D3/32 ,  B23K3/06 ,  C25D3/18 ,  C25D7/00 ,  B22F1/02 ,  B22F9/08 ,  B23K35/30 ,  C23C18/32 ,  C25D5/10 ,  C25D5/12 ,  C25D5/18

Abstract: Provided herein is a solder material that includes a spherical core that provides space between a joint object and another object to be joined to the joint object and a solder coated layer that has a melting point at which a core layer of the core is not melted. The solder coated layer includes Sn as a main ingredient and 0 to 2 mass % of Ag, and coats the core. The solder coated layer has an average grain diameter of crystal grains of 3 μm or less, and the solder material has a spherical diameter of 1 to 230 μm and a sphericity of 0.95 or more.

公开(公告)号：US20190358752A1

公开(公告)日：2019-11-28

申请号：US16419294

申请日：2019-05-22

Applicant: Senju Metal Industry Co., Ltd.

Inventor： Hiroki Oshima ,  Takeo Saitoh ,  Takahiro Nishizaki ,  Tomohisa Kawanago ,  Masato Shiratori ,  Kaichi Tsuruta

IPC: B23K35/26 ,  H05K3/34 ,  B23K35/30

Abstract: A solder ball according to the present invention contains 0.2 to 2.2% by mass of Zn, and a balance of Sn, and has a spherical diameter of 0.1 to 120 μm and a yellowness (b*) in an L*a*b* color system of 2.70 or more and 9.52 or less. An oxide film is formed by performing aging treatment. By producing a solder ball having a yellowness of 2.70 or more and 9.52 or less, it is possible to suppress the growth of a Cu3Sn layer and/or a Cu—Zn(—Sn) layer during joining.