-
公开(公告)号:US11830638B2
公开(公告)日:2023-11-28
申请号:US17269718
申请日:2019-06-13
Applicant: Sumitomo Electric Industries, Ltd. , Sumitomo Wiring Systems, Ltd. , AutoNetworks Technologies, Ltd.
Inventor: Kei Sakamoto , Akiko Inoue , Tetsuya Kuwabara , Yusuke Oshima , Minoru Nakamoto , Kazuhiro Nanjo , Taichiro Nishikawa , Yoshihiro Nakai , Yasuyuki Otsuka , Fumitoshi Imasato , Hiroyuki Kobayashi
Abstract: A covered electrical wire comprises a conductor and an insulating covering layer provided outside the conductor, the conductor being a stranded wire composed of a plurality of copper alloy wires composed of a copper alloy and twisted together, and having a wire diameter of 0.5 mm or less, the copper alloy containing Fe in an amount of 0.1% by mass or more and 1.6% by mass or less, P in an amount of 0.05% by mass or more and 0.7% by mass or less, and one or more elements selected from Ni, Al, Cr and Co in an amount of 0.01% by mass or more and 0.7% by mass or less in total, with a balance being Cu and impurities.
-
公开(公告)号:US20190237216A1
公开(公告)日:2019-08-01
申请号:US16383077
申请日:2019-04-12
Applicant: NTN CORPORATION
Inventor: Naoyuki UCHIYAMA , Akio NAKAJIMA
CPC classification number: H01B7/04 , B60K7/00 , B60K7/0007 , H01B3/445 , H01B7/0009 , H01B7/17 , H01B7/18 , H01B9/02 , H01B13/00
Abstract: Provided is an in-wheel motor power cable in which a cross-sectional area of a conductor portion can be sufficiently assured for allowing large current to pass therethrough while avoiding excessively large maximum diameter of the cable. The power cable includes a conductor portion; an insulator configured to cover an outer circumference of the conductor portion; a hollow shield wire configured to cover an outer circumference of the insulator; and a sheath configured to cover an outer circumference of the shield wire. The conductor portion comprises a composite strand obtained by stranding a plurality of wire strands each of which is a strand of a plurality of filaments with no insulating layer, each filament being a tin-plated soft copper wire. The insulator is a soft fluororesin, and the shield wire is a braided copper-foiled yarn cable.
-
公开(公告)号:US10068685B1
公开(公告)日:2018-09-04
申请号:US15435685
申请日:2017-02-17
Applicant: Superior Essex International LP
Inventor: Thomas Christopher Cook
IPC: H01B11/04 , H01B11/08 , H01B11/06 , H01B7/18 , H01B7/00 , H01B7/28 , H01B7/04 , H01B11/00 , H01B9/00 , H01B7/32 , H01B9/02 , H01B13/00
CPC classification number: H01B11/04 , H01B7/00 , H01B7/009 , H01B7/04 , H01B7/041 , H01B7/18 , H01B7/1805 , H01B7/182 , H01B7/1895 , H01B7/28 , H01B7/32 , H01B9/00 , H01B9/028 , H01B11/00 , H01B11/06 , H01B11/08 , H01B13/00
Abstract: A cable may include a plurality of twisted pairs of individually insulated conductors, a separator positioned between the twisted pairs, and a jacket formed around the twisted pairs and the separator. The separator may include a longitudinally extending spine positioned between the plurality of twisted pairs, and at least one prong respectively extending from the spine at each of a plurality of longitudinally spaced locations. Additionally, for each pair of adjacent longitudinally spaced locations, the at least one prong extending at a first of the pair of locations may extend in a first set of one or more directions and the at least one prong extending at a second of the pair of locations may extend in a second set of one or more directions that is different than the first set of one or more directions.
-
公开(公告)号:US20180169755A1
公开(公告)日:2018-06-21
申请号:US15735255
申请日:2016-06-08
Applicant: NOF CORPORATION
Inventor: Yasunobu TAGAMI , Naoshi TAKAHASHI , Masayuki SAITOH , Kouhei SAWADA
CPC classification number: B22F1/0062 , B22F1/00 , B22F1/02 , B22F2301/10 , H01B1/02 , H01B1/026 , H01B1/22 , H01B5/00 , H01B13/00
Abstract: There are provided a surface-coated copper filler having an excellent oxidation resistance for use in a conductive composition, a method for producing the surface-coated copper filler, and a conductive composition containing the surface-coated copper filler. The surface-coated copper filler comprises: a copper particle; a first coating layer containing an amine compound, which is bonded to copper on a surface of the copper particle via a chemical bond and/or a physical bond; and a second coating layer containing an aliphatic monocarboxylic acid having 8 to 20 carbon atoms, which is bonded to the amine compound via a chemical bond. The amine compound is represented by the following formula (1): H2NCH2mNHnCH2mNH2 (1) wherein m is an integer of 0 to 3, n is an integer of 0 to 2, m is 0 to 3 when n is 0, and m is 1 to 3 when n is 1 or 2.
-
公开(公告)号:US09984792B2
公开(公告)日:2018-05-29
申请号:US14936121
申请日:2015-11-09
Applicant: Hitachi Metals, Ltd.
Inventor: Tamotsu Kibe , Hisao Furuichi , Hiroshi Okikawa , Ryutaro Kikuchi
CPC classification number: H01B7/04 , H01B3/441 , H01B3/446 , H01B5/00 , H01B7/00 , H01B7/0216 , H01B7/295 , H01B13/00
Abstract: An electric wire includes a conductor having a cross-sectional area of not less than 290 mm2 and not more than 360 mm2, an insulation provided so as to cover the outer periphery of the conductor, and a wire sheath provided so as to cover the outer periphery of the insulation. The amount of deflection is not less than 120 mm when, at 23° C., one end of the electric wire is fixed to a fixture table so that another end horizontally protrudes 400 mm from the fixture table and a weight of 2 kg is attached to the other end, and cracks and breaks do not occur when wound with a bending diameter of three times the diameter at −40° C.
-
公开(公告)号:US20180130575A1
公开(公告)日:2018-05-10
申请号:US15866233
申请日:2018-01-09
Applicant: The University of Houston System
Inventor: Goran Majkic , Venkat Selvamanickam
IPC: H01B12/06 , H01B13/008 , H01B13/00 , C23C16/448 , C23C16/54 , H01L39/24 , C23C16/02 , C23C16/40
CPC classification number: H01B12/06 , C23C16/0209 , C23C16/408 , C23C16/448 , C23C16/545 , H01B13/00 , H01B13/0026 , H01B13/008 , H01L39/2441
Abstract: An MOCVD system fabricates high quality superconductor tapes with variable thicknesses. The MOCVD system can include a gas flow chamber between two parallel channels in a housing. A substrate tape is heated and then passed through the MOCVD housing such that the gas flow is perpendicular to the tape's surface. Precursors are injected into the gas flow for deposition on the substrate tape. In this way, superconductor tapes can be fabricated with variable thicknesses, uniform precursor deposition, and high critical current densities.
-
公开(公告)号:US20180105920A1
公开(公告)日:2018-04-19
申请号:US15562669
申请日:2016-04-20
Applicant: SUMITOMO METAL MINING CO., LTD.
Inventor: Hiroto WATANABE
CPC classification number: C23C14/0036 , B32B15/043 , C23C14/08 , C23C14/14 , C23C14/185 , C23C14/35 , C23C14/562 , H01B13/00
Abstract: Provided is a reactive sputtering method and the like that are capable of making it unlikely for a particle deposit deposited on a non-erosion region or a nodule generated in an erosion region to be peeled off from a sputtering target, and of suppressing arc discharge and the like.A reactive sputtering method for performing deposition by using a sputtering device including magnetron sputtering cathodes 17, 18, 19, and 20 in a vacuum chamber 10, and by introducing a process gas containing a reactive gas into the vacuum chamber is wherein the reactive gas includes an oxygen gas or a nitrogen gas, and water is contained in the reactive gas. The action of water contained in the reactive gas makes it unlikely for a particle deposit and a nodule to be peeled off from a sputtering target, and also reduces the electric charges of the charged particle deposit or nodule, allowing arc discharge and the like to be suppressed.
-
公开(公告)号:US09872386B2
公开(公告)日:2018-01-16
申请号:US15503637
申请日:2015-09-01
Applicant: LG CHEM, LTD.
Inventor: Chee-Sung Park , Cheol-Hee Park , Ha Na Lee , Han Nah Jeong , Jae Hyun Kim , Shin Hee Jun , Eun Kyu Seong , Su Jeong Lee
CPC classification number: H05K1/09 , C08J7/123 , C08J2369/00 , C08K3/22 , C08K2003/2248 , C08K2003/2293 , C23C18/1612 , C23C18/1641 , C23C18/2013 , C23C18/204 , H01B1/22 , H01B5/14 , H01B13/00 , H05K1/0353 , H05K3/105 , H05K3/181 , H05K2201/032
Abstract: The present invention relates to a composition for forming a conductive pattern which allows micro conductive patterns to be formed on various polymeric resin products or resin layers by a very simplified process, a method for forming a conductive pattern using the composition, and a resin structure having the conductive pattern. The composition for forming a conductive pattern comprises: a polymeric resin; and a nonconductive metallic compound including a first metal, a second metal and a third metal, wherein the nonconductive metallic compound has a three-dimensional structure including a plurality of first layers (edge-shared octahedral layers) having a structure in which octahedrons comprising two metals from among the first metal, the second metal and the third metal which share the edges thereof with one another are two-dimensionally connected to one other, and a second layer which includes a metal of a different type from the first layer and is arranged between adjacent first layers, and wherein a metallic core including the first metal, the second metal or the third metal or an ion thereof is formed from the nonconductive metallic compound by electromagnetic radiation.
-
公开(公告)号:US09870841B2
公开(公告)日:2018-01-16
申请号:US15464828
申请日:2017-03-21
Inventor: Sho Yoshida , Shigeki Sekiya , Kengo Mitose
IPC: H01B1/02 , C22C21/08 , C22C21/02 , C22F1/047 , C22F1/043 , H01B5/02 , H01B5/08 , H01B7/02 , H01B7/00 , H01B13/00 , B21C1/02
CPC classification number: H01B1/023 , B21C1/02 , C22C21/02 , C22C21/08 , C22F1/00 , C22F1/04 , C22F1/043 , C22F1/047 , H01B1/02 , H01B5/02 , H01B5/08 , H01B7/00 , H01B7/0045 , H01B7/02 , H01B13/00 , H01B13/0016
Abstract: An aluminum alloy wire rod has a composition including 0.1-1.0 mass % Mg; 0.1-1.0 mass % Si; 0.01-1.40 mass % Fe; 0.000-0.100 mass % Ti; 0.000-0.030 mass % B; 0.00-1.00 mass % Cu; 0.00-0.50 mass % Ag; 0.00-0.50 mass % Au; 0.00-1.00 mass % Mn; 0.00-1.00 mass % Cr; 0.00-0.50 mass % Zr; 0.00-0.50 mass % Hf; 0.00-0.50 mass % V; 0.00-0.50 mass % Sc; 0.00-0.50 mass % Sn; 0.00-0.50 mass % Co; 0.00-0.50 mass % Ni; and the balance being Al and inevitable impurities, and an area fraction of a region in which an angle formed by a longitudinal direction of the aluminum alloy wire rod and a direction of a crystal is within 20° is greater than or equal to 20% and less than or equal to 65%.
-
公开(公告)号:US09837191B2
公开(公告)日:2017-12-05
申请号:US14146356
申请日:2014-01-02
Applicant: Raytheon Company
Inventor: Rigel Q. Woida-O'Brien
CPC classification number: H01B13/00 , B29C64/112 , B29C64/386 , B29K2995/0006 , B29K2995/0007 , B29L2031/3462 , B29L2031/707 , B33Y10/00 , B33Y80/00 , H05K1/147 , H05K2201/10189
Abstract: Embodiments are directed to a method for manufacturing a product comprising: establishing, by a computing device comprising a processor, at least one parameter of a particular instance of a component to be used in the product, adapting, by the computing device, a baseline model of the component based on the at least one parameter to accommodate use of the particular instance of the component, growing a structure based on the adapted model to accommodate the particular instance of the component using an additive manufacturing technique, coupling the structure to the particular instance of the component, growing an electrical harness by using additive printing to establish an electrical cable, and assembling the product by coupling the electrical harness to the particular instance of the component.
-
-
-
-
-
-
-
-
-