公开(公告)号：US09788425B2

公开(公告)日：2017-10-10

申请号：US14958031

申请日：2015-12-03

申请人： VIA Alliance Semiconductor Co., Ltd.

发明人： Nai-Shung Chang ,  Wen-Yuan Chang ,  Kuo-Ying Tsai

IPC分类号： H05K1/11 ,  H05K1/14 ,  H01L25/00 ,  H05K1/02 ,  H05K3/34

CPC分类号： H05K1/111 ,  H01L25/00 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0204 ,  H05K1/141 ,  H05K1/144 ,  H05K3/3436 ,  H05K2201/09381 ,  H05K2201/10992 ,  Y02P70/611 ,  H01L2924/00012

摘要： An electronic package assembly is provided. The electronic package assembly includes a package substrate having a first surface and a second surface opposite thereto. A plurality of conductive pads is disposed on the first surface. A chip is mounted onto the first surface of the package substrate. A circuit board is mounted onto the second surface of the package substrate, and includes an electrical connector. A plurality of electrical contact components is electrically connected to the electrical connector and is in contact with the plurality of conductive pads.

公开(公告)号：US09669493B2

公开(公告)日：2017-06-06

申请号：US14648031

申请日：2013-11-18

申请人： Senju Metal Industry Co., Ltd.

发明人： Koji Watanabe ,  Minoru Toyoda ,  Satoshi Tomita ,  Tsutomu Sugino ,  Daichi Kikuchi ,  Hiroki Oshima

IPC分类号： B23K35/00 ,  B23K35/14 ,  B23K35/02 ,  B23K35/28 ,  B23K1/00 ,  B23K1/19 ,  C22C12/00 ,  B32B15/01 ,  B23K35/26 ,  B23K35/40 ,  C22C1/00 ,  C22C11/06 ,  C22C13/00 ,  C22C13/02 ,  C22C21/14 ,  H05K3/34 ,  B23K101/42

CPC分类号： B23K35/0238 ,  B23K1/0016 ,  B23K1/19 ,  B23K35/0222 ,  B23K35/0233 ,  B23K35/26 ,  B23K35/262 ,  B23K35/268 ,  B23K35/28 ,  B23K35/40 ,  B23K2101/42 ,  B32B15/01 ,  B32B15/018 ,  C22C1/00 ,  C22C11/06 ,  C22C12/00 ,  C22C13/00 ,  C22C13/02 ,  C22C21/14 ,  H05K3/3463 ,  H05K2201/10992 ,  H05K2203/0405 ,  H05K2203/12 ,  Y10T428/12986

摘要： When soldering a package having an electrode on which Ni/Au or Ag—Pd alloy is plated, to a printed circuit board having a Cu electrode or an electrode on which Cu is plated, a solid-phase diffusion layer is formed within a layered solder material for bonding different species of electrodes. The layered solder material is composed of a solder material of Sn—Ag—Cu series or Sn—Sb series and a solder material of Sn—Ag—Cu—Ni series or Sn—Pb series. The electrode on which Ni/Au or Ag—Pd alloy is plated and the Cu electrode or the electrode on which Cu is plated are soldered with the solder material of Sn—Ag—Cu series or Sn—Sb series being attached to the Cu electrode and the solder material of Sn—Ag—Cu—Ni series or Sn—Cu series being attached to the electrode on which Ni/Au or Ag—Pd alloy is plated. This restrains formation of intermetallic compounds and provides high bonding reliability.

公开(公告)号：US09516770B2

公开(公告)日：2016-12-06

申请号：US14416375

申请日：2013-10-29

申请人： KYOCERA Corporation

发明人： Tsuyoshi Kanchiku

IPC分类号： H05K7/02 ,  H05K5/02 ,  H01R13/405 ,  H01L23/10 ,  H05K5/06 ,  H01L23/057

CPC分类号： H05K5/0217 ,  H01L23/057 ,  H01L23/10 ,  H01L2924/0002 ,  H01R13/405 ,  H05K5/069 ,  H05K2201/10984 ,  H05K2201/10992 ,  H01L2924/00

摘要： An electronic component housing container includes a container body housing an electronic component inside a cavity constituted by a bottom plate and a side wall which surrounds a center region of the bottom plate, and an input-output terminal. The input-output terminal includes an insulation member, a pin terminal, and a ring-like member. The insulation member is bonded to a periphery of an opening of a through hole provided in the side wall so as to close the through hole. The pin terminal has a flange portion protruding from an outer peripheral surface thereof, and is pierced through the insulation member. The flange portion is bonded to the insulation member. The ring-like member is bonded to the outer peripheral surface of the pin terminal and to the insulation member, on an opposite side to a surface of the insulation member to which the flange portion is bonded.

摘要翻译： 电子部件容纳容器包括：容纳体，其容纳由底板和围绕底板的中心区域的侧壁构成的空腔内的电子部件;以及输入输出端子。 输入输出端子包括绝缘构件，销端子和环状构件。 绝缘构件结合到设置在侧壁中的通孔的开口的周边，以闭合通孔。 销端子具有从其外周面突出的凸缘部，并穿过绝缘部件。 凸缘部分结合到绝缘构件。 所述环状构件在与所述凸缘部接合的所述绝缘构件的表面相反的一侧，与所述销端子的外周面和所述绝缘构件接合。

公开(公告)号：US09084377B2

公开(公告)日：2015-07-14

申请号：US11694913

申请日：2007-03-30

申请人： Seng Guan Chow

发明人： Seng Guan Chow

IPC分类号： H05K3/34 ,  H05K3/28 ,  H05K1/11 ,  H05K3/12 ,  H05K3/40

CPC分类号： H05K3/284 ,  H01L2224/32225 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/19105 ,  H05K1/111 ,  H05K3/1216 ,  H05K3/3442 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/3484 ,  H05K3/4007 ,  H05K2201/035 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/10636 ,  H05K2201/10992 ,  H05K2203/043 ,  H05K2203/1476 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00

摘要： An integrated circuit package system is provided including providing a substrate having a contact pad, forming a first conductor having a first melting point over the contact pad, forming a second conductor having a second melting point over the first conductor with the first melting point higher than the second melting point, and mounting a first device over the second conductor.

摘要翻译： 提供了一种集成电路封装系统，包括提供具有接触焊盘的衬底，形成在接触焊盘上具有第一熔点的第一导体，在第一导体上形成具有第二熔点的第二导体，第一熔点高于 第二熔点，并且将第一装置安装在第二导体上。

公开(公告)号：US20150189775A1

公开(公告)日：2015-07-02

申请号：US14416375

申请日：2013-10-29

申请人： KYOCERA Corporation

发明人： Tsuyoshi Kanchiku

IPC分类号： H05K5/02

CPC分类号： H05K5/0217 ,  H01L23/057 ,  H01L23/10 ,  H01L2924/0002 ,  H01R13/405 ,  H05K5/069 ,  H05K2201/10984 ,  H05K2201/10992 ,  H01L2924/00

摘要： An electronic component housing container includes a container body housing an electronic component inside a cavity constituted by a bottom plate and a side wall which surrounds a center region of the bottom plate, and an input-output terminal. The input-output terminal includes an insulation member, a pin terminal, and a ring-like member. The insulation member is bonded to a periphery of an opening of a through hole provided in the side wall so as to close the through hole. The pin terminal has a flange portion protruding from an outer peripheral surface thereof, and is pierced through the insulation member. The flange portion is bonded to the insulation member. The ring-like member is bonded to the outer peripheral surface of the pin terminal and to the insulation member, on an opposite side to a surface of the insulation member to which the flange portion is bonded.

摘要翻译： 电子部件容纳容器包括：容纳体，其容纳由底板和围绕底板的中心区域的侧壁构成的空腔内的电子部件;以及输入输出端子。 输入输出端子包括绝缘构件，销端子和环状构件。 绝缘构件结合到设置在侧壁中的通孔的开口的周边，以闭合通孔。 销端子具有从其外周面突出的凸缘部，并穿过绝缘部件。 凸缘部分结合到绝缘构件。 所述环状构件在与所述凸缘部接合的所述绝缘构件的表面相反的一侧，与所述销端子的外周面和所述绝缘构件接合。

公开(公告)号：US20150122874A1

公开(公告)日：2015-05-07

申请号：US14598007

申请日：2015-01-15

申请人： Senju Metal Industry Co., Ltd.

发明人： Masahiko ABE ,  Koji WATANABE ,  Hideaki TAKAHASHI ,  Masahiko KANNO ,  Masaya ITO

IPC分类号： B23K35/02 ,  B26F1/02 ,  B23K35/40

CPC分类号： B23K35/0222 ,  B23K1/0016 ,  B23K1/008 ,  B23K3/0623 ,  B23K35/02 ,  B23K35/26 ,  B23K35/262 ,  B23K35/286 ,  B23K35/302 ,  B23K35/325 ,  B23K35/40 ,  B23K2101/42 ,  B26F1/02 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2201/10636 ,  H05K2201/10992 ,  H05K2203/0415 ,  H05K2203/082 ,  Y02P70/611 ,  Y10T83/0448 ,  Y10T83/0481

摘要： A solder piece that has a rectangular parallelepiped shape formed by a punching process. Any one of the four surfaces of the rectangular parallelepiped other than the surface on which the shear droop portion generated by the punching process is formed and a surface opposite to the surface on which the shear droop portion is formed is a vacuum pickup surface. Each vacuum pickup surface is a sheared surface and extends along a longitudinal direction of the rectangular parallelepiped solder piece. The solder piece may be located in an open cavity in a supply tape with one of only the four vacuum pickup surfaces exposed to be available for vacuum pickup.

摘要翻译： 具有通过冲压加工形成的长方体形状的焊料。 长方体的除了通过冲压加工产生的剪切下垂部分的表面以外的其他四个表面中的任何一个都形成真空拾取表面，并且与形成有剪切下垂部分的表面相反的表面。 每个真空拾取表面是剪切表面，并且沿长方体焊料的长度方向延伸。 焊料可以位于供应带中的开放空腔中，只有四个真空吸附表面中的一个露出可用于真空吸取。

公开(公告)号：US20100291734A1

公开(公告)日：2010-11-18

申请号：US12841621

申请日：2010-07-22

申请人： Masazumi AMAGAI

发明人： Masazumi AMAGAI

IPC分类号： H01L21/60

CPC分类号： H01L23/3128 ,  B23K35/262 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13021 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16503 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/81447 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01021 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/244 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/10992 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/01047 ,  H01L2924/01028 ,  H01L2924/01027

摘要： A semiconductor device with an improved solder joint system is described. The solder system includes two copper contact pads connected by a body of solder and the solder is an alloy including tin, silver, and at least one metal from the transition groups IIIA, IVA, VA, VIA, VIIA, and VIIIA of the Periodic Table of the Elements. The solder joint system also includes, between the pads and the solder, layers of intermetallic compounds, which include grains of copper and tin compounds and copper, silver, and tin compounds. The compounds contain the transition metals. The inclusion of the transition metals in the compound grains reduce the compound grains size and prevent grain size increases after the solder joint undergoes repeated solid/liquid/solid cycles.

公开(公告)号：US20100139958A1

公开(公告)日：2010-06-10

申请号：US12706418

申请日：2010-02-16

申请人： Mukta G. Farooq ,  Charles C. Goldsmith

发明人： Mukta G. Farooq ,  Charles C. Goldsmith

IPC分类号： H05K1/09

CPC分类号： B23K3/0638 ,  B23K2101/40 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/49149

摘要： Methods of forming and assemblies having hybrid interconnection grid arrays composed of a homogenous mixture of Pb-free solder joints and Pb-containing solder paste on corresponding sites of a printed board. The aligned Pb-free solder joints and Pb-containing solders are heated to a temperature above a melting point of the Pb-free solder joint for a sufficient time to allow complete melting of both the Pb-free solder joints and Pb-containing solder paste and the homogenous mixing thereof during assembly. These molten materials mix together such that the Pb from the Pb-containing solder disperses throughout substantially the entire Pb-free solder joint for complete homogenization of the molten materials to form the homogenous hybrid interconnect structures of the invention.

摘要翻译： 具有混合互连栅格阵列的形成和组装方法，其由印刷电路板的相应位置上的无铅焊点和含Pb焊膏的均匀混合物组成。 将排列的无铅焊点和含Pb焊料加热到无铅焊点的熔点以上的温度足够的时间，以使无铅焊点和含Pb焊膏完全熔化 并在组装期间均匀混合。 这些熔融材料混合在一起，使得来自含Pb焊料的Pb分散在基本上整个无铅焊料接头处，以使熔融材料完全均化，形成本发明的均匀混合互连结构。

公开(公告)号：US07709293B2

公开(公告)日：2010-05-04

申请号：US12038444

申请日：2008-02-27

申请人： Motoyuki Nishizawa

发明人： Motoyuki Nishizawa

IPC分类号： H01L21/00

CPC分类号： H05K3/321 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/742 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/11901 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1358 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75743 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H05K2201/10674 ,  H05K2201/10992 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/0695 ,  H01L2224/29099 ,  H01L2924/013

摘要： A semiconductor device where an outside connection terminal of a semiconductor element and an electrode of a wiring board are connected to each other via a conductive adhesive, the conductive adhesive includes a first conductive adhesive; and a second conductive adhesive covering the first conductive adhesive; wherein the first conductive adhesive contains a conductive filler including silver (Ag); and the second conductive adhesive contains a conductive filler including a metal selected from a group consisting of tin (Sn), zinc (Zn), cobalt (Co), iron (Fe), palladium (Pd), and platinum (Pt).

摘要翻译： 其中半导体元件的外部连接端子和布线板的电极通过导电粘合剂彼此连接的半导体器件，导电粘合剂包括第一导电粘合剂; 以及覆盖所述第一导电粘合剂的第二导电粘合剂; 其中所述第一导电粘合剂含有包含银（Ag）的导电填料; 所述第二导电性粘合剂含有包含选自锡（Sn），锌（Zn），钴（Co），铁（Fe），钯（Pd）和铂（Pt）的金属的导电性填料。

公开(公告)号：US20100013092A1

公开(公告)日：2010-01-21

申请号：US12458328

申请日：2009-07-08

申请人： Tsuyoshi Eda

发明人： Tsuyoshi Eda

IPC分类号： H01L23/498 ,  H01L21/768

CPC分类号： H05K3/3436 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/1147 ,  H01L2224/13012 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H05K3/3463 ,  H05K2201/10992 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/13099

摘要： Provided is a semiconductor device having a bump structure which is capable of resolving inconvenience in mounting. The semiconductor device comprises: an electrode pad; and a columnar bump formed on the electrode pad, the columnar bump comprising: a first high melting point metal layer (14) formed on the electrode pad; a first solder (15) formed on the first high melting point metal layer (14); a second high melting point metal layer (16) formed on the first solder (15); and a second solder (17) which is formed on the second high melting point metal layer (16) and is connected to an external.

摘要翻译： 提供了具有能够解决安装不便的凸块结构的半导体器件。 该半导体器件包括：电极焊盘; 和形成在所述电极焊盘上的柱状凸起，所述柱状凸起包括：形成在所述电极焊盘上的第一高熔点金属层（14） 形成在第一高熔点金属层（14）上的第一焊料（15）; 形成在第一焊料（15）上的第二高熔点金属层（16）; 和形成在第二高熔点金属层（16）上并与外部连接的第二焊料（17）。