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    ELECTROLESS NICKEL ALLOY PLATING BATHS, A METHOD FOR DEPOSITION OF NICKEL ALLOYS, NICKEL ALLOY DEPOSITS AND USES OF SUCH FORMED NICKEL ALLOY DEPOSITS
    5.
    发明申请
    ELECTROLESS NICKEL ALLOY PLATING BATHS, A METHOD FOR DEPOSITION OF NICKEL ALLOYS, NICKEL ALLOY DEPOSITS AND USES OF SUCH FORMED NICKEL ALLOY DEPOSITS 有权

    公开(公告)号：US20220389588A1

    公开(公告)日：2022-12-08

    申请号：US17775902

    申请日：2020-11-19

    申请人： Atotech Deutschland GmbH & Co. KG

    发明人： Sebastian LANG

    IPC分类号： C23C18/36

    摘要： The present invention relates to an electroless nickel alloy plating bath comprising nickel ions; further reducible metal ions selected from the group consisting of molybdenum ions, rhenium ions, tungsten ions, copper ions, oxo-ions thereof, and mixtures thereof; at least one reducing agent suitable to reduce the nickel ions and the further reducible metal ions to their respective metallic state; complexing agents CA1, CA2, CA3, and CA4, wherein CA1, CA2, CA3, and CA4 are all different from each other, wherein each of CA1 and CA2 is independently selected from the group consisting of compounds having at least two carboxylic acid moieties, the respective salts thereof as well as mixtures of the aforementioned; wherein CA3 is selected from the group consisting of aliphatic compounds having exactly one carboxylic acid moiety, the respective salts thereof as well as mixtures of the aforementioned; and wherein CA4 is selected from the group consisting of aromatic compounds having at least one carboxylic acid moiety, the respective salts thereof as well as mixtures of the aforementioned.

    Method for the fabrication of an electroless-metal-plated sulfur nanocomposite, an electroless-metal-plated sulfur cathode which is made from the nanocomposite, and a battery that uses the cathode
    6.
    发明申请
    Method for the fabrication of an electroless-metal-plated sulfur nanocomposite, an electroless-metal-plated sulfur cathode which is made from the nanocomposite, and a battery that uses the cathode 有权

    公开(公告)号：US20220293914A1

    公开(公告)日：2022-09-15

    申请号：US17329356

    申请日：2021-05-25

    申请人： NATIONAL CHENG KUNG UNIVERSITY

    发明人： SHENG HENG CHUNG

    IPC分类号： H01M4/36 ,  H01M4/38 ,  H01M4/04 ,  C23C18/36

    摘要： A method for the fabrication of an electroless-metal-plated sulfur nanocomposite, an electroless-metal-plated sulfur cathode which is made from the nanocomposite, and a battery that uses the cathode, where the method includes chemically plating a conductive metal nanoshell onto the surface of the insulating sulfur powder to improve the conductivity of the sulfur cathode material, where through enhancing the electrochemical reaction kinetics with metal catalysis capabilities, and performing physical and chemical adsorption of liquid polysulfides with metal activity, the electroless-metal-plated sulfur nanocomposite enables the battery to exhibit high electrochemical utilization and stable cyclability, such that the nanocomposite can achieve a high sulfur content and high metal content, and the cathode demonstrates a high sulfur loading with a low electrolyte-to-sulfur ratio, the lithium-sulfur battery with the cathode exhibiting a high discharge capacity along with high energy density, and maintaining stable and high reversible capacity after 200 cycles within a wide range of cycling rates.

    METHOD FOR MANUFACTURING SURGE ABSORBING DEVICE
    8.
    发明申请
    METHOD FOR MANUFACTURING SURGE ABSORBING DEVICE 有权

    公开(公告)号：US20210226422A1

    公开(公告)日：2021-07-22

    申请号：US17223381

    申请日：2021-04-06

    申请人： AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION ,  SMART ELECTRONICS INC.

    发明人： Chang-Koo Kim ,  Hae-Min Lee ,  Doo Won Kang ,  Hyun Chang Kim

    IPC分类号： H01T4/12 ,  H01T21/00 ,  C23C18/50 ,  C23C18/18 ,  C23C18/16 ,  C23C18/36

    摘要： A method for manufacturing a surge absorbing device is provided. The method includes providing an elongate ceramic tube having a hollow space defined therein and having open and opposite first and second end; forming a first plating layer and a second plating layer on the first end and the second end, respectively; placing a surge absorbing element within the hollow space within the ceramic tube; disposing first and second brazing rings on the first plating layer and the second plating layer, respectively; disposing first and second sealing electrodes on the first and second brazing rings respectively; and melting the first and second brazing rings in an inert gas atmosphere to attach the first and second sealing electrodes onto the first plating layer and the second plating layer, respectively.

    PLATING METHOD, PLATING APPARATUS AND RECORDING MEDIUM
    9.
    发明申请
    PLATING METHOD, PLATING APPARATUS AND RECORDING MEDIUM 有权

    公开(公告)号：US20210175079A1

    公开(公告)日：2021-06-10

    申请号：US16769714

    申请日：2018-11-22

    申请人： Tokyo Electron Limited

    发明人： Mitsuaki Iwashita

    IPC分类号： H01L21/033 ,  C23C18/16 ,  C23C18/18 ,  C23C18/36 ,  H01L21/02

    摘要： On a surface of a substrate having a plateable material portion and a non-plateable material portion, a polymer compound, which selectively reacts with an OH end group of the non-plateable material portion, is supplied. By performing a catalyst imparting processing on the substrate on which the polymer compound is supplied, a catalyst is selectively imparted to the plateable material portion. Further, by performing a plating processing on the substrate, a plating layer is selectively formed on the plateable material portion. Before or after forming the plating layer, the polymer compound on the substrate is removed.