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    ELECTRONIC DEVICE HAVING HOUSING HAVING MATT SURFACE AND METHOD OF PRODUCING THE SAME
    2.
    发明申请
    ELECTRONIC DEVICE HAVING HOUSING HAVING MATT SURFACE AND METHOD OF PRODUCING THE SAME 有权

    公开(公告)号：US20220400569A1

    公开(公告)日：2022-12-15

    申请号：US17811402

    申请日：2022-07-08

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yoonhee LEE ,  Juncheol SHIN ,  Hangyu HWANG ,  Yucheol KIM ,  Jungmin YEO

    IPC: H05K5/04 ,  C25D21/00 ,  C25D11/24

    Abstract: Disclosed are an electronic device including a housing having a matte surface and a method of manufacturing the same. An electronic device according to various embodiments of the disclosure is an electronic device including a housing. The housing may include a base material including an aluminum alloy, a plurality of pits adjacently formed on a surface of the base material, and a crystal grain boundary protrusion part formed as a crystal grain boundary of the surface of the base material portion protrudes on the surface. A method of manufacturing a housing for an electronic device may include an etching step of generating irregularities on a surface of a base material including an aluminum alloy in a way to etch the base material by dipping the base material into an etching solution containing chloride ions, and an anodizing step of forming an anodizing layer on the surface of the base material by dipping, into an anodizing solution, the base material on which the etching step has been completed and applying a current to the base material by using the base material as an anode.

    DEVICE AND METHOD FOR PREVENTING COPPER PLATING OF CONDUCTOR ROLL
    3.
    发明申请
    DEVICE AND METHOD FOR PREVENTING COPPER PLATING OF CONDUCTOR ROLL 有权

    公开(公告)号：US20220282390A1

    公开(公告)日：2022-09-08

    申请号：US17752105

    申请日：2022-05-24

    Applicant: Chongqing JIMAT New Material Technology Co., Ltd.

    Inventor： Shiwei ZANG ,  Wenqing LIU

    IPC: C25D3/38 ,  C25D17/10 ,  C25D21/00

    Abstract: The present invention discloses a device and method for preventing copper plating of a conductor roll in the technical field of manufacturing of copper electroplating films. A conductor roll and an electroplating anode are respectively connected to the negative output end and the positive output end of a first power source, the conductor roll and the electroplating anode electroplate a plating product flowing through plating pool bath after being electrified, and the conductor roll is connected to the positive output end of a second power source and mated with an auxiliary electrode connected to the negative output end of the second power source to realize the electrolysis of the conductor roll so that the conductor roll avoids copper deposition when electroplating the plating product. The present invention can realize the electrolysis of bath near the conductor roll on the premise of completing electroplating by the conductor roll so that the copper electroplating process and the copper electrolyzing process are balanced on the conductor roll to avoid residual copper on the conductor roll so as to improve the copper plating quality of the plating product, and the present invention does not increase the procedure of the electroplating process or affect the implementation of the electroplating process.

    Electroplating device
    5.
    发明授权
    Electroplating device 有权

    公开(公告)号：US10968530B2

    公开(公告)日：2021-04-06

    申请号：US16260153

    申请日：2019-01-29

    Applicant: EBARA CORPORATION

    Inventor： Mitsuhiro Shamoto ,  Tsutomu Nakada ,  Masashi Shimoyama

    IPC: C25D17/12 ,  H01L21/67 ,  H01L21/687 ,  C25D17/06 ,  C25D5/08 ,  C25D21/00 ,  C25D17/00

    Abstract: In-plane uniformity of a membrane electroplated on a polygon substrate is improved. An electroplating device includes an anode holder configured to hold an anode, a substrate holder configured to hold a polygon substrate, and a regulation plate provided between the anode holder and the substrate holder. The regulation plate has a body portion having a first polygon opening following an outer shape of the polygon substrate, and wall portions protruding on a substrate holder side from edges of the first polygon opening. The wall portions protrude over a first distance on the substrate holder side in first regions which contain middle portions of sides of the first polygon opening, and are notched in second regions which contain corner portions of the first polygon opening, or protrude over a second distance smaller than the first distance on the substrate holder side.

    CLEANING DEVICE FOR CLEANING ELECTROPLATING SUBSTRATE HOLDER
    8.
    发明申请
    CLEANING DEVICE FOR CLEANING ELECTROPLATING SUBSTRATE HOLDER 审中-公开
    用于清洁电镀基板支架的清洁装置

    公开(公告)号：US20170056934A1

    公开(公告)日：2017-03-02

    申请号：US14839625

    申请日：2015-08-28

    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

    Inventor： Yu-Young WANG ,  Chung-En KAO ,  Victor Y. LU

    IPC: B08B3/02 ,  C25D17/06 ,  C25D21/00 ,  B08B3/10 ,  B08B3/08

    CPC classification number: B08B3/02 ,  B08B2203/0229 ,  C25D17/06 ,  C25D21/00

    Abstract: A cleaning device for removing contamination on a substrate holder used with an electroplating cell includes an arm, a cleaning agent supplier, a nozzle and a receiver. The cleaning agent supplier is coupled to the arm and configured to supply a cleaning agent. The nozzle is coupled to the cleaning agent supplier and configured to spray the cleaning agent onto the substrate holder to remove the contamination. The receiver is coupled to the arm and configured to receive the cleaning agent after the cleaning agent is sprayed onto the substrate holder.

    Abstract translation: 用于去除与电镀槽一起使用的衬底保持器上的污染的清洁装置包括臂，清洁剂供应器，喷嘴和接收器。 清洁剂供应商联接到臂并且构造成供应清洁剂。 喷嘴连接到清洁剂供应商并且被配置为将清洁剂喷射到基板保持器上以除去污染物。 接收器耦合到臂并且被配置为在将清洁剂喷射到基板保持器上之后接收清洁剂。

    DROPLET BILAYER FORMATION USING THROUGHPUT LIQUID HANDLING TECHNIQUES
    9.
    发明申请
    DROPLET BILAYER FORMATION USING THROUGHPUT LIQUID HANDLING TECHNIQUES 有权
    使用液体液体处理技术制成的双层双层结构

    公开(公告)号：US20130056358A1

    公开(公告)日：2013-03-07

    申请号：US13520339

    申请日：2011-01-05

    Applicant: Jason L. Poulos ,  Jacob J. Schmidt

    Inventor： Jason L. Poulos ,  Jacob J. Schmidt

    IPC: C25D5/02 ,  C25D17/16 ,  C25D17/10 ,  G01N27/00 ,  C25D21/00

    CPC classification number: C40B50/08 ,  C40B40/14 ,  G01N33/48728

    Abstract: The invention relates to methods and devices for forming and measuring lipid bilayers, for example, by joining lipid monolayers that self-assemble at the interface of aqueous and organic phases using sessile aqueous droplets in contact with a measurement electrode. At least one of the aqueous solution, the lower aqueous phase, and/or the upper organic phase comprise lipids. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

    Abstract translation: 本发明涉及用于形成和测量脂质双层的方法和装置，例如通过连接使用与测量电极接触的无固定水性液滴在水相和有机相的界面处自组装的脂质单层。 水溶液，下部水相和/或上部有机相中的至少一种包含脂质。 该摘要旨在作为用于在特定技术中进行搜索的扫描工具，而不意在限制本发明。

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