-
公开(公告)号：US20240334603A1
公开(公告)日：2024-10-03
申请号：US18672676
申请日：2024-05-23
Inventor： Ren XIONG , Fan LI , Qiang TANG , Fei SHANG , Haijun QIU , Yuanyuan CHAI , Huiqiang SONG
IPC: H05K1/11 , G06F3/041 , G06F3/044 , H01R12/61 , H05K1/18 , H05K3/36 , H10K59/131 , H10K59/179
CPC classification number: H05K1/118 , G06F3/0412 , G06F3/0443 , G06F3/0446 , H01R12/61 , H05K3/363 , G06F3/04164 , H05K1/189 , H05K2201/041 , H05K2201/09227 , H05K2201/09236 , H05K2201/09381 , H05K2201/0939 , H05K2201/09481 , H05K2201/10128 , H10K59/131 , H10K59/179
Abstract: A display device is provided. The display device includes a display panel (20) and a flexible circuit board electrically connected with the display panel (20). The flexible circuit board includes a first circuit board (11), a second circuit board (22) and a conductive portion; the first circuit board (11) includes a first substrate (100), and a main contact pad, a first wire (501) and a second wire (502) provided on the first substrate (100); the second circuit board (22) includes a second substrate (200), a relay contact pad and a third wire (210) provided on the second substrate (200); and the conductive portion is configured for electrically connecting the main contact pad and the relay contact pad.
-
公开(公告)号：US11869688B2
公开(公告)日：2024-01-09
申请号：US17511367
申请日：2021-10-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Rikiya Sano , Masayuki Yoneda
CPC classification number: H01F27/292 , H05K1/18 , H01F27/2804 , H05K2201/09381 , H05K2201/09472 , H05K2201/1003
Abstract: An inductor component includes a component body having a mounting surface and a top surface and provided therein with a spiral inductor wiring line advancing in the extending direction of a winding center axis. The inductor wiring line is connected to a first external electrode at a first end, and connected to a second external electrode at a second end. The component body includes: a first inclined surface connected to a first end of the mounting surface on a first side in a length direction and inclined toward the top surface as separating from the first end; and a second inclined surface connected to a second end of the mounting surface on a second side in the length direction and inclined toward the top surface as separating from the second end. The winding center axis extends in a direction parallel to the mounting surface and perpendicular to the length direction.
-
公开(公告)号：US11665825B2
公开(公告)日：2023-05-30
申请号：US17493569
申请日：2021-10-04
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Heung Kil Park , Se Hun Park , Hun Gyu Park , Woo Chui Shin , Ji Hong Jo
CPC classification number: H05K1/181 , H01G2/065 , H01G4/12 , H01G4/232 , H01G4/30 , H05K1/111 , H05K2201/09381 , H05K2201/10015 , H05K2201/2045
Abstract: A multilayer electronic component includes: a capacitor body having first to sixth surfaces, and including first and second internal electrodes; first and second external electrodes including first and second connection portions and first and second band portions; and a connection terminal including first and second land portions disposed on the first and second band portions, respectively, and having first and second cut-out portions, respectively. First and second solder accommodating portions are provided by the first and second cut-out portions in lower portions of the first and second band portions, respectively, and, 0.2≤SA1/BW1≤0.5 and 0.2≤SA2/BW2≤0.5 which in BW1 is an area of the first band portion, SA1 is an area of the first solder accommodating portion, BW2 is an area of the second band portion, and SA2 is an area of the second solder accommodating portion.
-
公开(公告)号：US20190250742A1
公开(公告)日：2019-08-15
申请号：US16394559
申请日：2019-04-25
Applicant: Japan Display Inc.
Inventor： Koji ISHIZAKI , Daisuke SONODA , Toshimasa ISHIGAKI
CPC classification number: G06F3/044 , G02F1/13338 , G06F3/0412 , G06F2203/04103 , H05K1/11 , H05K3/28 , H05K2201/09381
Abstract: A detection device includes a first substrate including a first region, a second region and a third region, the second region arranged between the first region and the third region; a detection electrode arranged on the first substrate; a first electrode coupled to the detection electrode, continuously formed from the first region to the third region in a first direction on the first substrate, and including a plurality of concave portions in the second region; and a protective layer formed on the first electrode in the first region, wherein the protective layer is formed on a first one of the concave portions in the second region, wherein the protective film is not formed on a second one of the concave portions in the second region, the second one of the concave portions is arranged nearer to the third region than the first one of the concave portions.
-
公开(公告)号：US09978725B2
公开(公告)日：2018-05-22
申请号：US14903834
申请日：2014-07-08
Applicant: PSI CO., LTD.
Inventor： Young Rag Do
CPC classification number: H01L25/0753 , H01L33/504 , H01L33/507 , H01L33/62 , H01L2924/0002 , H05K1/0295 , H05K1/0296 , H05K1/111 , H05K3/28 , H05K3/3442 , H05K2201/09236 , H05K2201/09254 , H05K2201/09381 , H05K2201/0939 , H05K2201/09427 , H05K2201/09954 , H05K2201/10106 , H05K2201/10583 , H05K2201/10636 , H05K2201/10651 , H05K2203/048 , Y02P70/611 , H01L2924/00
Abstract: Provided is an LED lamp using a nano-scale LED electrode assembly. The LED lamp using the nano-scale LED electrode assembly may solve limitations in which, when a nano-scale LED device according to the related art stands up and is three-dimensionally coupled to an electrode, it is difficult to allow the nano-scale LED device to stand up, and when the nano-scale LED devices are coupled to one-to-one correspond to electrodes different from each other, product quality is deteriorated. Thus, the nano-scale LED device having a nano unit may be connected to the two electrodes different from each other without causing defects, and light extraction efficiency may be improved due to the directivity of the nano-scale LED devices connected to the electrodes. Furthermore, deterioration in function of the LED lamp due to the defects of a portion of the nano-scale LEDs provided in the LED lamp may be minimized, and the LED lamp may have a flexible structure and shape by using the nano-scale LED electrode assembly of which a portion is deformable according to the used purpose or position of the LED lamp.
-
公开(公告)号：US20180138617A1
公开(公告)日：2018-05-17
申请号：US15351237
申请日：2016-11-14
Applicant: Microsoft Technology Licensing, LLC
CPC classification number: H01R12/91 , H01R12/721 , H01R12/78 , H04N13/344 , H04N2213/001 , H04N2213/008 , H05K1/0221 , H05K1/0295 , H05K1/11 , H05K3/361 , H05K2201/09272 , H05K2201/09381 , H05K2201/0939
Abstract: A universal coupling is disclosed for electrically and mechanically connecting flexible printed circuit (FPC) components within asymmetric FPC modules. The universal coupling allows a first FPC component to be connected to a second FPC component in two or more different orientations. This allows identical FPC components to be used in two or more asymmetric FPC modules. This in turn allows a reduction in the number of parts and tooling required to fabricate the two or more asymmetric FPC modules, and a simplification of the fabrication process.
-
公开(公告)号：US20180063954A1
公开(公告)日：2018-03-01
申请号：US15679095
申请日：2017-08-16
Applicant: Samsung Display Co., Ltd.
Inventor： Byoung Yong KIM , Jeong Ho HWANG
CPC classification number: H05K1/111 , G02F1/13452 , G02F1/13458 , G02F1/136286 , H01L27/124 , H01L27/1248 , H01L27/3276 , H01L51/0096 , H05K1/0268 , H05K1/113 , H05K1/18 , H05K2201/09381 , H05K2201/094 , H05K2201/09409 , H05K2201/09781 , H05K2201/10128 , H05K2201/10136
Abstract: A display device including: a display substrate including a display area configured to display an image and a pad area positioned on the periphery of the display area; a first pad part positioned above the pad area and including first pad terminals arranged in a first direction; and a printed circuit board including a base film and a second pad part positioned at one side of the base film and coupled with the first pad part, the second pad part includes first contact terminals coupled with first pad terminals, each of first contact terminals includes first contact pad terminals arranged along a first row forming a first inclination angle with the first direction, and second contact pad terminals spaced from first contact pad terminals and arranged along a second row forming a second inclination angle with the first direction.
-
公开(公告)号：US09900982B2
公开(公告)日：2018-02-20
申请号：US14539545
申请日：2014-11-12
Applicant: Finisar Corporation
Inventor： Henry Nguyen , Yuxin Zhou , Tay Gek-Teng
CPC classification number: H05K1/113 , H01L2924/0002 , H05K1/0269 , H05K1/111 , H05K3/363 , H05K3/4007 , H05K3/4038 , H05K2201/0373 , H05K2201/09381 , H05K2201/09445 , H05K2201/09845 , H05K2203/0465 , Y02P70/611 , H01L2924/00
Abstract: A method of soldering can include: providing a first electronic component having a first buttoned soldering pad including a first soldering pad and one or more first button heads protruding from a first surface of the soldering pad; providing a second electronic component having a soldering pad; and soldering the first buttoned soldering pad to the soldering pad. The method includes introducing solder to spaces around the one or more first buttons of the first buttoned soldering pad. The method includes introducing a first solder to spaces around the one or more first buttons of the first buttoned soldering pad; introducing a second solder to spaces around one or more second buttons of a second buttoned soldering pad of the first electronic component; and forming spaces between the first and second solder that electronically insulate the first solder from the second solder.
-
公开(公告)号：US20180042109A1
公开(公告)日：2018-02-08
申请号：US15782987
申请日：2017-10-13
Applicant: OLYMPUS CORPORATION
Inventor： Takahiro SHIMOHATA
CPC classification number: H05K1/144 , A61B1/00124 , A61B1/041 , H01L27/14618 , H01L27/14636 , H05K1/111 , H05K1/119 , H05K2201/041 , H05K2201/09027 , H05K2201/09072 , H05K2201/09118 , H05K2201/09381 , H05K2201/10121 , H05K2201/10151 , H05K2203/0465
Abstract: A connection structure includes: a wiring board including a plurality of first electrodes that are arranged on a principal surface; a molded interconnect device (MID) made of a non-electroconductive resin as a base material, the MID including a side surface and a bottom surface, the bottom surface being parallel to the principal surface of the wiring board and including a plurality of arranged second electrodes, and the side surface being perpendicular to the principal surface of the wiring board; and a plurality of electroconductive members each made of an electroconductive paste, each of the electroconductive members electrically connecting each of the plurality of first electrodes to each of the plurality of second electrodes, in which the plurality of electroconductive members are housed in respective reservoir sections formed by the second member and are not in contact with the non-electroconductive resin.
-
公开(公告)号：US09787022B2
公开(公告)日：2017-10-10
申请号：US15146652
申请日：2016-05-04
Applicant: JoyLabz LLC
Inventor： Bryan Randall Wilcox , Todd Eddie , Jay Saul Silver
CPC classification number: H01R13/6205 , G06F1/16 , H01R11/24 , H01R13/6658 , H01R2201/06 , H05K1/11 , H05K1/111 , H05K1/113 , H05K1/117 , H05K5/0278 , H05K2201/083 , H05K2201/09381 , H05K2201/0939 , H05K2201/094 , H05K2201/09427 , H05K2201/09481 , H05K2201/10386
Abstract: Systems and methods for magnetic coupling. One system includes an external computing device and a connector having a conductive end. The system also includes a printed circuit board. The printed circuit board includes a connector side opposite a back side. The connector side has a contact pad with an aperture. The printed circuit board also includes a magnet positioned on the back side of the printed circuit board. The magnet provides a magnetic field configured to provide magnetic attraction forces to a connector contacting the contact pad. The printed circuit board also includes a communication terminal. The system also includes a circuit in communication with the printed circuit board through the connector and contact pad.
