公开(公告)号：US20160254103A1

公开(公告)日：2016-09-01

申请号：US15151088

申请日：2016-05-10

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Katsuji Nakamura ,  Kaichi Tsuruta ,  Yuji Ozaki ,  Shigeaki Watarai ,  Hidenori Takagi ,  Yutaka Ohori

IPC: H01G11/50 ,  H01M2/26 ,  C25D3/22 ,  C25D3/30 ,  C25D3/56 ,  H01G11/30 ,  C25D3/12 ,  C23C18/16 ,  C23C18/31 ,  C23C18/32 ,  C23C18/48 ,  H01G11/06 ,  C25D5/12 ,  C25D3/60

CPC classification number: H01G11/50 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1827 ,  C23C18/31 ,  C23C18/32 ,  C23C18/36 ,  C23C18/48 ,  C23C18/52 ,  C23C18/54 ,  C25D3/12 ,  C25D3/22 ,  C25D3/30 ,  C25D3/565 ,  C25D3/60 ,  C25D5/12 ,  C25D5/44 ,  H01B1/023 ,  H01B13/32 ,  H01G11/06 ,  H01G11/24 ,  H01G11/30 ,  H01G11/66 ,  H01M2/202 ,  H01M2/26 ,  H01M2/30 ,  H01M2004/028 ,  Y02E60/13 ,  Y10T29/49147

Abstract: An electrode for an energy storage device including a Zn layer or Zn alloy layer, a Ni layer, and a Sn layer or Sn alloy layer formed by plating on a connecting terminal part of a positive electrode composed of Al so that the resistance value at the contacting point is reduced and the voltage of the energy storage device can be effectively supplied without any drop. Accordingly, this electrode can be soldered to a Cu negative electrode, which is composed of metal that is different species from Al, through a Sn layer or a Sn alloy layer so that jointing strength of the Al positive electrode and the Cu negative electrode can be enhanced. The contacting area is increased in comparison with the conventional jointing by spot-welding or conventional fastening by a bolt so that the resistance value at the contacting point is reduced.

Abstract translation: 1.一种蓄电装置用电极，其特征在于，包括Zn层或Zn合金层，Ni层以及通过电镀在由Al构成的正极的连接端子部分上形成的Sn层或Sn合金层， 接触点减小，并且可以有效地提供能量存储装置的电压而没有任何下落。 因此，该电极可以通过Sn层或Sn合金层焊接到由与Al不同的金属构成的Cu负极上，使得Al正极和Cu负极的接合强度可以 增强。 与通过点焊的常规接合或通过螺栓的常规紧固相比，接触面积增加，使得接触点处的电阻值降低。

公开(公告)号：US10121606B2

公开(公告)日：2018-11-06

申请号：US15151088

申请日：2016-05-10

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Katsuji Nakamura ,  Kaichi Tsuruta ,  Yuji Ozaki ,  Shigeaki Watarai ,  Hidenori Takagi ,  Yutaka Ohori

IPC: H01R9/00 ,  H05K3/00 ,  H01G11/50 ,  C23C18/16 ,  C23C18/18 ,  C23C18/54 ,  H01G11/24 ,  H01G11/66 ,  H01M2/20 ,  H01M2/30 ,  H01B1/02 ,  H01B13/32 ,  C25D5/12 ,  C25D5/44 ,  C23C18/31 ,  C23C18/32 ,  C23C18/48 ,  C25D3/12 ,  C25D3/22 ,  C25D3/30 ,  C25D3/56 ,  C25D3/60 ,  H01G11/06 ,  H01G11/30 ,  H01M2/26 ,  C23C18/36 ,  C23C18/52 ,  H01M4/02

Abstract: An electrode for an energy storage device including a Zn layer or Zn alloy layer, a Ni layer, and a Sn layer or Sn alloy layer formed by plating on a connecting terminal part of a positive electrode composed of Al so that the resistance value at the contacting point is reduced and the voltage of the energy storage device can be effectively supplied without any drop. Accordingly, this electrode can be soldered to a Cu negative electrode, which is composed of metal that is different species from Al, through a Sn layer or a Sn alloy layer so that jointing strength of the Al positive electrode and the Cu negative electrode can be enhanced. The contacting area is increased in comparison with the conventional jointing by spot-welding or conventional fastening by a bolt so that the resistance value at the contacting point is reduced.