-
公开(公告)号：US20240360585A1
公开(公告)日：2024-10-31
申请号：US18771571
申请日：2024-07-12
Inventor： Kuo-Lung HOU , Ming-Hsien LIN , Tsung-Cheng WU
CPC classification number: C25D21/12 , C25D5/54 , C25D7/12 , C25D17/001 , C25D21/00
Abstract: An electrochemical plating apparatus for depositing a conductive material on a wafer includes a cell chamber. The plating solution is provided from a bottom of the cell chamber into the cell chamber. A plurality of openings passes through a sidewall of the cell chamber. A flow regulator is arranged with each of the plurality of openings configured to regulate an overflow amount of the plating solution flowing out through the each of the plurality of openings. The electrochemical plating apparatus further comprises a controller to control the flow regulator such that overflow amounts of the plating solution flowing out through the plurality of openings are substantially equal to each other.
-
公开(公告)号：US20240360584A1
公开(公告)日：2024-10-31
申请号：US18768106
申请日：2024-07-10
Inventor： Kuo-Lung HOU , Ming-Hsien LIN
CPC classification number: C25D21/12 , C25D5/54 , C25D7/12 , C25D17/001 , C25D17/02
Abstract: A plating system is provided. The plating system includes an electroplating chamber defining a plating region within which a wafer is plated. The electroplating chamber includes an inlet configured to introduce plating solution into the plating region of the electroplating chamber. The electroplating chamber includes an outlet configured to remove the plating solution from the plating region of the electroplating chamber. The plating system includes a barrier configured to inhibit removal of the plating solution from the plating region.
-
公开(公告)号：US20240318343A1
公开(公告)日：2024-09-26
申请号：US18578448
申请日：2022-06-29
Applicant: Tokyo Electron Limited
Inventor： Kazuyuki Goto , Masatoshi Shiraishi , Masato Hamada
IPC: C25D7/12 , C25D5/54 , C25D17/00 , C25D21/12 , H01L21/288
CPC classification number: C25D7/123 , C25D5/54 , C25D17/001 , C25D21/12 , H01L21/288
Abstract: A controller outputs a control signal to control a plating liquid supply and a power applying device to perform a first electrolytic plating processing by applying power to a processing surface in a state that a plating liquid is in contact with a first facing range, which is a partial range of an electrode facing surface, and the controller also outputs, after the first electrolytic plating processing is performed, a control signal to control the plating liquid supply and the power applying device to perform a second electrolytic plating processing by applying the power to the processing surface in a state that the plating liquid is in contact with a second facing range of the electrode facing surface, the second facing range being wider than the first facing range.
-
公开(公告)号：US12071699B2
公开(公告)日：2024-08-27
申请号：US17873136
申请日：2022-07-25
Inventor： Kuo-Lung Hou , Ming-Hsien Lin , Tsung-Cheng Wu
CPC classification number: C25D21/12 , C25D5/54 , C25D7/12 , C25D17/001 , C25D21/00
Abstract: An electrochemical plating apparatus for depositing a conductive material on a wafer includes a cell chamber. The plating solution is provided from a bottom of the cell chamber into the cell chamber. A plurality of openings passes through a sidewall of the cell chamber. A flow regulator is arranged with each of the plurality of openings configured to regulate an overflow amount of the plating solution flowing out through the each of the plurality of openings. The electrochemical plating apparatus further comprises a controller to control the flow regulator such that overflow amounts of the plating solution flowing out through the plurality of openings are substantially equal to each other.
-
公开(公告)号：US12020922B2
公开(公告)日：2024-06-25
申请号：US17232937
申请日：2021-04-16
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor： Kuo-Lung Hou , Ming-Hsien Lin
IPC: H01L21/02 , B08B3/02 , B08B3/08 , B08B13/00 , C25D5/54 , C25D7/12 , C25D21/12 , H01L21/288 , H01L21/66 , H01L21/67
CPC classification number: H01L21/02087 , B08B3/02 , B08B3/08 , B08B13/00 , C25D5/54 , C25D7/12 , C25D21/12 , H01L21/2885 , H01L21/67051 , H01L21/67253 , H01L22/26
Abstract: An electrochemical plating apparatus for performing an edge bevel removal process on a wafer includes a cell chamber. The cell chamber includes two or more nozzles located adjacent to the edge of the wafer. A flow regulator is arranged with each of the two or more nozzles, which is configured to regulate an tap width of a deposited film flowing out through the each of the two or more nozzles. The electrochemical plating apparatus further includes a controller to control the flow regulator such that tap width of the deposited film includes a pre-determined surface profile. The two or more nozzles are located in radially or angularly different dispensing positions above the wafer.
-
Patent Agency Ranking
公开(公告)号：US12006587B2
公开(公告)日：2024-06-11
申请号：US17180670
申请日：2021-02-19
Applicant: Mark R. Schroeder
Inventor： Mark R. Schroeder
IPC: C25D3/56 , C03C15/00 , C03C17/10 , C25D5/00 , C25D5/02 , C25D5/20 , C25D5/54 , C25D7/00 , C25D21/10 , G01R33/07 , G01R33/09 , H01F1/055
CPC classification number: C25D3/562 , C03C15/00 , C03C17/10 , C25D5/009 , C25D5/022 , C25D5/20 , C25D5/54 , C25D7/00 , C25D21/10 , G01R33/07 , G01R33/096 , H01F1/055 , C03C2217/261 , C03C2217/27 , C03C2218/115 , C03C2218/31 , C03C2218/34
Abstract: In one example, a method to manufacture a magnetic sensor, comprises providing an electrolyte solution, submersing a substrate in the electrolyte solution, submersing a plurality of ingots in the electrolyte solution, wherein the ingots comprises a metal that is magnetic, and depositing the metal on the substrate by applying a voltage between the metal ingot and the substrate to result in magnetic alloy layer on the substrate. Other examples and related methods are also disclosed herein.
-
公开(公告)号：US20240141541A1
公开(公告)日：2024-05-02
申请号：US18549426
申请日：2022-03-15
Applicant: Lam Research Corporation
Inventor： Lee Peng Chua , Gabriel Hay Graham , Bryan L. Buckalew , Stephen J. Banik, II , Santosh Kumar , James Isaac Fortner , Robert Rash , Steven T. Mayer
IPC: C25D17/00 , C25D5/02 , C25D5/08 , C25D5/54 , H01L21/288
CPC classification number: C25D17/008 , C25D5/022 , C25D5/08 , C25D5/54 , C25D17/001 , H01L21/2885
Abstract: An apparatus for electroplating a metal on a semiconductor substrate with high control over plated thickness on a die-level includes an ionically resistive ionically permeable element (e.g., a plate with channels), where the element allows for flow of ionic current through the element towards the substrate during electroplating, where the element includes a plurality of regions, each region having a pattern of varied local resistance, and where the pattern of varied local resistance repeats in at least two regions. An electroplating method includes providing a semiconductor substrate to an electroplating apparatus having an ionically resistive ionically permeable element or a grid-like shield having a pattern correlating with a pattern of features on the substrate, and plating metal, while the pattern on the substrate remains spatially aligned with the pattern of the element or the grid-like shield for at least a portion of the total electroplating time.
-
公开(公告)号：US11824229B2
公开(公告)日：2023-11-21
申请号：US16649172
申请日：2018-09-20
Applicant: NEXGEN Materials, LLC
Inventor： Alexander A. Bistrika , Jacob Donovan Tenhoff , Erica Viola Lewis , Jordan Loos , Gerard W. Kesselring , Bill Jay Brooks
IPC: H01M8/0228 , C23F17/00 , C25D5/48 , C25D5/54 , F28F21/02 , H01L23/373 , H01M8/0206 , H01M8/0232 , H01M8/0245 , H01M8/18 , C25D5/00 , H01M8/0226 , H01M8/10
CPC classification number: H01M8/0228 , C23F17/00 , C25D5/48 , C25D5/54 , C25D5/605 , F28F21/02 , H01L23/3736 , H01M8/0206 , H01M8/0226 , H01M8/0232 , H01M8/0245 , H01M8/188 , H01M2008/1095
Abstract: The present invention includes methods of manufacturing a metal infused graphitic material. Also described is how this device may be rendered impermeable. The present invention includes the electroplating/electroless deposition of metal on exposed internal and external surfaces of a porous graphitic substrate. The deposition of metal on the internal structure is accomplished by replacing the void space in the porous substrate with an electrolyte solution containing dissolved metallic species. The plating is initiated either through electrochemical means, electroless means, chemical vapor deposition means, or other means obvious to one familiar in the art of metal plating. A post-deposition bath is also described wherein the plating may be removed from one or both sides of the external surface without impacting the internal pore plating.
-
公开(公告)号：US20180327918A1
公开(公告)日：2018-11-15
申请号：US15777523
申请日：2016-11-02
Inventor： Xiaoguang WANG , Lifeng LIU
CPC classification number: C25B11/0405 , C23C14/0021 , C25B1/04 , C25B11/035 , C25B11/0415 , C25B11/0447 , C25D3/12 , C25D5/48 , C25D5/54 , C25D7/00 , Y02E60/366
Abstract: A system which includes two electrodes for use as cathode and anode, respectively, can perform water electrolysis. Each of the two electrodes includes a self-supporting electrode material containing a porous core material and a coating material. The porous core material includes carbon, and the coating material contains a transition metal phosphide. The two electrodes include identical electrode material, and each of the electrodes contains a connector to connect to a power source.
-
公开(公告)号：US20180065146A1
公开(公告)日：2018-03-08
申请号：US15284353
申请日：2016-10-03
Applicant: DONGGUAN ESTIN HOME PRODUCTS CO. LTD
Inventor： Shibo LIU
IPC: B05D3/06 , F21S6/00 , F21S9/02 , F21S10/04 , F21V23/04 , F21V23/00 , F21V3/04 , C25D3/04 , C25D5/54 , C25D21/04 , C25D3/46 , B05D1/02 , B05D7/00
CPC classification number: B05D3/06 , B05D1/02 , B05D5/06 , B05D7/54 , B05D2203/35 , B05D2254/06 , B05D2350/65 , B44C1/228 , B44F1/00 , C25D3/04 , C25D3/46 , C25D5/54 , C25D21/04 , F21S6/001 , F21S9/02 , F21S10/04 , F21V3/061 , F21V23/003 , F21V23/0435 , F21W2121/00 , F21Y2115/10
Abstract: The present invention relates to a production technique of a 3D glass candle lamp. Transparent glass is processed, the interior of the glass is formed by a laser method, and by conducting electroplating and color plating on the inner surface and the outer surface of the glass correspondingly, under the condition that a light source of the glass lamp is available, light is reflected by the inner electroplated layer and the outer electroplated layer, and thus clearly-layered 3D patterns are formed at the positions of laser patterns; in addition, the colors of the patterns can change along with plating colors and the color of the light source, and the scene illumination effect is additionally achieved.
-
-
-
-
-
-
-
-
-
Search Results
668
records
(took 0.026 seconds)
