公开(公告)号：US11984652B2

公开(公告)日：2024-05-14

申请号：US17895003

申请日：2022-08-24

Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED

Inventor： Osamu Hashiguchi

IPC: H01Q1/36 ,  H01Q1/50 ,  H01R9/00 ,  H01R9/05

CPC classification number: H01Q1/36 ,  H01Q1/50

Abstract: An antenna assembly includes an antenna body formed of a sheet metal, an electric cable, and a conductive film. The antenna body includes at least one crimp portion. The conductive film has a main portion and at least one connected portion extending from the main portion. The electric cable has a conductor portion 46. The at least one crimp portion is crimped to the conductor portion in a state that at least one connected portion lies between the conductor portion and the at least one crimp portion.

公开(公告)号：US11521933B2

公开(公告)日：2022-12-06

申请号：US16835238

申请日：2020-03-30

Applicant: FUJI ELECTRIC CO., LTD.

Inventor： Shuangching Chen ,  Sayaka Yamamoto

IPC: H01L23/495 ,  H01L23/48 ,  H01L21/00 ,  H01R9/00 ,  H05K7/18 ,  H01L23/538 ,  H02M7/483 ,  H01L23/00 ,  H01L23/498 ,  H01L29/739 ,  H01L29/10 ,  H01L29/808

Abstract: A semiconductor device is provided, which includes a semiconductor chip; a first current input/output portion that is electrically connected to the semiconductor chip; a second current input/output portion that is electrically connected to the semiconductor chip; three or more conducting portions provided with the semiconductor chip, between the first current input/output portion and the second current input/output portion; and a current path portion having a path through which current is conducted to each of the three or more conducting portions, wherein the current path portion includes a plurality of slits.

公开(公告)号：US11495523B2

公开(公告)日：2022-11-08

申请号：US17225683

申请日：2021-04-08

Applicant: CHANG WAH TECHNOLOGY CO., LTD.

Inventor： Chia-Neng Huang

IPC: H01L23/495 ,  H01L23/48 ,  H01L21/00 ,  H01R9/00 ,  H05K7/18 ,  H01L23/31 ,  H01L23/00

Abstract: A lead frame is made of conductive material, and includes an interconnecting web portion and a plurality of unit lead frames. Each unit lead frame includes a die pad and a plurality of leads. The die pad has a die-attach section disposed below an upper surface of the interconnecting web portion, and a plurality of extension sections bent at an angle from a periphery of the die-attach section and projecting to the interconnecting web portion. The die pad is formed with a plurality of grooves formed at an underside of junctions of the die-attach section and the extension sections. The leads extend from the interconnecting web portion toward and are spaced apart from the die pad.

公开(公告)号：US11348862B2

公开(公告)日：2022-05-31

申请号：US17013351

申请日：2020-09-04

Applicant: KABUSHIKI KAISHA TOSHIBA ,  TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION

Inventor： Seiichi Kamiyama

IPC: H01L23/495 ,  H01L23/48 ,  H01R9/00 ,  H05K7/18 ,  H01L23/482 ,  H01L23/00 ,  H01L23/498

Abstract: Provided is a semiconductor device including: a semiconductor chip having a rectangular region including a first corner portion having a first notch portion, a second corner portion being provided to diagonally face the first corner portion, a third corner portion, and a fourth corner portion being provided to diagonally face the third corner portion on a surface and having a semiconductor element formed in the rectangular region; a first electrode including a fifth corner portion being provided on the first corner portion and having a second notch portion, a sixth corner portion being provided on the second corner portion, a seventh corner portion being provided on the third corner portion, and an eighth corner portion being provided on the fourth corner portion, the first electrode being provided on the semiconductor element, and the first electrode being electrically connected to the semiconductor element; and a first connector including a ninth corner portion being provided on the fifth corner portion and having a third notch portion and a twelfth corner portion being provided on the eighth corner portion, the first connector being provided on the first electrode, and the first connector being electrically connected to the first electrode.

公开(公告)号：US11282778B2

公开(公告)日：2022-03-22

申请号：US16703454

申请日：2019-12-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsu-Nan Fang

IPC: H01L23/02 ,  H01L23/34 ,  H01L23/48 ,  H01L23/28 ,  H01L21/00 ,  H05K7/00 ,  H01R9/00 ,  H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/538 ,  H01L21/56 ,  H01L25/065 ,  H01L21/683 ,  H01L23/31

Abstract: A semiconductor device package includes a redistribution structure, a conductive substrate stacked on the redistribution structure and an encapsulant encapsulating the redistribution structure and the conductive substrate. The encapsulant encapsulates a side surface of the conductive substrate. A method for manufacturing an electronic device package includes: providing a carrier, forming a redistribution structure on the carrier, mounting a conductive substrate on a first surface of the redistribution structure, forming a first encapsulant to encapsulate the first surface of the redistribution structure and a side surface of the conductive substrate, and removing the carrier.

公开(公告)号：US11278455B2

公开(公告)日：2022-03-22

申请号：US16066637

申请日：2016-06-30

Applicant: ElastiMed Ltd.

Inventor： Omer Zelka

IPC: H01R9/00 ,  H05K3/00 ,  A61F13/08 ,  A61B17/132 ,  B29C53/04 ,  A61F5/01 ,  B29C55/14 ,  A61B17/00 ,  B29K33/00 ,  B29K83/00 ,  B29L31/48 ,  B29C55/12 ,  A61B90/00 ,  A61F2/50 ,  B29L31/00

Abstract: In some embodiments, the present invention is directed to an actuator which includes at least the following: a pre-stretched electro-active polymer film being pre-stretched in a single or biaxial planar directions; at least one first semi-stiff conductor attached to a first surface of the pre-stretched electro-active polymer film, wherein the first surface is parallel to the single or biaxial planar stretch directions; at least one second semi-stiff conductor attached to a second surface of the pre-stretched electro-active polymer film, wherein the second surface is opposite to the first surface; where the semi-stiff conductors are configured to: fix the pre-stretched electro-active polymer film in a pre-stretched state and allow the pre-stretched electro-active polymer film to expand; a pair of mechanical connectors coupled to each end of an active region of the pre-stretched electro-active polymer film.

公开(公告)号：US10772214B2

公开(公告)日：2020-09-08

申请号：US16679761

申请日：2019-11-11

Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA ,  DENSO CORPORATION

Inventor： Masafumi Momose ,  Tetsuya Dewa

IPC: H01R9/00 ,  H05K3/00 ,  H05K3/32 ,  H05K1/18 ,  B23K26/22 ,  H05K1/02 ,  H05K7/20

Abstract: A manufacturing method for a circuit board in which a pin inserted in a through-hole of a land is welded to the land is disclosed. The land is covered with a white layer, and an irradiation angle of a laser beam with respect to the circuit board is adjusted so that reflected light of the laser beam emitted to the pin reaches the white layer on the land. As the reflected light of the laser beam is allowed to reach a white region provided on the land, the reflected light is scattered on the white region. A rate of absorption of the laser beam by the land is decreased, and a temperature increase of the land is restrained. As a result, a damage of an insulating part around the land is restrained.

公开(公告)号：US10653177B2

公开(公告)日：2020-05-19

申请号：US15840289

申请日：2017-12-13

Applicant: Nu Mark Innovations Ltd.

Inventor： Zvika Feldman ,  Arie Holtz ,  Eyal Peleg ,  Sammy Capuano

IPC: A24F40/70 ,  A24F47/00 ,  H05B3/06 ,  H05B3/16 ,  H01R9/00

Abstract: A cartomizer assembly of an electronic cigarette which is formed from automated assembly compatible parts comprises a container assembly including a container and a heater coil surrounding a wick in an airflow space of the container. The entire coil of the heater coil is inside the container and the heater coil is configured to heat liquid on the wick to generate an aerosol mist during a vaporization process. A liquid storage space is in liquid communication with the wick and is operable to supply liquid to the wick. The heater, the wick, and the container are shaped such that the heater and wick can be dropped into the container during automated assembly thereof and be directed to and located at a desired location in the container.

公开(公告)号：US10574018B2

公开(公告)日：2020-02-25

申请号：US14667439

申请日：2015-03-24

Applicant: The Boeing Company

Inventor： Thu A. Nguyen ,  Michael G. Parent ,  Russell J. Heeter ,  Jeffrey A. Wilkerson

IPC: H01R9/00 ,  H01R43/26 ,  B64D45/02 ,  F16B33/00 ,  H01R43/00 ,  F16B13/00 ,  F16B1/00 ,  H01R4/64

Abstract: A conductive sleeved fastener assembly includes an electrically-conductive fastener having a fastener head and a fastener shank extending from the fastener head and an electrically-conductive fastener sleeve receiving the fastener shank of the fastener and a fastener sleeve flange provided on the fastener sleeve and disposed in direct contact with the fastener head of the fastener. A method of preparing a conductive sleeved fastener for use is also disclosed.

公开(公告)号：US10412835B2

公开(公告)日：2019-09-10

申请号：US15953560

申请日：2018-04-16

Applicant: Qi Ding Technology Qinhuangdao Co., Ltd. ,  Zhen Ding Technology Co., Ltd.

Inventor： Yu-Cheng Huang

IPC: H01R9/00 ,  H05K1/18 ,  H05K1/02 ,  H05K3/00 ,  H05K3/30 ,  H05K3/46 ,  H05K3/04 ,  H05K3/20 ,  H05K3/06

Abstract: A package substrate includes a dielectric layer, a first circuit layer, a second circuit layer and at least one electrically conductive pole. The dielectric layer includes a first side and a second side opposite to the first side. The first circuit layer is located at the first side of the dielectric layer, and includes a plurality of spaced first circuit patterns embedded into the dielectric layer. The second circuit layer is located at the second side of the dielectric layer, and includes a plurality of spaced second circuit patterns located on the second side the dielectric layer. The electrically conductive pole electrically couples the first circuit layer to the second circuit layer. Each of the first circuit patterns has an extension direction from the first side toward the second side, and has widths gradually decreasing along the extension direction.