REACTIVE SPUTTERING METHOD AND METHOD FOR PRODUCING LAMINATE FILM

    公开(公告)号:US20180105920A1

    公开(公告)日:2018-04-19

    申请号:US15562669

    申请日:2016-04-20

    Inventor: Hiroto WATANABE

    Abstract: Provided is a reactive sputtering method and the like that are capable of making it unlikely for a particle deposit deposited on a non-erosion region or a nodule generated in an erosion region to be peeled off from a sputtering target, and of suppressing arc discharge and the like.A reactive sputtering method for performing deposition by using a sputtering device including magnetron sputtering cathodes 17, 18, 19, and 20 in a vacuum chamber 10, and by introducing a process gas containing a reactive gas into the vacuum chamber is wherein the reactive gas includes an oxygen gas or a nitrogen gas, and water is contained in the reactive gas. The action of water contained in the reactive gas makes it unlikely for a particle deposit and a nodule to be peeled off from a sputtering target, and also reduces the electric charges of the charged particle deposit or nodule, allowing arc discharge and the like to be suppressed.

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