公开(公告)号：US09669493B2

公开(公告)日：2017-06-06

申请号：US14648031

申请日：2013-11-18

申请人： Senju Metal Industry Co., Ltd.

发明人： Koji Watanabe ,  Minoru Toyoda ,  Satoshi Tomita ,  Tsutomu Sugino ,  Daichi Kikuchi ,  Hiroki Oshima

IPC分类号： B23K35/00 ,  B23K35/14 ,  B23K35/02 ,  B23K35/28 ,  B23K1/00 ,  B23K1/19 ,  C22C12/00 ,  B32B15/01 ,  B23K35/26 ,  B23K35/40 ,  C22C1/00 ,  C22C11/06 ,  C22C13/00 ,  C22C13/02 ,  C22C21/14 ,  H05K3/34 ,  B23K101/42

CPC分类号： B23K35/0238 ,  B23K1/0016 ,  B23K1/19 ,  B23K35/0222 ,  B23K35/0233 ,  B23K35/26 ,  B23K35/262 ,  B23K35/268 ,  B23K35/28 ,  B23K35/40 ,  B23K2101/42 ,  B32B15/01 ,  B32B15/018 ,  C22C1/00 ,  C22C11/06 ,  C22C12/00 ,  C22C13/00 ,  C22C13/02 ,  C22C21/14 ,  H05K3/3463 ,  H05K2201/10992 ,  H05K2203/0405 ,  H05K2203/12 ,  Y10T428/12986

摘要： When soldering a package having an electrode on which Ni/Au or Ag—Pd alloy is plated, to a printed circuit board having a Cu electrode or an electrode on which Cu is plated, a solid-phase diffusion layer is formed within a layered solder material for bonding different species of electrodes. The layered solder material is composed of a solder material of Sn—Ag—Cu series or Sn—Sb series and a solder material of Sn—Ag—Cu—Ni series or Sn—Pb series. The electrode on which Ni/Au or Ag—Pd alloy is plated and the Cu electrode or the electrode on which Cu is plated are soldered with the solder material of Sn—Ag—Cu series or Sn—Sb series being attached to the Cu electrode and the solder material of Sn—Ag—Cu—Ni series or Sn—Cu series being attached to the electrode on which Ni/Au or Ag—Pd alloy is plated. This restrains formation of intermetallic compounds and provides high bonding reliability.