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公开(公告)号：US20240344225A1
公开(公告)日：2024-10-17
申请号：US18752338
申请日：2024-06-24
申请人： Kohler Co.
发明人： Sarfaraz MOH , Gary N. CLARKE
IPC分类号： C25D5/00 , B05D1/32 , B05D5/06 , B44C1/00 , C23C2/04 , C23C4/01 , C23C4/02 , C23C4/06 , C23C4/08 , C23C4/18 , C23C14/00 , C23C14/04 , C23C14/06 , C23C14/16 , C23C14/58 , C23C16/00 , C23C16/04 , C23C16/06 , C23C24/04 , C23C24/08 , C23C28/02 , C23C30/00 , C25D5/02 , C25D5/10 , C25D7/00 , E03C1/04
CPC分类号： C25D5/627 , B05D1/327 , B05D5/066 , B05D5/068 , C23C2/04 , C23C4/01 , C23C4/02 , C23C4/06 , C23C4/08 , C23C4/18 , C23C14/0015 , C23C14/044 , C23C14/0623 , C23C14/0647 , C23C14/16 , C23C14/165 , C23C14/5873 , C23C16/006 , C23C16/042 , C23C16/06 , C23C24/04 , C23C24/08 , C23C28/02 , C23C28/021 , C23C28/023 , C23C28/028 , C23C30/00 , C25D5/022 , C25D5/10 , C25D7/00 , B44C1/00 , E03C1/0404
摘要： A plumbing fixture having a multi-color appearance includes a first portion including a first finish having a first appearance and a second portion including a second portion having a second appearance that differs from the first appearance. The plumbing fixture further includes a transition region between the first portion and the second portion, wherein the appearance of the third region is graduated from the first appearance to the second appearance between a first end of the transition region adjacent the first portion and a second end of the transition region adjacent the second portion. The plumbing fixture has an ombre appearance as a result of the graduated transition between the first portion and the second portion.
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公开(公告)号：US12110808B2
公开(公告)日：2024-10-08
申请号：US18512227
申请日：2023-11-17
发明人： Yueguang Yu , Lingfeng Huang , Jianming Liu , Shuai Wang , Xiaoliang Lu , Yinghui Cai , Rui Guo , Tong Liu , Dan Guo , Chao Wu
CPC分类号： F01D5/288 , B05D1/12 , C23C4/073 , C23C28/022 , C25D5/14 , C25D7/00 , C25D15/00 , F01D11/122
摘要： A titanium alloy blade tip with a wear-resistant protective coating and a preparation method thereof are provided. The method includes: (1) spraying MCrAlY alloy powder on a surface of a titanium alloy blade tip by high velocity oxygen fuel (HVOF) spraying at a spraying distance of 300-400 mm to obtain the titanium alloy blade tip with a MCrAlY layer on the surface; where M is one of Ni and NiCo; (2) pre-plating Ni at a current density of 4-10 A/dm2; (3) placing the pre-plated titanium alloy blade tip in a Watt solution, covering a surface of the pre-plated titanium alloy blade tip obtained in the step (2) with abrasive particles, and then performing composite electroplating at a current density of 0.5-2 A/dm2. In the method, the wear-resistant protective coating with the high adhesion strength is prepared on the titanium alloy blade tip, and the wear-resistant protective coating has good wear resistance.
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公开(公告)号：US20240298411A1
公开(公告)日：2024-09-05
申请号：US18661939
申请日：2024-05-13
发明人： Chan Jin Park , Jong Eun Park , Hyun Seok Yang , Sangik Cho , Hiroki Okada , Young Ook Cho , Mi Jeong Jeon , In Jae Chung
CPC分类号： H05K3/188 , C25D5/022 , C25D7/00 , G03F7/20 , H05K2203/025
摘要： A method of manufacturing a printed circuit board includes: forming a resist layer; exposing first areas of the resist layer spaced apart from each other; after exposing the first areas, exposing second areas of the resist layer, the second areas being spaces between the first areas; forming first and second openings spaced apart from each other in the first and second areas by developing the resist layer; and forming a plurality of conductor patterns by filling the first and second openings with conductors.
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4.发明公开公开(公告)号：US20240287699A1
公开(公告)日：2024-08-29
申请号：US18563521
申请日：2022-03-17
发明人： Hirotaka KOTANI , Hiroto NARIEDA , Takao TOMIYA , Tatsuhiro DOI , Yukiya KATO , Hirotaka TAKAHASHI
摘要： There is provided a composite material in which an oxygen-containing silver-based coating layer is formed on a base material. the oxygen-containing silver-based coating layer containing silver and having oxygen present in the vicinity of its surface. and the base material comprising copper or copper alloy.
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公开(公告)号：US20240271307A1
公开(公告)日：2024-08-15
申请号：US18568465
申请日：2022-05-25
发明人： Donald Desalvo , Ron Blake , Carmichael Gugliotti , William J. Decesare , Richard A. Bellemare , James Watkowski , Ernest Long
摘要： A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and blind micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to. receive copper electroplating thereon: (2) forming at least one of one or more through-holes and/or one or more blind micro-vias in the electronic substrate; and (3) electroplating copper in the at one or more through-holes and/or one or more blind micro-vias by contacting the electronic substrate with an acid copper electrolyte. The acid copper electrolyte is used to plate the one or more through-holes and/or the one or more blind micro-vias using a complex waveform including pulse reverse plating. DC plating and/or synchronous pulse plating. The complex waveforms can be used for filling through-holes and blind microvias with copper without defects.
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公开(公告)号：US12042839B2
公开(公告)日：2024-07-23
申请号：US16529722
申请日：2019-08-01
发明人： Reza Oboodi , James Piascik , Lee Poandl , Harry Lester Kington
IPC分类号： B21D28/00 , B21D22/04 , B21D28/24 , C25D3/66 , C25D7/00 , C25D17/10 , C25D17/12 , F01D5/28 , F01D5/30
CPC分类号： B21D28/00 , B21D22/04 , B21D28/24 , C25D3/665 , C25D7/00 , C25D17/10 , C25D17/12 , F01D5/288 , F01D5/3092 , F05D2230/31 , F05D2230/90 , F05D2300/121
摘要： Ionic liquid bath plating methods for depositing aluminum-containing layers utilizing shaped consumable aluminum anodes are provided, as are turbomachine components having three dimensionally-tailored, aluminum-containing coatings produced from such aluminum-containing layers. In one embodiment, the ionic liquid bath plating method includes the step or process of obtaining a consumable aluminum anode including a workpiece-facing anode surface substantially conforming with the geometry of the non-planar workpiece surface. The workpiece-facing anode surface and the non-planar workpiece surface are positioned in an adjacent, non-contacting relationship, while the workpiece and the consumable aluminum anode are submerged in an ionic liquid aluminum plating bath. An electrical potential is then applied across the consumable aluminum anode and the workpiece to deposit an aluminum-containing layer onto the non-planar workpiece surface. In certain implementations, additional steps are then performed to convert or incorporate the aluminum-containing layer into a high temperature aluminum-containing coating, such as an aluminide coating.
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公开(公告)号：US12006587B2
公开(公告)日：2024-06-11
申请号：US17180670
申请日：2021-02-19
申请人： Mark R. Schroeder
发明人： Mark R. Schroeder
IPC分类号： C25D3/56 , C03C15/00 , C03C17/10 , C25D5/00 , C25D5/02 , C25D5/20 , C25D5/54 , C25D7/00 , C25D21/10 , G01R33/07 , G01R33/09 , H01F1/055
CPC分类号： C25D3/562 , C03C15/00 , C03C17/10 , C25D5/009 , C25D5/022 , C25D5/20 , C25D5/54 , C25D7/00 , C25D21/10 , G01R33/07 , G01R33/096 , H01F1/055 , C03C2217/261 , C03C2217/27 , C03C2218/115 , C03C2218/31 , C03C2218/34
摘要： In one example, a method to manufacture a magnetic sensor, comprises providing an electrolyte solution, submersing a substrate in the electrolyte solution, submersing a plurality of ingots in the electrolyte solution, wherein the ingots comprises a metal that is magnetic, and depositing the metal on the substrate by applying a voltage between the metal ingot and the substrate to result in magnetic alloy layer on the substrate. Other examples and related methods are also disclosed herein.
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公开(公告)号：US12004304B2
公开(公告)日：2024-06-04
申请号：US17442373
申请日：2020-03-17
CPC分类号： H05K3/064 , C23C18/1646 , C23C18/1689 , C23C28/023 , C25D5/022 , C25D7/00 , G03F7/20 , G03F7/42 , H05K2203/072 , H05K2203/0723 , H05K2203/1152
摘要： There is provided a method for manufacturing a printed wiring board that effectively suppresses pattern failure and is also excellent in fine circuit forming properties. This method includes: providing an insulating substrate including a roughened surface; performing electroless plating on the roughened surface of the insulating substrate to form an electroless plating layer less than 1.0 μm thick having a surface having an arithmetic mean waviness Wa of 0.10 μm or more and 0.25 μm or less as measured in accordance with JIS B0601-2001 and a kurtosis Sku of 2.0 or more and 3.5 or less as measured in accordance with ISO 25178; laminating a photoresist on the surface of the electroless plating layer; performing exposure and development to form a resist pattern; applying electroplating to the electroless plating layer; stripping the resist pattern; and etching away an unnecessary portion of the electroless plating layer to form a wiring pattern.
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公开(公告)号：US11920255B2
公开(公告)日：2024-03-05
申请号：US17630564
申请日：2020-06-04
发明人： Hirotaka Kotani , Yukiya Kato , Tatsuhiro Doi , Takao Tomiya , Hiroto Narieda
摘要： There are provided a composite plated product wherein a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material and wherein the amount of the carbon particles dropped out of the composite plating film is small, and a method for producing the same. After a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material (of preferably copper or a copper alloy) by electroplating using a silver-plating solution to which the carbon particles are added, a treatment for removing part of the carbon particles on the surface thereof is carried out.
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公开(公告)号：US20240018683A1
公开(公告)日：2024-01-18
申请号：US18463350
申请日：2023-09-08
摘要： A method for depositing a metal layer on a component includes applying an electrically conductive coating composition comprising a resin and metal particles on a coating region of the component and partially curing the resin to a gel state to form an electrically conductive coating. The method also includes applying additional metal particles to the partially cured resin in the gel state and depositing, via an electrodeposition process, a metal layer on the electrically conductive coating.
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