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公开(公告)号：US20230046780A1
公开(公告)日：2023-02-16
申请号：US17790545
申请日：2020-06-10
发明人： Yukiya KATO , Hirotaka KOTANI , Tatsuhiro DOI , Takao TOMIYA , Hiroto NARIEDA
摘要： There is provided a composite plating material and a related technique thereof, the composite plating material including: a base material, and a composite plating layer on the base material, the composite plating layer comprising a composite material containing carbon particles and Sb in an Ag layer, with a carbon content of 6.0 mass % or more and a Sb content of 0.5 mass % or more.
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公开(公告)号：US20180274074A1
公开(公告)日：2018-09-27
申请号：US15760693
申请日：2016-08-29
摘要： A copper alloy sheet material has a copper alloy component system that has a high conductivity of 75.0% IACS or more and has both high strength and good stress relaxation resistance characteristics. A copper alloy sheet material has a composition containing, by mass %, from 0.01 to 0.50% of Zr, from 0.01 to 0.50% of Sn, a total content of from 0 to 0.50% of Mg, Al, Si, P, Ti, Cr, Mn, Co, Ni, Zn, Fe, Ag, Ca, and B, with the balance Cu, and unavoidable impurities, and a metal structure having a number density NA Of fine second phase particles having a particle diameter of approximately from 5 to 50 nm of 10.0 per 0.12 mm2 or more and a ratio NB/NA of a number density NB (per 0.012 mm2) of coarse second phase particles having a particle diameter exceeding approximately 0.2 mm and the NA of 0.50 or less.
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3.发明公开公开(公告)号：US20240287699A1
公开(公告)日：2024-08-29
申请号：US18563521
申请日：2022-03-17
发明人： Hirotaka KOTANI , Hiroto NARIEDA , Takao TOMIYA , Tatsuhiro DOI , Yukiya KATO , Hirotaka TAKAHASHI
摘要： There is provided a composite material in which an oxygen-containing silver-based coating layer is formed on a base material. the oxygen-containing silver-based coating layer containing silver and having oxygen present in the vicinity of its surface. and the base material comprising copper or copper alloy.
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公开(公告)号：US20200290316A1
公开(公告)日：2020-09-17
申请号：US16800833
申请日：2020-02-25
发明人： Meoung-whan CHO , Il-ho KIM , Seog-woo LEE , Young-suk KIM , Hiroto NARIEDA , Tomotsugu AOYAMA
摘要： A heat sink plate includes a first layer made of copper (Cu) or a copper (Cu) alloy, a second layer formed on the first layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), a third layer formed on the second layer and made of copper (Cu) or a copper (Cu) alloy, a fourth layer formed on the third layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), and a fifth layer formed on the fourth layer and made of copper (Cu) or a copper (Cu) alloy.
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公开(公告)号：US20240200169A1
公开(公告)日：2024-06-20
申请号：US18554884
申请日：2022-06-21
摘要： There is provided a copper alloy sheet material, containing: 0.0005% by mass or more and 0.1% by mass or less of Ni, 0.0005% by mass or more and 0.1% by mass or less of Sn, 100 ppm or less of C, 800 ppm or less of O, 10 ppm or less of H, and 50 ppm or less of Ag, with a balance being Cu and impurities, wherein a total content of Ni and Sn is 0.001% by mass or more and 0.11% by mass or less, and when a content of the impurities is expressed as A to B (ppm) in consideration of a quantitative lower limit of each element (here, A is a total impurity content when a content of elements less than the quantitative lower limit is deemed 0 ppm, and B is a total impurity content when a content of the element less than the quantitative lower limit is deemed the quantitative lower limit of each element), A is 100 or less and B is 250 or less.
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公开(公告)号：US20230175160A1
公开(公告)日：2023-06-08
申请号：US17923692
申请日：2021-04-21
发明人： Yukiya KATO , Hirotaka TAKAHASHI , Tatsuhiro DOI , Hirotaka KOTANI , Takao TOMIYA , Hiroto NARIEDA
摘要： A composite material including a composite film formed on a base material, the composite film including a silver layer containing carbon particles, wherein a content of Sb in the composite film is 1 mass % or less, and a crystallite size of silver in the composite film is 40 nm or less.
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公开(公告)号：US20180245230A1
公开(公告)日：2018-08-30
申请号：US15752996
申请日：2016-08-23
发明人： Yuta SONODA , Hiroto NARIEDA , Hideki ENDO , Akira SUGAWARA , Hirotaka KOTANI , Jyun TOYOIZUMI , Takaya KANDO , Yuya KISHIBATA
CPC分类号： C25D5/12 , B32B15/01 , B32B2311/12 , B32B2311/16 , B32B2311/22 , C25D3/12 , C25D3/32 , C25D3/38 , C25D5/50 , C25D5/505 , H01R13/03 , H01R43/16
摘要： A tin-plated product contains: a substrate 10 of copper or a copper alloy; an underlying layer 12 of nickel which is formed on the surface of the substrate 10; and an outermost layer 14 containing tin, the outermost layer 14 being formed on the surface of the underlying layer 12, the outermost layer 14 being composed of a copper-tin alloy layer 14a of a large number of crystal grains of a copper-tin alloy, tin layers 14b of tin having an average thickness of 0.01 to 0.20 micrometers, and a plurality of copper-nickel-tin alloy layers 14c of a copper-nickel-tin alloy, each of the tin layers 14b being formed in a corresponding one of recessed portions between adjacent two of the crystal grains of the copper-tin alloy on the outermost surface of the copper-tin alloy layer, the copper-nickel-tin alloy layers 14c being arranged on the side of the underlying layer 12 in the copper-tin alloy layer 14a so as to be apart from each other.
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8.发明申请COPPER ALLOY SHEET MATERIAL AND METHOD FOR PRODUCING SAME, AND CURRENT-CARRYING COMPONENT 审中-公开铜合金板材及其制造方法和电流承载构件公开(公告)号：US20160201179A1
公开(公告)日：2016-07-14
申请号：US14912641
申请日：2014-08-26
发明人： Kuniaki MIYAGI , Takashi SUGA , Tomotsugu AOYAMA , Hiroto NARIEDA , Hideki ENDO , Akira SUGAWARA
摘要： A copper alloy sheet material contains, in mass %, Fe: 0.05 to 2.50%, Mg: 0.03 to 1.00%, and P: 0.01 to 0.20%, and the contents of these elements satisfy the relation Mg-1.18(P—Fe/3.6)3 0.03. The Mg solid-solution ratio determined by the amount of dissolved Mg (mass %)/the Mg content of the alloy (mass %)’ 100 is 50% or more. The density of an Fe—P-based compound having a particle size of 50 nm or more is 10.00 particles/10 mm2 or less, and the density of an Mg—P-based compound having a particle size of 100 nm or more is 10.00 particles/10 mm2 or less. The Cu—Fe—P—Mg-based copper alloy sheet material is excellent in terms of electrical conductivity, strength, bending workability, and stress relaxation resistance in the case where load stress is applied in a direction perpendicular to both a rolling direction and a sheet thickness direction.
摘要翻译： 铜合金板材以质量％计含有Fe：0.05〜2.50％，Mg：0.03〜1.00％，P：0.01〜0.20％，这些元素的含量满足Mg-1.18（P-Fe / 3.6）3 0.03。 通过溶解的Mg（质量％）/合金的Mg含量（质量％）100测定的Mg固溶体比例为50％以上。 粒径为50nm以上的Fe-P系化合物的密度为10.00个/ 10mm2以下，粒径为100nm以上的Mg-P系化合物的密度为10.00 颗粒/ 10 mm2或更小。 Cu-Fe-P-Mg系铜合金板材在与轧制方向和垂直于轧制方向的方向上施加负荷应力的情况下，导电性，强度，弯曲加工性，耐应力松弛性优异 板厚方向。
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