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公开(公告)号：US20220386473A1
公开(公告)日：2022-12-01
申请号：US17683604
申请日：2022-03-01
发明人： Chan Jin Park , Jong Eun Park , Hyun Seok Yang , Sangik Cho , Hiroki Okada , Young Ook Cho , Mi Jeong Jeon , In Jae Chung
摘要： A method of manufacturing a printed circuit board includes: forming a resist layer; exposing first areas of the resist layer spaced apart from each other; after exposing the first areas, exposing second areas of the resist layer, the second areas being spaces between the first areas; forming first and second openings spaced apart from each other in the first and second areas by developing the resist layer; and forming a plurality of conductor patterns by filling the first and second openings with conductors.
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公开(公告)号：US20240298411A1
公开(公告)日：2024-09-05
申请号：US18661939
申请日：2024-05-13
发明人： Chan Jin Park , Jong Eun Park , Hyun Seok Yang , Sangik Cho , Hiroki Okada , Young Ook Cho , Mi Jeong Jeon , In Jae Chung
CPC分类号： H05K3/188 , C25D5/022 , C25D7/00 , G03F7/20 , H05K2203/025
摘要： A method of manufacturing a printed circuit board includes: forming a resist layer; exposing first areas of the resist layer spaced apart from each other; after exposing the first areas, exposing second areas of the resist layer, the second areas being spaces between the first areas; forming first and second openings spaced apart from each other in the first and second areas by developing the resist layer; and forming a plurality of conductor patterns by filling the first and second openings with conductors.
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公开(公告)号：US11044808B2
公开(公告)日：2021-06-22
申请号：US16736114
申请日：2020-01-07
发明人： Min Hee Yoon , Jong Eun Park , Sun Young Choi
IPC分类号： H05K1/02 , H05K1/11 , H05K1/16 , H01L23/00 , H01L23/12 , H01L23/31 , H01L23/48 , H01L23/52 , H01L23/498
摘要： A printed circuit board includes a core layer, a plurality of conductive pattern layers disposed on one side and the other side of the core layer, a plurality of insulating layers disposed on the one side and the other side of the core layer, and a plurality of via layers disposed on the one side and the other side of the core layer. The printed circuit board has a wiring region and a dummy region surrounding at least a portion outside of the wiring region on a plane. A metal ratio in the dummy region on one side and a metal ratio in the dummy region on the other side are different from each other.
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公开(公告)号：US20210127484A1
公开(公告)日：2021-04-29
申请号：US16736114
申请日：2020-01-07
发明人： Min Hee Yoon , Jong Eun Park , Sun Young Choi
IPC分类号： H05K1/02 , H01L23/498
摘要： A printed circuit board includes a core layer, a plurality of conductive pattern layers disposed on one side and the other side of the core layer, a plurality of insulating layers disposed on the one side and the other side of the core layer, and a plurality of via layers disposed on the one side and the other side of the core layer. The printed circuit board has a wiring region and a dummy region surrounding at least a portion outside of the wiring region on a plane. A metal ratio in the dummy region on one side and a metal ratio in the dummy region on the other side are different from each other.
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公开(公告)号：US12016130B2
公开(公告)日：2024-06-18
申请号：US17683604
申请日：2022-03-01
发明人： Chan Jin Park , Jong Eun Park , Hyun Seok Yang , Sangik Cho , Hiroki Okada , Young Ook Cho , Mi Jeong Jeon , In Jae Chung
CPC分类号： H05K3/188 , C25D5/022 , C25D7/00 , G03F7/20 , H05K2203/025
摘要： A method of manufacturing a printed circuit board includes: forming a resist layer; exposing first areas of the resist layer spaced apart from each other; after exposing the first areas, exposing second areas of the resist layer, the second areas being spaces between the first areas; forming first and second openings spaced apart from each other in the first and second areas by developing the resist layer; and forming a plurality of conductor patterns by filling the first and second openings with conductors.
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公开(公告)号：US11558959B2
公开(公告)日：2023-01-17
申请号：US17230437
申请日：2021-04-14
发明人： Jin Uk Lee , Sangik Cho , Eun Sun Kim , Young Hun You , Jong Eun Park
摘要： A printed circuit board includes an insulating layer, a circuit pattern embedded in the insulating layer and including a first metal layer, a second metal layer and a third metal layer disposed between the first metal layer and the second metal layer, and a connection conductor disposed on one surface of the insulating layer and connected to the circuit pattern, wherein the first metal layer is exposed through the one surface of the insulating layer.
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公开(公告)号：US20220217843A1
公开(公告)日：2022-07-07
申请号：US17230437
申请日：2021-04-14
发明人： Jin Uk Lee , Sangik Cho , Eun Sun Kim , Young Hun You , Jong Eun Park
摘要： A printed circuit board includes an insulating layer, a circuit pattern embedded in the insulating layer and including a first metal layer, a second metal layer and a third metal layer disposed between the first metal layer and the second metal layer, and a connection conductor disposed on one surface of the insulating layer and connected to the circuit pattern, wherein the first metal layer is exposed through the one surface of the insulating layer.
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