公开(公告)号：US20220386473A1

公开(公告)日：2022-12-01

申请号：US17683604

申请日：2022-03-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chan Jin Park ,  Jong Eun Park ,  Hyun Seok Yang ,  Sangik Cho ,  Hiroki Okada ,  Young Ook Cho ,  Mi Jeong Jeon ,  In Jae Chung

IPC: H05K3/18 ,  C25D7/00 ,  C25D5/02 ,  G03F7/20

Abstract: A method of manufacturing a printed circuit board includes: forming a resist layer; exposing first areas of the resist layer spaced apart from each other; after exposing the first areas, exposing second areas of the resist layer, the second areas being spaces between the first areas; forming first and second openings spaced apart from each other in the first and second areas by developing the resist layer; and forming a plurality of conductor patterns by filling the first and second openings with conductors.

公开(公告)号：US20220209397A1

公开(公告)日：2022-06-30

申请号：US17182671

申请日：2021-02-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ju Ho Kim ,  Chan Jin Park

IPC: H01Q1/38 ,  H01Q1/24 ,  H01Q9/04 ,  H01Q5/335

Abstract: An antenna board includes a first base board unit including a first insulating layer having a first receiving groove; a first antenna board unit disposed in the first receiving groove, including a second insulating layer and a third insulating layer disposed on the second insulating layer, and further including at least one of a first patch pattern disposed on the second insulating layer and covered by the third insulating layer and a second patch pattern disposed on the third insulating layer; and a first encapsulant covering at least a portion of the first antenna board unit and filling at least a portion of the first receiving groove, wherein a dielectric constant of the second insulating layer is different from a dielectric constant of the third insulating layer.

公开(公告)号：US12028973B2

公开(公告)日：2024-07-02

申请号：US17501253

申请日：2021-10-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chan Jin Park ,  Young Ook Cho ,  Hyun Seok Yang ,  Ki Joo Sim ,  Won Seok Lee ,  Mi Jeong Jeon

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/11

CPC classification number: H05K1/0298 ,  H05K1/09 ,  H05K1/115 ,  H05K1/11

Abstract: A printed circuit board includes a first insulating layer, a metal layer disposed on one surface of the first insulating layer, a first circuit layer disposed inside the first insulating layer and having one surface exposed to the one surface of the first insulating layer so as to be in contact with one surface of the metal layer, a second circuit layer in contact with the other surface of the metal layer, and a second insulating layer disposed on the one surface of the first insulating layer to cover the metal layer and the second circuit layer. The first and second circuit layers respectively include a metal different from the metal layer.

公开(公告)号：US20220217842A1

公开(公告)日：2022-07-07

申请号：US17501253

申请日：2021-10-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chan Jin Park ,  Young Ook Cho ,  Hyun Seok Yang ,  Ki Joo Sim ,  Won Seok Lee ,  Mi Jeong Jeon

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/11

Abstract: A printed circuit board includes a first insulating layer, a metal layer disposed on one surface of the first insulating layer, a first circuit layer disposed inside the first insulating layer and having one surface exposed to the one surface of the first insulating layer so as to be in contact with one surface of the metal layer, a second circuit layer in contact with the other surface of the metal layer, and a second insulating layer disposed on the one surface of the first insulating layer to cover the metal layer and the second circuit layer. The first and second circuit layers respectively include a metal different from the metal layer.

公开(公告)号：US20240298411A1

公开(公告)日：2024-09-05

申请号：US18661939

申请日：2024-05-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chan Jin Park ,  Jong Eun Park ,  Hyun Seok Yang ,  Sangik Cho ,  Hiroki Okada ,  Young Ook Cho ,  Mi Jeong Jeon ,  In Jae Chung

IPC: H05K3/18 ,  C25D5/02 ,  C25D7/00 ,  G03F7/20

CPC classification number: H05K3/188 ,  C25D5/022 ,  C25D7/00 ,  G03F7/20 ,  H05K2203/025

Abstract: A method of manufacturing a printed circuit board includes: forming a resist layer; exposing first areas of the resist layer spaced apart from each other; after exposing the first areas, exposing second areas of the resist layer, the second areas being spaces between the first areas; forming first and second openings spaced apart from each other in the first and second areas by developing the resist layer; and forming a plurality of conductor patterns by filling the first and second openings with conductors.

公开(公告)号：US20230086970A1

公开(公告)日：2023-03-23

申请号：US17691785

申请日：2022-03-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chan Jin Park ,  Hyun Seok Yang

IPC: H05K3/06 ,  C25D5/02 ,  C25D5/48 ,  C25D3/38 ,  G03F7/16 ,  G03F7/00 ,  C25D7/00

Abstract: A method of manufacturing a printed circuit board a includes preparing an insulating substrate on which a first metal layer is formed, stacking a resist laminate having a plurality of layers on the first metal layer, forming an opening exposing a portion of the first metal layer by patterning the stacked resist laminate having the plurality of layers, forming a second metal layer on the exposed portion of the first metal layer, removing the patterned resist laminate having the plurality of layers, and etching at least another portion of the first metal layer.

公开(公告)号：US12016130B2

公开(公告)日：2024-06-18

申请号：US17683604

申请日：2022-03-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chan Jin Park ,  Jong Eun Park ,  Hyun Seok Yang ,  Sangik Cho ,  Hiroki Okada ,  Young Ook Cho ,  Mi Jeong Jeon ,  In Jae Chung

IPC: H05K3/18 ,  C25D5/02 ,  C25D7/00 ,  G03F7/20

CPC classification number: H05K3/188 ,  C25D5/022 ,  C25D7/00 ,  G03F7/20 ,  H05K2203/025

Abstract: A method of manufacturing a printed circuit board includes: forming a resist layer; exposing first areas of the resist layer spaced apart from each other; after exposing the first areas, exposing second areas of the resist layer, the second areas being spaces between the first areas; forming first and second openings spaced apart from each other in the first and second areas by developing the resist layer; and forming a plurality of conductor patterns by filling the first and second openings with conductors.

公开(公告)号：US11937378B2

公开(公告)日：2024-03-19

申请号：US17691785

申请日：2022-03-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chan Jin Park ,  Hyun Seok Yang

IPC: H05K3/06 ,  C25D3/38 ,  C25D5/02 ,  C25D5/48 ,  C25D7/00 ,  G03F7/00 ,  G03F7/16

CPC classification number: H05K3/064 ,  C25D3/38 ,  C25D5/022 ,  C25D5/48 ,  C25D7/00 ,  G03F7/0035 ,  G03F7/164 ,  H05K3/062

Abstract: A method of manufacturing a printed circuit board a includes preparing an insulating substrate on which a first metal layer is formed, stacking a resist laminate having a plurality of layers on the first metal layer, forming an opening exposing a portion of the first metal layer by patterning the stacked resist laminate having the plurality of layers, forming a second metal layer on the exposed portion of the first metal layer, removing the patterned resist laminate having the plurality of layers, and etching at least another portion of the first metal layer.

公开(公告)号：US20230092667A1

公开(公告)日：2023-03-23

申请号：US17991579

申请日：2022-11-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chan Jin Park ,  Hyun Seok Yang

IPC: H05K3/06 ,  C25D3/38 ,  G03F7/16 ,  C25D7/00 ,  C25D5/48 ,  C25D5/02 ,  G03F7/00

Abstract: A method of manufacturing a printed circuit board a includes preparing an insulating substrate on which a first metal layer is formed, stacking a resist laminate having a plurality of layers on the first metal layer, forming an opening exposing a portion of the first metal layer by patterning the stacked resist laminate having the plurality of layers, forming a second metal layer on the exposed portion of the first metal layer, removing the patterned resist laminate having the plurality of layers, and etching at least another portion of the first metal layer.

公开(公告)号：US11600913B2

公开(公告)日：2023-03-07

申请号：US17182671

申请日：2021-02-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ju Ho Kim ,  Chan Jin Park

IPC: H01Q1/38 ,  H01Q5/335 ,  H01Q9/04 ,  H01Q1/24

Abstract: An antenna board includes a first base board unit including a first insulating layer having a first receiving groove; a first antenna board unit disposed in the first receiving groove, including a second insulating layer and a third insulating layer disposed on the second insulating layer, and further including at least one of a first patch pattern disposed on the second insulating layer and covered by the third insulating layer and a second patch pattern disposed on the third insulating layer; and a first encapsulant covering at least a portion of the first antenna board unit and filling at least a portion of the first receiving groove, wherein a dielectric constant of the second insulating layer is different from a dielectric constant of the third insulating layer.