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公开(公告)号：US20230250535A1
公开(公告)日：2023-08-10
申请号：US18119350
申请日：2023-03-09
申请人： C3 Nano, Inc.
发明人： Yongxing Hu , Xiqiang Yang , Ying-Syi Li , Alexander Seung-il Hong , Melanie Mariko Inouye , Yadong Cao , Ajay Virkar
IPC分类号： C23C18/44 , C23C18/54 , C09D133/06 , C23C18/16 , B32B27/20 , B32B9/04 , B32B27/28 , B32B27/08 , B32B15/04 , B32B15/08 , B82Y30/00 , C09D11/52 , C09D101/02 , C09D139/06 , C23C18/42 , H01B1/22 , H01B13/30 , H05K1/02 , H05K1/09 , H05K3/10 , H05K3/12 , B32B15/01
CPC分类号： C23C18/44 , B32B9/045 , B32B15/04 , B32B15/08 , B32B15/018 , B32B27/08 , B32B27/20 , B32B27/28 , B82Y30/00 , C09D11/52 , C09D101/02 , C09D133/06 , C09D139/06 , C23C18/42 , C23C18/54 , C23C18/1635 , C23C18/1637 , H01B1/22 , H01B13/30 , H05K1/02 , H05K1/097 , H05K1/0274 , H05K3/10 , H05K3/105 , H05K3/1283 , C09D105/08
摘要： Metal nanowires with uniform noble metal coatings are described. Two methods, galvanic exchange and direct deposition, are disclosed for the successful formation of the uniform noble metal coatings. Both the galvanic exchange reaction and the direct deposition method benefit from the inclusion of appropriately strong binding ligands to control or mediate the coating process to provide for the formation of a uniform coating. The noble metal coated nanowires are effective for the production of stable transparent conductive films, which may comprise a fused metal nanostructured network.
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公开(公告)号：US11718727B2
公开(公告)日：2023-08-08
申请号：US16496591
申请日：2018-03-26
发明人： Sven Fünderich , David Garcia Martinez , Thomas Futterer , Christian Litterscheid , Rüdiger Wissemborski , Jorge Flores
IPC分类号： C08K3/01 , C08K3/32 , C23C18/14 , C08K3/30 , C08K5/00 , C23C18/16 , C25D5/56 , G03F7/20 , H05K1/03 , H05K3/10
CPC分类号： C08K3/01 , C08K3/30 , C08K3/32 , C08K5/0008 , C23C18/1612 , C25D5/56 , G03F7/2053 , H05K1/0373 , H05K3/105
摘要： A method for manufacturing electrically conductive structures, preferably conductive pathway structures using laser beams on a non-conductive carrier (LDS method), wherein a non-conductive carrier material is provided which contains at least one inorganic metal phosphate compound and at least one stabiliser finely distributed or dissolved therein, the carrier material is irradiated in regions by laser beams generating the electrically conductive structures in the irradiated regions.
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公开(公告)号：US20180358504A1
公开(公告)日：2018-12-13
申请号：US16053959
申请日：2018-08-03
IPC分类号： H01L31/18 , H01L33/42 , H01L31/0224 , H01L33/00 , B82Y10/00 , H01L51/00 , B82Y30/00 , H01B1/24 , H05K3/10
CPC分类号： H01L31/1884 , B82Y10/00 , B82Y30/00 , H01B1/24 , H01L31/022408 , H01L31/022425 , H01L31/022466 , H01L33/005 , H01L33/42 , H01L51/0021 , H05K3/105 , H05K2201/0108 , H05K2201/026 , H05K2203/1194 , Y02E10/50
摘要： A method of forming a metal silicide nanowire network that includes multiple metal silicide nanowires fused together in an orderly arrangement on a substrate. The metal silicide nanowire network can be formed by printing a first set of multiple parallel silicon nanowires on the substrate and printing a second set of multiple parallel silicon nanowires over the first set of multiple parallel silicon nanowires such that said first set is perpendicular to said second set. A metal layer can be formed on the silicon nanowires. A silicidation anneal process is performed such that metal silicide nanowires are formed and fused together in an orderly arrangement, forming a grid network. After the silicidation anneal is performed, any unreacted silicon or metal can be selectively removed.
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公开(公告)号：US10059821B2
公开(公告)日：2018-08-28
申请号：US15133295
申请日：2016-04-20
IPC分类号： H01L21/027 , C08J7/16 , H01B1/12 , C08F212/14 , C08J7/04 , C08J7/12 , C08G73/02 , B05D7/04 , B05D3/06 , B05D7/00 , H05K3/02 , H05K3/10 , B05D3/10 , G03F7/004 , G03F7/40
CPC分类号： B05D7/544 , B05D3/067 , B05D3/101 , B05D7/04 , B05D7/584 , C08F12/30 , C08F212/14 , C08G73/0266 , C08J3/24 , C08J7/047 , C08J7/123 , C08J2367/02 , C08J2400/12 , C08J2400/14 , C08J2425/08 , C09D125/18 , G03F7/004 , G03F7/0047 , G03F7/038 , G03F7/40 , H01B1/128 , H05K3/02 , H05K3/105 , H05K2203/1136 , C08F2220/302 , C08F220/06
摘要： A method is used to provide an electrically-conductive polyaniline pattern by providing a uniform layer of a photocurable composition on a substrate. The photocurable composition comprises a water-soluble reactive polymer comprising (a) greater than 40 mol % of recurring units comprising sulfonic acid or sulfonate groups, and (b) at least 5 mol % of recurring units comprising a pendant group capable of crosslinking via [2+2] photocycloaddition. The photocurable composition is exposed to cause crosslinking via [2+2] photocycloaddition of the (b) recurring units, thereby forming a crosslinked polymer. Any remaining water-soluble reactive polymer is removed. The crosslinked polymer is contacted with an aniline reactive composition having aniline monomer and up to 0.5 molar of an aniline oxidizing agent, thereby forming an electrically-conductive polyaniline disposed either within, on top of, or both within and on top of, the crosslinked polymer.
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公开(公告)号：US20180217697A1
公开(公告)日：2018-08-02
申请号：US15747958
申请日：2016-08-17
发明人： Encai Hao , Matthew S. Stay , Albert I. Everaerts , Mahfuza B. Ali , Yizhong Wang , Kevin M. Lewandowski , Corey J. Radloff
CPC分类号： G06F3/044 , G06F2203/04103 , G06F2203/04112 , H05K1/0274 , H05K1/09 , H05K1/097 , H05K3/105 , H05K3/285 , H05K2201/0108 , H05K2201/026 , H05K2201/0338 , H05K2201/09245 , H05K2201/10151 , H05K2203/0143 , H05K2203/0315 , H05K2203/0759 , H05K2203/0783 , H05K2203/125
摘要： A transparent conductor is provided, including a visible light transparent substrate and metal traces disposed on the substrate, and a layer of a second metal deposited on at least a portion of the metal traces. The transparent conductor further includes a layer of a second metal, which conforms to the surface structure of the metal traces on which it is deposited. Optionally, the transparent conductor also includes a coating layer disposed on a portion of the metal traces and the substrate surface. The coating layer includes a polymer prepared from a polymerizable composition containing at least one ionic liquid monomer. A method of forming a transparent conductor is also provided, including obtaining a visible light transparent substrate having metal traces disposed on the substrate and applying a coating composition on a portion of the metal traces and substrate. The coating composition contains at least one noble metal salt and at least one polymerizable ionic liquid monomer.
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公开(公告)号：US09982113B2
公开(公告)日：2018-05-29
申请号：US15321907
申请日：2015-06-01
申请人： Merck Patent GmbH
CPC分类号： C08K9/02 , C01P2004/84 , C08K3/22 , C08K9/12 , C08K2003/2231 , C08K2003/2241 , C08K2201/002 , C08K2201/005 , C08L55/02 , C08L69/00 , C09C1/3661 , H05K1/0353 , H05K3/105 , H05K2203/107 , H05K2203/1136
摘要： The present invention relates to an LDS-active additive for LDS plastics, to a polymer composition comprising an additive of this type, and to an article having metallized conductor tracks in which a polymeric basic body of the article or a polymeric coating on a basic body comprises an LDS additive of the said type.
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7.发明申请公开(公告)号：US20180077795A1
公开(公告)日：2018-03-15
申请号：US15819857
申请日：2017-11-21
申请人： SMR Patents S.à.r.l.
发明人： Andreas Herrmann
CPC分类号： H05K1/0292 , B60R1/12 , H05K1/0201 , H05K1/028 , H05K1/0286 , H05K1/0306 , H05K1/0313 , H05K1/14 , H05K1/142 , H05K1/181 , H05K3/0014 , H05K3/105 , H05K3/341 , H05K3/361 , H05K2201/0187 , H05K2201/09027 , H05K2201/09118 , H05K2201/09963 , H05K2201/09972 , H05K2201/10386 , H05K2201/209 , H05K2203/107 , H05K2203/1453 , H05K2203/1461 , H05K2203/168 , Y10T29/49126
摘要： A method of making a printed circuit board and a printed circuit board including a plurality of plastic substrate parts having one or more first substrate parts each having at least one coupling means, and one or more second substrate parts each having at least one receiving means to receive the coupling mean. At least one of the plurality of plastic substrate parts is formed with a further structural element, and at least two of the plurality of plastic substrate parts are connected to each other through the at least one coupling means and the at least one receiving means. The connected substrate parts include a circuit.
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公开(公告)号：US20180049321A1
公开(公告)日：2018-02-15
申请号：US15231852
申请日：2016-08-09
CPC分类号： H05K3/105 , G03F7/06 , G03F7/063 , G03F7/0957 , H05K2203/125
摘要： A method is used to provide electrically-conductive silver metal from a photosensitive thin film or photosensitive thin film pattern on a substrate using a non-hydroxylic-solvent soluble silver complex represented by the following formula (I): (Ag+)a(L)b(P)c (I) wherein L represents an α-oxy carboxylate; P represents a primary alkylamine; a is 1 or 2; b is 1 or 2; and c is 1, 2, 3, or 4, provided that when a is 1, b is 1, and when a is 2, b is 2. A photosensitizer can also be present with the complex. The reducible silver ions in the photosensitive thin film or photosensitive thin film pattern photochemically can be reduced to provide electrically-conductive silver metal by irradiation with UV-visible electromagnetic radiation.
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公开(公告)号：US09832886B2
公开(公告)日：2017-11-28
申请号：US15125037
申请日：2015-03-05
发明人： Daisuke Kumaki , Shizuo Tokito , Yu Kobayashi , Shohei Norita
IPC分类号： H05K3/00 , H05K3/40 , H05K3/10 , H01L23/522 , H05K1/09 , H01L21/768
CPC分类号： H05K3/4038 , H01L21/76802 , H01L23/5226 , H05K1/092 , H05K3/105 , H05K3/4069 , Y10T29/49124
摘要： A method for forming a wiring according to the present invention includes: applying an ink (6) that exhibits electrical conductivity upon light absorption to a contact hole formation portion of an upper face of an insulating resin layer (3) formed on a lower wiring element (2); and irradiating the ink (6) with light to render the ink (6) conductive and also to remove a part of the insulating resin layer (3) by heat emitted from the ink (6) so as to form a contact hole (5), the part of the insulating resin layer (3) lying under the portion of the face to which the ink (6) is applied. A step of forming an upper wiring element (4) on the upper face of the insulating resin layer (3) may further be carried out, the upper wiring element (4) being electrically continuous with the lower wiring element (2) through the contact hole (5).
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公开(公告)号：US20170329230A1
公开(公告)日：2017-11-16
申请号：US15154712
申请日：2016-05-13
申请人： XEROX CORPORATION
发明人： Wayne A. BUCHAR , George A. GIBSON
CPC分类号： G03F7/2053 , G03F7/06 , G03F7/20 , G06K7/10009 , G06K19/0672 , H05K1/092 , H05K1/16 , H05K3/02 , H05K3/105 , H05K2201/10098 , H05K2203/0514 , H05K2203/0557 , H05K2203/056 , H05K2203/107 , H05K2203/125
摘要： A method for forming a structure for a radio frequency identification device includes dispensing a photosensitive compound onto a substrate. Subsequently, first portions of the photosensitive compound are exposed to a light pattern from a light source, while second portions of the photosensitive compound remain unexposed to the light source. Exposing the photosensitive compound to light reduces the photosensitive compound to a metal layer. The unexposed second portions of the photosensitive compound may be rinsed away to leave the metal layer. Processing may continue to form an RFID circuit from the metal layer, and a completed RFID transponder comprising the RFID circuit.
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