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公开(公告)号：US20240188220A1
公开(公告)日：2024-06-06
申请号：US18285001
申请日：2022-03-28
Applicant: RESONAC CORPORATION
Inventor： Shigeru YAMAKI , Shuhei YONEDA , Yasunao MIYAMURA , Kumiko TERAO
CPC classification number: H05K3/027 , H05K1/095 , H05K2201/0215 , H05K2201/026
Abstract: First and second transparent conducting layers each containing a binder resin and a nano-structured network having metal nanowire intersections, are respectively formed on first and second main faces of a transparent resin film, each of the first and second transparent conducting layers has an absorption peak based on the nano-structured network in an optical transmission spectrum, the transparent resin film has a thickness of 40 μm or more. After first and second protection layers are respectively formed on the first and second transparent conducting layer, only the first transparent conducting layer is etched from the first protection layer side so that a first transparent conducting pattern having a first conducting region and a first non-conducting region is formed by the first transparent conducting layer on the first main face.
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公开(公告)号：US20230319976A1
公开(公告)日：2023-10-05
申请号：US18124450
申请日：2023-03-21
Inventor： Klaus Haimlinger , Christian Hoelzl , Marco Gavagnin
CPC classification number: H05K1/0213 , H05K1/144 , H05K3/46 , H05K2201/026 , H05K2201/0379 , H05K2203/02 , H05K2201/058
Abstract: A carrier assembly may include a first carrier sub-assembly, said first carrier sub-assembly having an elongated shape and comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, said at least one electrically conductive layer structure extending up to a first area provided on one of two extremities of the elongated shape, wherein a first plurality of conductive nanowires is provided on said first area, and a second carrier sub-assembly, said second carrier sub-assembly comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, said at least one electrically conductive layer structure comprising a second area, wherein a second plurality of conductive nanowires is provided on that second area.
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公开(公告)号：US11668010B2
公开(公告)日：2023-06-06
申请号：US15354733
申请日：2016-11-17
Applicant: C3Nano Inc.
Inventor： Yongxing Hu , Xiqiang Yang , Ying-Syi Li , Alexander Seung-il Hong , Melanie Mariko Inouye , Yadong Cao , Ajay Virkar
IPC: C23C18/44 , C23C18/54 , C09D133/06 , C23C18/16 , B32B27/20 , B32B9/04 , B32B27/28 , B32B27/08 , B32B15/04 , B32B15/08 , B82Y30/00 , C09D11/52 , C09D101/02 , C09D139/06 , C23C18/42 , H01B1/22 , H01B13/30 , H05K1/02 , H05K1/09 , H05K3/10 , H05K3/12 , B32B15/01 , C09D105/08 , B82Y20/00
CPC classification number: C23C18/44 , B32B9/045 , B32B15/018 , B32B15/04 , B32B15/08 , B32B27/08 , B32B27/20 , B32B27/28 , B82Y30/00 , C09D11/52 , C09D101/02 , C09D133/06 , C09D139/06 , C23C18/1635 , C23C18/1637 , C23C18/42 , C23C18/54 , H01B1/22 , H01B13/30 , H05K1/02 , H05K1/0274 , H05K1/097 , H05K3/10 , H05K3/105 , H05K3/1283 , B32B2255/10 , B32B2255/26 , B32B2262/103 , B32B2262/12 , B32B2307/202 , B32B2307/412 , B32B2307/414 , B32B2457/20 , B82Y20/00 , C09D105/08 , H05K2201/0108 , H05K2201/026 , Y10T428/12444 , Y10T428/12479 , Y10T428/12486 , Y10T428/12889 , Y10T428/12896
Abstract: Metal nanowires with uniform noble metal coatings are described. Two methods, galvanic exchange and direct deposition, are disclosed for the successful formation of the uniform noble metal coatings. Both the galvanic exchange reaction and the direct deposition method benefit from the inclusion of appropriately strong binding ligands to control or mediate the coating process to provide for the formation of a uniform coating. The noble metal coated nanowires are effective for the production of stable transparent conductive films, which may comprise a fused metal nanostructured network.
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公开(公告)号：US20190239351A1
公开(公告)日：2019-08-01
申请号：US16381708
申请日：2019-04-11
Applicant: Microsoft Technology Licensing, LLC
Inventor： James David Holbery , Siyuan Ma , Michael David Dickey , Andrew L. Fassler
IPC: H05K1/03 , C08K7/00 , H05K3/00 , H05K1/09 , H01L23/538 , C09D183/04 , G06F1/16 , C08K3/08 , H05K1/02 , H05K3/28 , C09D5/24
CPC classification number: H05K1/0393 , C08K3/08 , C08K7/00 , C08K2003/0806 , C08K2201/001 , C08K2201/011 , C09D5/24 , C09D183/04 , G06F1/1669 , H01L23/5386 , H01L23/5387 , H05K1/028 , H05K1/0313 , H05K1/09 , H05K1/148 , H05K3/0014 , H05K3/285 , H05K2201/0245 , H05K2201/026 , H05K2201/0391 , H05K2203/0776
Abstract: One example provides a circuit structure comprising a liquid metal conductive path enclosed in an encapsulant, a polymer circuit support comprising a polymer having a functional species available for a condensation reaction, and a cross-linking agent covalently bonding the encapsulant to the polymer circuit support via the functional species.
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公开(公告)号：US10073549B2
公开(公告)日：2018-09-11
申请号：US14905160
申请日：2014-07-18
Applicant: Heraeus Deutschland GmbH & Co. KG
Inventor： Wilfried Lovenich , Rüdiger Sauer , Udo Guntermann
IPC: G06F3/041 , C09D5/24 , H01L51/00 , H01L51/10 , H01L51/44 , H01L51/52 , H05K9/00 , H05K3/06 , B22F7/04 , G06F3/044 , B22F1/00 , H05K1/09 , B22F3/24
CPC classification number: G06F3/041 , B22F1/0025 , B22F7/04 , B22F2003/244 , B22F2301/255 , C09D5/24 , G06F3/044 , G06F2203/04103 , G06F2203/04112 , H01L51/0023 , H01L51/102 , H01L51/442 , H01L51/5215 , H01L51/5234 , H05K1/097 , H05K3/067 , H05K9/0096 , H05K2201/026 , H05K2203/0789 , Y02E10/549 , Y02P70/521
Abstract: The present invention relates to the production of a layer structure, comprising the following process steps: i) coating a substrate with a composition at least comprising silver nanowires and a solvent; ii) at least partial removal of the solvent, thereby obtaining a substrate that is coated with an electrically conductive layer, the electrically conductive layer at least comprising the silver nanowires; iii) bringing into contact selected areas of the electrically conductive layer with an etching composition, thereby reducing the conductivity of the electrically conductive layer in these selected areas, wherein the etching composition comprises an organic compound capable of releasing chlorine, bromine or iodine, a compound containing hypochloride, a compound containing hypo-bromide or a mixture of at least two of these compounds. The invention also relates to a layer structure obtainable by this method, a layer structure, the use of a layer structure, an electronic component and the use of an organic compound.
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公开(公告)号：US10070515B2
公开(公告)日：2018-09-04
申请号：US15175510
申请日：2016-06-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Eun-soo Park , Keum-hwan Park , Ju-Ho Lee , Jin-man Park , Young-soo Lee
IPC: H05K1/09 , H05K1/02 , G09F9/30 , H01L31/0224 , H05K3/06
CPC classification number: H05K1/0274 , G09F9/301 , H01L31/022466 , H01L51/0021 , H01L51/442 , H05K1/097 , H05K3/06 , H05K2201/0108 , H05K2201/026 , Y02E10/549
Abstract: A transparent electrode using an amorphous alloy is provided. The transparent electrode includes a flexible substrate and an amorphous alloy layer configured to have conductivity and to be formed on the flexible substrate so as to have a plurality of voids.
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7.发明申请
公开(公告)号：US20180242465A1
公开(公告)日：2018-08-23
申请号：US15441146
申请日：2017-02-23
Applicant: Lawrence Livermore National Security, LLC
Inventor： Anna Hiszpanski , Thomas Yong-Jin Han , Carla Lim Watson , Timothy Dexter Yee
CPC classification number: C09K13/00 , B81C1/00031 , B81C1/00126 , B81C1/00206 , B81C1/00484 , B81C1/00531 , B81C2201/0149 , B81C2201/0194 , B82Y40/00 , H01B1/22 , H01B1/24 , H01L31/022466 , H01L31/1884 , H05K1/0274 , H05K2201/0108 , H05K2201/026 , Y10S977/888
Abstract: According to one embodiment, a method for creating a metal nanowire mesh the method includes forming a first layer of block copolymer, causing the block copolymer to become aligned in approximately straight lines, infiltrating one phase of the block copolymer with a metal, and removing the block copolymer where the metal remains after the block copolymer is removed. Furthermore, the method includes forming a second layer of block copolymer, causing the block copolymer in the second layer to become ordered in approximately straight lines oriented at an angle from greater than 0 degrees to 90 degrees from a mean direction of longitudinal axes of the remaining metal, infiltrating one phase of the block copolymer in the second layer with a second metal, and removing the block copolymer in the second layer where the second metal remains above the metal after the block copolymer in the second layer is removed.
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公开(公告)号：US09987827B2
公开(公告)日：2018-06-05
申请号：US14967349
申请日：2015-12-13
Applicant: Tsinghua University , HON HAI PRECISION INDUSTRY CO., LTD.
Inventor： Yuan-Hao Jin , Qun-Qing Li , Shou-Shan Fan
IPC: G06F3/044 , C03C17/09 , B32B15/08 , C23C14/20 , C23C14/58 , C23C16/06 , C23C16/56 , C23C30/00 , C23F4/00 , G06F3/047 , H05K1/02 , H05K1/03 , H05K1/09 , B32B5/02 , H01B1/02 , H01B1/16
CPC classification number: B32B15/08 , B32B5/028 , B32B2307/202 , C03C17/09 , C03C2217/252 , C03C2217/253 , C03C2217/255 , C03C2218/15 , C03C2218/33 , C03C2218/34 , C23C14/20 , C23C14/5826 , C23C14/5873 , C23C16/06 , C23C16/56 , C23C30/00 , C23F4/00 , G06F3/044 , G06F3/047 , G06F2203/04103 , G06F2203/04112 , H01B1/026 , H01B1/16 , H05K1/0274 , H05K1/028 , H05K1/03 , H05K1/09 , H05K2201/026 , H05K2201/0323 , H05K2201/0364 , H05K2201/09681
Abstract: The disclosure relates to a touch panel. The touch panel includes a substrate having a surface, a transparent conductive layer, at least one electrode, and a conductive trace. The transparent conductive layer includes a metal nanowire film. The metal nanowire film includes a number of first metal nanowire bundles parallel with and spaced from each other. Each of the number of first metal nanowire bundles includes a number of first metal nanowires parallel with each other. The first distance between adjacent two of the number of first metal nanowires is less than the second distance between adjacent two of the number of first metal nanowire bundles.
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9.发明申请
公开(公告)号：US20180148584A1
公开(公告)日：2018-05-31
申请号：US15499376
申请日：2017-04-27
Inventor： Kunmo CHU , Byonggwon SONG , Sunghoon PARK , Kiyeon YANG , Changseung LEE
IPC: C09D5/24 , C09D7/12 , C09D183/04 , H01L23/00
CPC classification number: C09D5/24 , C08K3/041 , C08K3/08 , C08K3/10 , C08K2201/001 , C08K2201/003 , C08K2201/011 , C09D7/61 , C09D7/69 , C09D7/70 , C09D11/52 , C09D183/04 , H01B1/22 , H01B1/24 , H01L21/4867 , H01L23/49883 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/32 , H01L24/33 , H01L24/48 , H01L2224/13101 , H01L2224/16225 , H01L2224/27515 , H01L2224/29105 , H01L2224/29191 , H01L2224/29193 , H01L2224/3003 , H01L2224/48091 , H01L2924/00014 , H01L2924/10161 , H01L2924/15159 , H01R13/2414 , H05K1/028 , H05K1/095 , H05K1/189 , H05K2201/026 , H05K2201/0323 , H05K2203/128 , H01L2924/014 , H01L2224/45099
Abstract: Provided are a paste material, a method of forming the paste material, a wiring member formed from the paste material, and an electronic device including the wiring member. The paste material may include a plurality of liquid metal particles and a polymer binder. The paste material may further include a plurality of nanofillers. At least some of the plurality of nanofillers may each have an aspect ratio equal to or greater than about 3. A content of the plurality of liquid metal particles may be greater than a content of the polymer binder and may be greater than a content of the plurality of nanofillers. The wiring member may be formed by using the paste material, and the wiring member may be used in various electronic devices.
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公开(公告)号：US09980394B2
公开(公告)日：2018-05-22
申请号：US14897521
申请日：2014-07-18
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Matthew S. Stay , Mikhail L. Pekurovsky , Shawn C. Dodds , Ann M. Gilman , Daniel J. Theis
IPC: G02F1/1345 , H05K3/28 , G06F3/041 , G06F3/047 , H05K1/02 , H05K1/09 , H05K3/10 , H05K3/04 , H05K3/32 , H05K1/03
CPC classification number: H05K3/284 , G06F3/041 , G06F3/0412 , G06F3/047 , G06F2203/04103 , G06F2203/04112 , H05K1/028 , H05K1/0296 , H05K1/0393 , H05K1/09 , H05K1/097 , H05K3/048 , H05K3/103 , H05K3/323 , H05K2201/026 , H05K2201/10128 , H05K2203/0143 , H05K2203/1469 , H05K2203/1545
Abstract: A method for making an electronic assembly includes applying a conductive adhesive to a resist layer overlying a patterned conductive nanowire layer on a substrate and engaging an electrical contact of an electronic component with the conductive adhesive to provide an electrical connection between the electronic component and the conductive nanowire layer.
