公开(公告)号：US12018378B2

公开(公告)日：2024-06-25

申请号：US16485543

申请日：2018-06-21

申请人： KOJIMA CHEMICALS, CO., LTD.

发明人： Tomohito Kato ,  Hideto Watanabe

IPC分类号： C23C18/34 ,  C23C18/16 ,  C23C18/44 ,  H01L21/768

CPC分类号： C23C18/44 ,  C23C18/1651 ,  C23C18/34 ,  H01L21/7685 ,  H01L21/76874

摘要： An object is to provide an electroless plating process which can thin a film thickness of a nickel film and can obtain a film having excellent mounting characteristics, when the nickel film and a gold film are sequentially formed on a surface of a copper material. In order to solve the above-mentioned problems, provided is an electroless plating process which sequentially forms a nickel film and a gold film on a surface of a copper material by an electroless plating method and includes: a step of forming the nickel film on the surface of the copper material by an electroless strike plating method; and a step of forming the gold film by a reduction-type electroless plating method.

公开(公告)号：US11862518B2

公开(公告)日：2024-01-02

申请号：US16914900

申请日：2020-06-29

申请人： Analog Devices International Unlimited Company

发明人： Jan Kubik ,  Bernard P. Stenson ,  Michael Noel Morrissey

IPC分类号： H01L21/768 ,  H01L23/522 ,  H01L21/288 ,  H01L21/033 ,  C23C18/16 ,  H01L23/532 ,  C25D5/02 ,  C25D7/12 ,  C25D5/10 ,  H05K3/24 ,  H05K3/18 ,  H05K3/42 ,  H01L49/02 ,  H05K1/02

CPC分类号： H01L21/76885 ,  C23C18/1605 ,  C23C18/1651 ,  C25D5/022 ,  C25D5/10 ,  C25D7/123 ,  H01L21/0331 ,  H01L21/2885 ,  H01L21/76846 ,  H01L21/76852 ,  H01L21/76873 ,  H01L23/5226 ,  H01L23/53238 ,  H01L28/10 ,  H05K3/184 ,  H05K3/244 ,  H05K3/422 ,  H05K1/0265 ,  H05K3/188 ,  H05K3/424 ,  H05K2201/0367 ,  H05K2201/0391 ,  H05K2201/096 ,  H05K2201/09563 ,  H05K2201/09845 ,  H05K2203/0716 ,  H05K2203/1407 ,  H05K2203/1423 ,  H05K2203/1476

摘要： The disclosed technology generally relates to forming metallization structures for integrated circuit devices by plating, and more particularly to plating metallization structures that are thicker than masking layers used to define the metallization structures. In one aspect, a method of metallizing an integrated circuit device includes plating a first metal on a substrate in a first opening formed through a first masking layer, where the first opening defines a first region of the substrate, and plating a second metal on the substrate in a second opening formed through a second masking layer, where the second opening defines a second region of the substrate. The second opening is wider than the first opening and the second region encompasses the first region of the substrate.

公开(公告)号：US20230349049A1

公开(公告)日：2023-11-02

申请号：US18257047

申请日：2021-12-17

申请人： COVENTYA, INC.

发明人： George BOKISA ,  Adam COLBURN ,  Bradley DURKIN ,  Maurice MILLS ,  Ambrose SCHAFFER

IPC分类号： C23C28/02 ,  C23C18/16 ,  C23C18/32 ,  C25D3/56 ,  C25D3/12 ,  C23C18/18

CPC分类号： C23C28/021 ,  C23C18/1653 ,  C23C18/32 ,  C25D3/56 ,  C25D3/12 ,  C23C18/1651 ,  C23C18/1648 ,  C23C18/1827

摘要： An article including a substrate having on at least a portion of its surface a multilayer coating. The multilayer coating including at least one layer of electroless nickel overlying the portion of the surface, at least one layer of electrolytic nickel overlying the layer of electroless nickel, and at least one layer of an electrolytic tin-nickel overlying the layer of electrolytic nickel.

公开(公告)号：US11668009B2

公开(公告)日：2023-06-06

申请号：US16969238

申请日：2019-01-30

申请人： Sumitomo Electric Industries, Ltd. ,  A.L.M.T. Corp.

发明人： Kengo Goto ,  Tomoaki Ikeda ,  Akihisa Hosoe ,  Masanori Sugisawa ,  Fukuto Ishikawa ,  Hideaki Morigami

IPC分类号： C23C18/16 ,  C23C18/18 ,  C23C26/00 ,  C23C18/50 ,  C22C26/00 ,  B32B15/04 ,  H01L23/373 ,  C22C1/04 ,  C22C1/05 ,  C22C5/06 ,  C23C18/32 ,  H01L21/48 ,  B32B19/00 ,  B32B15/16 ,  B32B19/04 ,  B22F7/02

CPC分类号： C23C18/1651 ,  B32B15/04 ,  B32B15/043 ,  B32B15/16 ,  B32B19/00 ,  B32B19/041 ,  C22C1/0466 ,  C22C1/05 ,  C22C5/06 ,  C22C26/00 ,  C23C18/1637 ,  C23C18/1803 ,  C23C18/1827 ,  C23C18/1844 ,  C23C18/1879 ,  C23C18/32 ,  C23C18/50 ,  H01L21/4871 ,  H01L23/3732 ,  H01L23/3736 ,  B22F7/02 ,  B22F2998/10 ,  B22F2999/00 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2255/28 ,  Y10T428/12493 ,  Y10T428/12535 ,  Y10T428/12625 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12944 ,  Y10T428/12993 ,  B22F2999/00 ,  B22F7/02 ,  C22C1/05 ,  C22C26/00 ,  C22C1/0466 ,  B22F2998/10 ,  B22F7/02 ,  B22F2003/247 ,  B22F2003/244 ,  B22F2003/242

摘要： A composite member includes: a substrate formed of a composite material containing a plurality of diamond grains and a metal phase; and a coating layer made of metal. The surface of the substrate includes a surface of the metal phase, and a protrusion formed of a part of at least one diamond grain of the diamond grains and protruding from the surface of the metal phase. In a plan view, the coating layer includes a metal coating portion, and a grain coating portion. A ratio of a thickness of the grain coating portion to a thickness of the metal coating portion is equal to or less than 0.80. The coating layer has a surface roughness as an arithmetic mean roughness Ra of less than 2.0 μm.

公开(公告)号：US11668008B2

公开(公告)日：2023-06-06

申请号：US17111040

申请日：2020-12-03

申请人： TDK CORPORATION

发明人： Makoto Orikasa ,  Yuhei Horikawa ,  Yoshihiro Kanbayashi ,  Hisayuki Abe

IPC分类号： B32B27/08 ,  B32B27/36 ,  B32B15/09 ,  B32B15/20 ,  B32B3/30 ,  H01L23/52 ,  H01L27/15 ,  B32B27/18 ,  H01L23/498 ,  H01L33/62 ,  H01L23/14 ,  H01L25/075 ,  C23C18/16 ,  C23C18/32 ,  C23C18/38 ,  C23C18/30 ,  C23F1/02

CPC分类号： C23C18/1641 ,  B32B3/30 ,  B32B15/09 ,  B32B15/20 ,  B32B27/08 ,  B32B27/18 ,  B32B27/36 ,  C23C18/161 ,  C23C18/1608 ,  C23C18/1651 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  H01L23/52 ,  H01L27/156 ,  B32B2307/412 ,  B32B2457/20 ,  C23F1/02 ,  H01L23/145 ,  H01L23/498 ,  H01L25/0753 ,  H01L33/62

摘要： A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer.

公开(公告)号：US20180264548A1

公开(公告)日：2018-09-20

申请号：US15542174

申请日：2016-01-06

申请人： CLARKSON UNIVERSITY

发明人： Dan V. Goia ,  Corina Goia ,  John I. Njagi

IPC分类号： B22F1/02 ,  C23C18/44 ,  C23C18/16 ,  C23C18/54 ,  B22F1/00

CPC分类号： B22F1/025 ,  B22F1/0055 ,  B22F1/0062 ,  B22F1/0088 ,  B22F2999/00 ,  C23C18/1635 ,  C23C18/1637 ,  C23C18/1651 ,  C23C18/1692 ,  C23C18/44 ,  C23C18/54 ,  H01B1/026

摘要： Compositions having copper flakes coated with silver, where the silver is present as a hermetically closed metal shell around the copper, are described. The hermetically closed metal shell can limit oxidation of copper for at least 365 days at a temperature of less than 100° C. The composition can also contain palladium in an amount of about 1% or less by weight of silver in the shell. Palladium limits the migration of copper from the core flakes to the silver shell at temperatures below 250° C. Methods of manufacturing copper flakes coated can include the steps of treating copper flakes with an acid to form acid treated copper flakes, treating the acid treated copper flakes with a polyamine to form polyamine treated copper flakes, depositing silver on the polyamine treated copper flakes to form copper flakes comprising silver deposits, and depositing silver onto the copper flakes comprising silver deposits.

公开(公告)号：US10056505B2

公开(公告)日：2018-08-21

申请号：US14217553

申请日：2014-03-18

申请人： Inkron Ltd

发明人： Juha Rantala

IPC分类号： B22F1/00 ,  C09D5/24 ,  H01L31/0224 ,  C09D11/52 ,  C22C9/00 ,  H01B1/02 ,  C22C9/06 ,  B32B15/01 ,  B22F1/02 ,  C23C18/16 ,  C23C18/18 ,  C23C18/36 ,  C23C18/44 ,  C22C1/04

CPC分类号： H01L31/022425 ,  B22F1/02 ,  B22F1/025 ,  B32B15/01 ,  B32B15/018 ,  C09D5/24 ,  C09D11/52 ,  C22C1/0425 ,  C22C1/0433 ,  C22C9/00 ,  C22C9/06 ,  C23C18/1635 ,  C23C18/1651 ,  C23C18/1669 ,  C23C18/1692 ,  C23C18/1844 ,  C23C18/36 ,  C23C18/44 ,  H01B1/026 ,  Y02E10/50

摘要： A composition comprising a plurality of coated metal particles with a metal core surrounded by nested shells formed by an electrically conductive layer and by a barrier layer, at least one of the shells being formed by electroless plating. The invention also comprises a method of producing such compositions as well as the use of the composition in, for example, crystalline-silicon solar cell devices having contact structures formed on one or more surfaces of a solar cell device, such as those used in back contact solar cell devices or emitter wrap through (EWT) solar cell devices.

公开(公告)号：US10020116B2

公开(公告)日：2018-07-10

申请号：US15354465

申请日：2016-11-17

申请人： AVX Corporation

发明人： Andrew P. Ritter ,  Robert H. Heistand, II ,  John L. Galvagni ,  Sriram Dattaguru

IPC分类号： H01G4/00 ,  H01G4/30 ,  H01C1/14 ,  H01C7/00 ,  H01C7/10 ,  H01G4/005 ,  H01G4/012 ,  H01G4/228 ,  H01G4/232 ,  C25D5/02 ,  H05K3/02 ,  C23C18/16 ,  C23C18/32 ,  C23C18/38 ,  C23C18/48 ,  C23C28/02 ,  C25D7/00 ,  H01G4/008 ,  H01G4/12 ,  C25D3/56 ,  C25D5/34 ,  H01C17/28 ,  H01F41/04 ,  H01G4/06 ,  H05K3/40

CPC分类号： H01G4/30 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/32 ,  C23C18/38 ,  C23C18/48 ,  C23C28/021 ,  C23C28/023 ,  C25D3/56 ,  C25D5/02 ,  C25D5/34 ,  C25D7/00 ,  H01C1/14 ,  H01C7/008 ,  H01C7/10 ,  H01C17/28 ,  H01F41/04 ,  H01G4/005 ,  H01G4/008 ,  H01G4/012 ,  H01G4/06 ,  H01G4/12 ,  H01G4/228 ,  H01G4/232 ,  H05K3/02 ,  H05K3/403 ,  H05K2201/09709 ,  Y10T29/42 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49099 ,  Y10T29/49101

摘要： Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.

公开(公告)号：US20180083294A1

公开(公告)日：2018-03-22

申请号：US15564098

申请日：2016-03-22

申请人： JFE STEEL CORPORATION

发明人： Takayoshi YANO ,  Shin ISHIKAWA ,  Chikara KAMI

IPC分类号： H01M8/0202 ,  C25D5/36 ,  C25D7/00 ,  H01M8/1018

CPC分类号： H01M8/0202 ,  C23C18/1651 ,  C23C18/1653 ,  C23C28/00 ,  C23C28/32 ,  C23C28/34 ,  C23C28/343 ,  C25D3/12 ,  C25D3/38 ,  C25D3/46 ,  C25D3/562 ,  C25D3/62 ,  C25D5/12 ,  C25D5/36 ,  C25D5/38 ,  C25D5/48 ,  C25D7/00 ,  C25D15/00 ,  H01M8/0208 ,  H01M8/021 ,  H01M8/0228 ,  H01M8/10 ,  H01M8/1018 ,  H01M2008/1095

摘要： A metal sheet for separators of polymer electrolyte fuel cells having both excellent corrosion resistance in the use environment of separators of polymer electrolyte fuel cells and excellent adhesion property between a substrate and a surface-coating layer even in the case where the surface-coating layer is made thinner is provided. A metal sheet for separators of polymer electrolyte fuel cells includes: a substrate made of metal; and a surface-coating layer with which the substrate is coated, with a strike layer in between, wherein a coating weight of the strike layer is 0.001 g/m2 to 1.0 g/m2.

公开(公告)号：US20180076275A1

公开(公告)日：2018-03-15

申请号：US15817858

申请日：2017-11-20

申请人： International Business Machines Corporation

发明人： Hariklia Deligianni ,  William J. Gallagher ,  Andrew J. Kellock ,  Eugene J. O'Sullivan ,  Lubomyr T. Romankiw ,  Naigang Wang

IPC分类号： H01L49/02 ,  H01F27/28 ,  H01F27/24 ,  H01F41/26 ,  H01L23/522 ,  C23C18/16 ,  H01F5/00 ,  H01L21/288 ,  H01F1/04 ,  H01F27/00 ,  H01F41/04

CPC分类号： H01L28/10 ,  C23C18/16 ,  C23C18/1605 ,  C23C18/165 ,  C23C18/1651 ,  C23C18/1673 ,  C23C18/168 ,  C23C18/1694 ,  C23C18/1696 ,  C23C18/1831 ,  C23C18/50 ,  H01F1/04 ,  H01F5/00 ,  H01F27/00 ,  H01F27/24 ,  H01F27/28 ,  H01F41/046 ,  H01F41/26 ,  H01L21/288 ,  H01L21/2885 ,  H01L23/5227

摘要： An on-chip magnetic structure structure includes a magnetic material comprising cobalt in a range from about 80 to about 90 atomic % (at. %) based on the total number of atoms of the magnetic material, tungsten in a range from about 4 to about 9 at. % based on the total number of atoms of the magnetic material, phosphorous in a range from about 7 to about 15 at. % based on the total number of atoms of the magnetic material, and palladium substantially dispersed throughout the magnetic material.