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公开(公告)号：US20240349426A1
公开(公告)日：2024-10-17
申请号：US18751913
申请日：2024-06-24
发明人： Atsushi SAKURAI
CPC分类号： H05K1/115 , H05K1/0298 , H05K3/422 , H05K2201/0323 , H05K2201/09545
摘要： An electronic component that includes: a substrate; a first electrode layer on the substrate and including conductive fillers and a binder; an insulation layer on the first electrode layer, the insulation layer having a via hole that penetrates the insulation layer in a lamination direction of the substrate, the first electrode layer, and the insulation layer; a second electrode layer on the insulation layer; and a via conductor in the via hole, the via conductor electrically coupling the first electrode layer and the second electrode layer, wherein a portion of the first electrode layer overlapping with the via hole in a top view includes a coupling layer coupled to the via conductor, the coupling layer having a content rate of the binder lower than a content rate of the binder in a portion of the first electrode layer positioned outside the via hole in the top view.
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公开(公告)号：US12069809B2
公开(公告)日：2024-08-20
申请号：US18205318
申请日：2023-06-02
CPC分类号： H05K3/022 , C23C28/322 , H05K3/422 , H05K3/426 , H05K3/427 , H05K2203/0716 , H05K2203/072 , H05K2203/0723 , Y10T428/12611
摘要： Method for forming a metal film includes forming an oxide layer on a to-be-treated surface of a to-be-treated object by bringing the to-be-treated surface into contact with a reaction solution containing fluorine and an oxide precursor, removing fluorine in the oxide layer, supporting a catalyst on the oxide layer by bringing the oxide layer into contact with a catalyst solution, and depositing a metal film on the oxide layer by bringing the oxide layer into contact with an electroless plating liquid.
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公开(公告)号：US11832397B2
公开(公告)日：2023-11-28
申请号：US17105768
申请日：2020-11-27
申请人： IBIDEN CO., LTD.
发明人： Masashi Awazu , Keisuke Kojima
IPC分类号： H05K1/02 , H05K1/03 , H05K1/09 , H05K1/11 , H05K1/18 , H05K3/10 , H05K3/24 , H05K3/30 , H05K3/34 , H05K3/40 , H05K3/46 , H01L21/48 , H01L21/66 , H01L21/683 , H01L21/768 , H01L23/00 , H01L23/15 , H01L23/31 , H01L23/48 , H01L23/498 , H01L23/525 , H01L23/538 , H05K3/42
CPC分类号： H05K3/3452 , H05K1/116 , H05K3/422 , H05K3/4661 , H05K3/4679 , H05K2201/09563
摘要： A printed wiring board includes a resin insulating layer, via conductors formed in the resin insulating layer, metal posts formed on the via conductors, respectively, and a solder resist layer formed on the resin insulating layer such that the metal posts have lower portions embedded in the solder resist layer and upper portions exposed from the solder resist layer, respectively. The metal posts are formed such that each of the metal posts has a top portion having a diameter in a range of 0.8 to 0.9 times a diameter of a respective one of the lower portions of the metal posts.
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公开(公告)号：US20230352903A1
公开(公告)日：2023-11-02
申请号：US18203056
申请日：2023-05-30
发明人： Ronny COSTI , Gilad REUT GELBART
IPC分类号： H01S5/02315 , H01S5/0237 , H01S5/02345 , H01S5/02 , H01S5/024 , H05K1/02 , H05K1/11 , H05K3/42
CPC分类号： H01S5/02315 , H01S5/0237 , H01S5/02345 , H01S5/0216 , H01S5/02469 , H01S5/02476 , H05K1/0206 , H05K1/0209 , H05K1/113 , H05K1/118 , H05K3/422 , H05K2201/09445 , H05K2201/09509 , H05K2203/073
摘要： A circuit sub-assembly is disclosed adapted for mounting and cooling a circuit component having a plurality of contacts. Circuit component can be mounted on a rigid substrate of a thermally conductive material having electrically insulating regions with a circuit board arranged between the circuit component and the substrate. The circuit board, which carries conductive traces that terminate in contact pads, is secured to the substrate with at least some of the contact pads on the circuit board disposed on the side of the board facing the substrate, some of the latter contact pads being bonded to the substrate. To establish both an electrical and a thermal connection between the contacts of the circuit component and the contact pads bonded to the substrate, there are blind holes formed in the base of the circuit board, each hole terminating at a respective one of the contact pads bonded to the substrate.
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公开(公告)号：US11792929B2
公开(公告)日：2023-10-17
申请号：US17588457
申请日：2022-01-31
申请人： IBIDEN CO., LTD.
发明人： Takema Adachi , Daisuke Minoura
IPC分类号： H05K1/02 , H05K1/09 , H05K3/10 , H05K3/26 , H05K3/38 , H01L23/13 , H01L23/60 , H01L23/498 , H05K1/11 , H05K3/42
CPC分类号： H05K1/116 , H05K3/26 , H05K3/389 , H05K3/422 , H05K2201/0989
摘要： A wiring substrate includes a first insulating layer, a first conductor layer, a second insulating layer, a second conductor layer, a connection conductor penetrating through the second insulating layer and connecting the first and second conductor layers, and a coating film formed on a surface of the first conductor layer such that the coating film is adhering the first conductor layer and the second insulating layer. The first conductor layer includes a conductor pad and a wiring pattern such that the conductor pad is in contact with the connection conductor and the wiring pattern is covered by the coating film, the conductor pad of the first conductor layer has a surface facing the second insulating layer and having a first surface roughness higher than a surface roughness of a surface of the wiring pattern, and the coating film has opening such that the opening is exposing the conductor pad entirely.
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公开(公告)号：US20190239349A1
公开(公告)日：2019-08-01
申请号：US16381823
申请日：2019-04-11
CPC分类号： H05K1/0313 , H05K1/0296 , H05K1/0353 , H05K1/0366 , H05K1/0373 , H05K1/038 , H05K1/09 , H05K1/115 , H05K3/18 , H05K3/181 , H05K3/182 , H05K3/387 , H05K3/422 , H05K3/429 , H05K3/4632 , H05K2201/0209 , H05K2201/0227 , H05K2201/0242 , H05K2201/0376 , H05K2203/0716
摘要： A catalytic resin is formed by mixing a resin and either homogeneous or heterogeneous catalytic particles, the resin infused into a woven glass fabric to form an A-stage pre-preg, the A-stage pre-preg cured into a B-stage pre-preg, thereafter held in a vacuum and between pressure plates at a gel point temperature for a duration of time sufficient for the catalytic particles to migrate away from the resin rich surfaces of the pre-preg, thereby forming a C-stage pre-preg after cooling. The C-stage pre-preg subsequently has trenches formed by removing the resin rich surface, the trenches extending into the depth of the catalytic particles, optionally including drilled holes to form vias, and the C-stage pre-preg with trenches and holes placed in an electroless bath, whereby traces form in the trenches and holes where the surface of the cured pre-preg has been removed.
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公开(公告)号：US20190141833A1
公开(公告)日：2019-05-09
申请号：US16238586
申请日：2019-01-03
申请人： AGC Inc.
发明人： Tomoya HOSODA , Tatsuya TERADA
CPC分类号： H05K1/0373 , H01P3/00 , H01Q1/38 , H05K1/024 , H05K1/0393 , H05K1/115 , H05K3/422 , H05K3/427 , H05K2201/015 , H05K2201/0154 , H05K2201/0212 , H05K2203/072 , H05K2203/0776 , H05K2203/0779 , H05K2203/095
摘要： To provide a wiring substrate having excellent transmission characteristics, of which initial failure of a plating layer formed on an inner wall surface of a hole is suppressed regardless of the type of the pre-treatment applied to the inner wall surface of the hole, and of which the plating layer has favorable heat resistance, and a process for producing it.A wiring substrate 10 comprising an electrical insulator layer 20, a first conductor layer 32 formed on a first surface of the electrical insulator layer 20, a second conductor layer 34 formed on a second surface of the electrical insulator layer 20, and a plating layer 42 provided on an inner wall surface of a hole 40 which opens from the first conductor layer 32 through the second conductor layer 34; wherein the electrical insulator layer 20 has a heat resistant resin layer 22 containing a heat resistant resin and a resin powder; the resin powder is formed from a resin material containing a melt-formable fluororesin having a functional group such as a carbonyl group-containing group; the content of the resin powder is from 5 to 70 mass % to the heat resistant resin layer 22; and the electrical insulator layer 20 has a dielectric constant of from 2.0 to 3.5.
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8.发明申请公开(公告)号：US20190008033A1
公开(公告)日：2019-01-03
申请号：US16025641
申请日：2018-07-02
申请人： INKTEC CO., LTD.
CPC分类号： H05K1/0219 , H01B7/08 , H01R12/79 , H05K1/028 , H05K1/115 , H05K1/118 , H05K3/422 , H05K3/425 , H05K9/0098 , H05K2201/0154 , H05K2201/0715 , H05K2201/093 , H05K2201/09609 , H05K2201/09681 , H05K2203/072
摘要： The present disclosure relates a printed circuit board having an EMI shielding function. In an example embodiment, the printed circuit board includes a substrate, a signal unit disposed on the substrate, a ground unit disposed in parallel with the signal unit, an insulation layer disposed above the substrate and covering the signal unit and the ground unit, an EMI shielding layer disposed on the insulation layer and under the substrate, respectively, and a shielding bridge passing through the substrate and the insulation layer at opposite sides of the signal unit and electrically connecting the EMI shielding layer disposed on the insulation layer to the EMI shielding layer disposed under the substrate.
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公开(公告)号：US20180279474A1
公开(公告)日：2018-09-27
申请号：US15935297
申请日：2018-03-26
申请人： IBIDEN CO., LTD.
发明人： Toshiaki HIBINO
CPC分类号： H05K1/115 , H01L23/49827 , H01L23/5383 , H05K1/0366 , H05K1/0373 , H05K3/0032 , H05K3/0035 , H05K3/421 , H05K3/422 , H05K3/423 , H05K3/428 , H05K3/429 , H05K3/4602 , H05K2201/09509 , H05K2201/09563 , H05K2201/09827 , H05K2201/09854 , H05K2203/072 , H05K2203/0723 , H05K2203/107 , H05K2203/1572
摘要： A printed wiring board includes a substrate having first and second surfaces such that the substrate has a thickness in a range of 30 μm to 100 μm between the first and second surfaces, and through hole conductors including plating material such that the through hole conductors are formed in through holes extending from the first surface to the second surface. Each through hole has a first opening portion and a second opening portion connected to the first opening portion such that the first opening portion has a tapered shape decreasing in diameter from the first surface toward the second surface, the second opening portion has a tapered shape decreasing in diameter from the second surface toward the first surface, and center lines of the first and second opening portions are shifted from each other by a distance that is equal to or less than the thickness of the substrate.
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公开(公告)号：US20180185658A1
公开(公告)日：2018-07-05
申请号：US15862118
申请日：2018-01-04
发明人： James E. Blood , Scott A. Spadgenske , Doug E. Giwoyna , Lonnie D. Myers , Shawn Larson , David A. Chizek
IPC分类号： A61N1/372 , H01L41/053 , H01L41/047 , H05K1/18 , H05K1/11 , H05K3/00 , H05K3/42 , H01L41/29 , G10K9/122 , A61N1/362 , A61N1/39 , A61N1/08
CPC分类号： A61N1/37258 , A61N1/08 , A61N1/3627 , A61N1/3956 , G10K9/122 , H01L41/0475 , H01L41/0533 , H01L41/29 , H05K1/09 , H05K1/115 , H05K1/183 , H05K1/185 , H05K1/189 , H05K3/0026 , H05K3/422 , H05K2201/10083 , H05K2203/0307 , H05K2203/072 , H05K2203/107 , H05K2203/1469
摘要： This document discusses, among other things, systems and methods related to a flexible circuit buzzer apparatus, such as a buzzer apparatus for use in an implantable medical device. In an example, the buzzer apparatus can include a flexible circuit having a first dielectric layer. A conductive layer can be disposed on the first dielectric layer. A hole can be formed in the first dielectric layer, the conductive layer, or both. A buzzer including a first contact can be located proximate to the hole. A conductive via can be plated or deposited in the hole. At least the first contact can be electrically coupled to the conductive layer by the conductive via.
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