Solder Ball Supplying Method, Solder Ball Supplying Device, and Solder Bump Forming Method
    2.
    发明申请
    Solder Ball Supplying Method, Solder Ball Supplying Device, and Solder Bump Forming Method 审中-公开
    焊球供料方式,焊球供料装置和焊接凸块成型方法

    公开(公告)号:US20160271715A1

    公开(公告)日:2016-09-22

    申请号:US14392168

    申请日:2013-06-26

    IPC分类号: B23K3/06 B23K1/00

    摘要: A solder-ball-supplying method, a solder-ball-supplying device and a solder-bump-forming method, which are flux-less and capable of being also applied to electrodes having a fine pitch. A substrate on which a resist with openings is positioned on electrode(s), which has a diameter of 10 through 30 μm, of the substrate is prepared. Next, plural solder balls SBL each having a grain diameter of 1 through 10 μm are shaken down to the opening(s) of the resist from a hopper and filled therein. Next, by sliding and moving a squeegee on an upper surface of the resist along X-Y direction, the solder balls SBL shaken down to the resist other than the openings are scrapped and removed and the solder balls SBL in the openings and around them are pushed into the openings by the squeegee.

    摘要翻译: 焊球提供方法,焊球供给装置和焊料凸块形成方法,其无磁通,并且也可以应用于具有细间距的电极。 制备其上具有开口的抗蚀剂位于基板的直径为10至30μm的电极上的基板。 接下来,将具有1〜10μm的粒径的多个焊球SBL从料斗中摇动到抗蚀剂的开口部并填充。 接下来,通过沿着XY方向滑动并移动抗蚀剂的上表面上的刮板,将焊球SBL摇动到除了开口之外的抗蚀剂被废弃和去除,并且将开口周围的焊球SBL推入 橡皮刮板的开口。

    SOLDER TRANSFER SHEET
    5.
    发明申请
    SOLDER TRANSFER SHEET 审中-公开
    卖方转让表

    公开(公告)号:US20160250719A1

    公开(公告)日:2016-09-01

    申请号:US15033963

    申请日:2014-11-05

    摘要: The present solder transfer sheet addresses the issue of providing a solder transfer sheet having both solder powder holding properties and sheet releasing properties and having excellent solder transfer properties. This solder transfer sheet is for soldering in a section to be soldered in a circuit substrate and has: a support base material; an adhesive layer provided on at least one surface of the support base material; and at least one solder layer including solder particles, provided upon the adhesive layer. The adhesive layer contains a side-chain crystalline polymer, exhibits viscosity by having fluidity at at least the melting point of the side-chain crystalline polymer, and decreases viscosity by crystalizing at temperatures less than the melting point of the side-chain crystalline polymer.

    摘要翻译: 本发明的焊料转印片解决了提供具有焊料粉末保持性和剥离性能以及焊料转移性优异的焊料转印片的问题。 该焊料转移片用于在要焊接在电路基板中的部分中进行焊接,并具有:支撑基材; 设置在所述支撑基材的至少一个表面上的粘合层; 以及设置在粘合剂层上的包括焊料颗粒的至少一个焊料层。 粘合剂层包含侧链结晶聚合物,通过在侧链结晶聚合物的至少熔点具有流动性而显示粘度,并且通过在低于侧链结晶聚合物的熔点的温度下结晶而降低粘度。

    Solder ball supplying method, solder ball supplying device, and solder bump forming method

    公开(公告)号:US10722965B2

    公开(公告)日:2020-07-28

    申请号:US14392168

    申请日:2013-06-26

    IPC分类号: B23K3/06 B23K1/00

    摘要: A solder-ball-supplying method, a solder-ball-supplying device and a solder-bump-forming method, which are flux-less and capable of being also applied to electrodes having a fine pitch. A substrate on which a resist with openings is positioned on electrode(s), which has a diameter of 10 through 30 μm, of the substrate is prepared. Next, plural solder balls SBL each having a grain diameter of 1 through 10 μm are shaken down to the opening(s) of the resist from a hopper and filled therein. Next, by sliding and moving a squeegee on an upper surface of the resist along X-Y direction, the solder balls SBL shaken down to the resist other than the openings are scrapped and removed and the solder balls SBL in the openings and around them are pushed into the openings by the squeegee.