公开(公告)号：US20230061536A1

公开(公告)日：2023-03-02

申请号：US17755748

申请日：2021-08-30

申请人： SURFACE TECHNOLOGY, INC

发明人： Jijeesh Thotathil ,  Michael Feldstein ,  Thomas S Lancsek ,  Doan Nguyen

IPC分类号： C23C18/32 ,  C23C18/16 ,  C23C18/18

摘要： Compositions for electroless plating baths and their use are disclosed, and more particularly different solutions each usable to both makeup an original bath and to replenishment of the original bath.

公开(公告)号：US20240228816A1

公开(公告)日：2024-07-11

申请号：US18590256

申请日：2024-02-28

申请人： SURFACE TECHNOLOGY, INC.

发明人： Jijeesh Thotathil ,  Michael David Feldstein ,  Doan Nguyen ,  Thomas S Lancsek

IPC分类号： C09D127/18 ,  C08K3/08 ,  C23C18/16 ,  C23C18/36

CPC分类号： C09D127/18 ,  C23C18/1662 ,  C23C18/36 ,  C08K2003/0843 ,  C08K2003/0862

摘要： A plating solution for electroless plating is disclosed, the solution including a metal salt, a reducing agent, a complexing agent, and a dispersion including polytetrafluoroethylene (PTFE) particulate matter and at least one particulate matter stabilizer, where said dispersion includes 400 parts per million or less of perfluorooctanoic acid (PFOA), and said dispersion is usable for an electroless plating bath to form a coating including PTFE particulate matter on an article.