Invention Grant
- Patent Title: Antenna board
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Application No.: US17182671Application Date: 2021-02-23
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Publication No.: US11600913B2Publication Date: 2023-03-07
- Inventor: Ju Ho Kim , Chan Jin Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2020-0187396 20201230
- Main IPC: H01Q1/38
- IPC: H01Q1/38 ; H01Q5/335 ; H01Q9/04 ; H01Q1/24

Abstract:
An antenna board includes a first base board unit including a first insulating layer having a first receiving groove; a first antenna board unit disposed in the first receiving groove, including a second insulating layer and a third insulating layer disposed on the second insulating layer, and further including at least one of a first patch pattern disposed on the second insulating layer and covered by the third insulating layer and a second patch pattern disposed on the third insulating layer; and a first encapsulant covering at least a portion of the first antenna board unit and filling at least a portion of the first receiving groove, wherein a dielectric constant of the second insulating layer is different from a dielectric constant of the third insulating layer.
Public/Granted literature
- US20220209397A1 ANTENNA BOARD Public/Granted day:2022-06-30
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