- 专利标题： Printed wiring board and method for manufacturing printed wiring board
-
申请号： US17105768申请日： 2020-11-27
-
公开(公告)号： US11832397B2公开(公告)日： 2023-11-28
- 发明人: Masashi Awazu , Keisuke Kojima
- 申请人： IBIDEN CO., LTD.
- 申请人地址： JP Gifu
- 专利权人： IBIDEN CO., LTD.
- 当前专利权人： IBIDEN CO., LTD.
- 当前专利权人地址： JP Ogaki
- 代理机构： Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP 19222027 2019.12.09
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; H05K1/03 ; H05K1/09 ; H05K1/11 ; H05K1/18 ; H05K3/10 ; H05K3/24 ; H05K3/30 ; H05K3/34 ; H05K3/40 ; H05K3/46 ; H01L21/48 ; H01L21/66 ; H01L21/683 ; H01L21/768 ; H01L23/00 ; H01L23/15 ; H01L23/31 ; H01L23/48 ; H01L23/498 ; H01L23/525 ; H01L23/538 ; H05K3/42
摘要：
A printed wiring board includes a resin insulating layer, via conductors formed in the resin insulating layer, metal posts formed on the via conductors, respectively, and a solder resist layer formed on the resin insulating layer such that the metal posts have lower portions embedded in the solder resist layer and upper portions exposed from the solder resist layer, respectively. The metal posts are formed such that each of the metal posts has a top portion having a diameter in a range of 0.8 to 0.9 times a diameter of a respective one of the lower portions of the metal posts.
公开/授权文献
信息查询
