-
公开(公告)号：US20240347946A1
公开(公告)日：2024-10-17
申请号：US18755320
申请日：2024-06-26
摘要： A two-piece high voltage (HV) terminal frame having a terminal frame and a contact spring. The terminal frame includes at least a top portion, a bottom portion, and a middle portion forming an opening for receiving a first bus bar and a second bus bar. The contact spring is configured to engage the top portion of the terminal frame, wherein the contact spring includes a spring portion that extends into the opening of the terminal frame.
-
公开(公告)号：US12119576B2
公开(公告)日：2024-10-15
申请号：US17064663
申请日：2020-10-07
发明人： Jie Chang , Huibin Chen , Tiburcio Maldo , Keunhyuk Lee
IPC分类号： H01R12/58 , H01L23/495 , H01L23/498 , H01R13/03 , H05K3/30
CPC分类号： H01R12/585 , H01L23/49517 , H01L23/49541 , H01L23/49555 , H01L23/49579 , H01L23/49811 , H01R13/03 , H05K3/308 , H05K2201/1059
摘要： Implementations of semiconductor packages may include: one or more die electrically coupled to a lead frame. The lead frame may be included within a housing. The semiconductor package may also include a set of signal leads extending from the housing, a set of power leads extending from the housing, and a plurality of press fit pins each fixedly coupled to the set of signal leads and the set of power leads. The set of signal leads and the set of power leads may be configured to couple with a substrate.
-
公开(公告)号：US12110606B2
公开(公告)日：2024-10-08
申请号：US17251253
申请日：2019-06-26
摘要： The invention relates to a silver electrolyte for the deposition of silver layers on substrates, which comprises potassium silver cyanide, potassium cyanide with a content of at least 10 g/L, at least one grain refiner with a content of 0.2 to 10 g/L, at least one dispersant with a content of 1 to 10 g/L and at least one solid component with a content of 1 to 150 g/L, wherein the particles of the solid component have an average particle size (d50) of 10 nm-100 μm. Furthermore, contact surfaces and methods for the deposition of such contact surfaces are shown.
-
公开(公告)号：US20240332843A1
公开(公告)日：2024-10-03
申请号：US18579654
申请日：2022-07-15
CPC分类号： H01R13/03 , H01R13/111 , H01R13/6683
摘要： A terminal having a memory ring, including a terminal body (1) and a memory ring (2). The terminal body (1) includes a contact section (13). The memory ring (2) is sleeved on an outer side of the contact section (13), and is in contact with the contact section (13), The memory ring (2) is made of a memory alloy and is capable of causing the contact section (13) to contract. The terminal having the memory ring can realize a butting without an insertion force, and a contact area and a contact force between a terminal and a mating terminal are ensured by a temperature rise during working, thereby improving contact reliability. Since the insertion force is not required, the work is easier and the working efficiency is improved.
-
公开(公告)号：US20240222894A1
公开(公告)日：2024-07-04
申请号：US18397132
申请日：2023-12-27
发明人： Robert C. Lane , Augusto E. Barton , Yifei Liu
IPC分类号： H01R12/79 , H01R13/03 , H01R13/15 , H01R13/639
CPC分类号： H01R12/79 , H01R13/03 , H01R13/15 , H01R13/639
摘要： A connector comprising a first circuit board and a second circuit board disassembled on the first circuit board through a connecting piece, the connecting piece slides through the first circuit board and the second circuit board, and the first circuit board and the second circuit board are fixed to each other, the first circuit board is provided with a conductive part, the second circuit board is provided with a contact part, and the second circuit board is provided with a contact part. When the second circuit board is installed on the first line circuit board, the conductive part and the contact part are electrically connected. The connector of the invention is simple in structure and convenient for disassembly and assembly between the first line circuit board and the second circuit board.
-
公开(公告)号：US20240162640A1
公开(公告)日：2024-05-16
申请号：US18281755
申请日：2022-03-10
申请人： KYOCERA CORPORATION
发明人： Akio TSUNEMURA , Shaolong WU
IPC分类号： H01R12/71 , H01R13/03 , H01R13/24 , H01R13/405 , H01R13/502
CPC分类号： H01R12/716 , H01R13/03 , H01R13/2407 , H01R13/405 , H01R13/502
摘要： According to the present disclosure, a connector (10) configured to engage a connection object (50) includes i) an insulator (20) including an engagement projection (22) and a peripheral wall (23) surrounding the engagement projection (22), ii) a first metal fitting (40a) attached to the engagement projection (22), and iii) a second metal fitting (40b) attached to the peripheral wall (23). The first metal fitting (40a) and the second metal fitting (40b) are separate members. A strength of the first metal fitting (40a) and a strength of the second metal fitting (40b) are different from each other.
-
公开(公告)号：US20240154338A1
公开(公告)日：2024-05-09
申请号：US18413053
申请日：2024-01-16
摘要： The present application provides a terminal and a processing method thereof. The terminal includes a connecting portion, a first fixing portion and a conducting portion that are connected in sequence. The connecting portion is used for being connected to a cable. The conducting portion includes a plurality of elastic sheets that are arranged at intervals in a circumferential direction. First ends of the elastic sheets are all fixedly connected to the first fixing portion, and a first groove is arranged between any two adjacent elastic sheets. The present application alleviates the technical problems of large contact resistance and high temperature rise at the connection position of the existing plug-in terminal.
-
公开(公告)号：US20240154333A1
公开(公告)日：2024-05-09
申请号：US18281134
申请日：2022-03-17
发明人： Reinhard Wagner , Christian Dandl
CPC分类号： H01R13/03 , C23C14/0623 , C23C14/34 , C23C28/345 , H01R43/16 , C23C4/06 , C25D5/12 , C25D7/0614
摘要： The present invention relates to a method for producing an electrical contact, in particular an electrical plug contact, comprising the steps of a) providing a substrate, wherein the substrate has a metallic and/or metallized surface, and b) applying a low-friction surface to the metallic and/or metallized surface of the substrate, wherein the low-friction surface is applied by mechanical rubbing, polishing and/or buffing of a solid lubricant; or wherein the low-friction surface is applied by spray application of a solid lubricant; or wherein the low-friction surface is applied by applying a solid lubricant by means of a drum washer; and wherein the low-friction surface (6) has a film thickness of 0.001 μm-4 μm.
-
公开(公告)号：US11978975B2
公开(公告)日：2024-05-07
申请号：US17649991
申请日：2022-02-04
发明人： Markus Jung , Josef Roth
CPC分类号： H01R13/111 , A61N1/3752 , H01R13/03 , H01R2201/12
摘要： The present invention relates to a monolithic spring contact ring, preferably for use in a medical electrode, comprising an outer ring and a plurality of elastically deformable belt-shaped spring elements, each comprising two curved connectors which form a continuously running, gap-free connection between the outer ring and the respective spring element, wherein the spring elements each extend continuously from the first connector to the second connector via a first bend, a central part of the spring element and a second bend, wherein the middle part comprises a front side which points in the direction of the central axis of the outer ring.
-
公开(公告)号：US20240145967A1
公开(公告)日：2024-05-02
申请号：US18498633
申请日：2023-10-31
发明人： Liming (Eric) Wang , Daiqiong (Diana) Zhang , Wende Zhao , Shilong Wu , Xinxin (Daisy) Li , Zhenyu (Richard) Chen , Jialin Zhang , Zhongxi Huang
IPC分类号： H01R13/03
CPC分类号： H01R13/03
摘要： A conductive terminal includes a conductive base substrate and a plating layer structure plated on the conductive base substrate. The plating layer structure includes a nickel plating layer located outside the conductive base substrate, a silver plating layer located outside the nickel plating layer, and a platinum-based polymetallic plating layer located outside the silver plating layer.
-
-
-
-
-
-
-
-
-
搜索结果
1485 条记录 (耗时 0.02 秒)
