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公开(公告)号:US12120743B2
公开(公告)日:2024-10-15
申请号:US18132858
申请日:2023-04-10
发明人: Tomoko Adachi , Masahiro Sekiya , Takeshi Tomizawa , Daisuke Taki , Masaaki Ikuta , Tomoya Suzuki
IPC分类号: H04W74/0816 , H04L1/00 , H04L1/1607 , H04L5/00 , H04W84/12 , H04W84/18 , H04W88/04
CPC分类号: H04W74/0816 , H04L1/008 , H04L1/1614 , H04L5/0007 , H04W84/12 , H04W84/18 , H04W88/04
摘要: According to one embodiment, a wireless communication device includes: a receiver that configured to receives a first frame; and a transmitter that configured to transmits a second frame including a first identifier and acknowledgement information on the first frame, the first identifier being extracted from a predetermined field of the first frame and being different from a source address of the first frame.
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公开(公告)号:US12119574B2
公开(公告)日:2024-10-15
申请号:US17689759
申请日:2022-03-08
发明人: Kenichi Agawa
CPC分类号: H01R12/53 , H05K1/144 , H05K2201/042 , H05K2201/10287 , H05K2201/10393
摘要: A wiring device has a plate having a first surface and a second surface and a first protrusion having a side surface capable of locking a first substrate and a first upper surface with a plurality of first grooves and the first substrate including a terminal on a surface of the first substrate. Each of the first grooves accommodates a coating of a wiring including a conductor and the coating, the first protrusion extending in a third direction. The holder includes a plurality of connection portions, and the holder includes a plurality of second grooves, each of the second grooves capable of accommodating the conductor exposed from the coating. The cover is rotatably openable and closable with respect to the plate, and the cover brings the conductor into pressure contact with the terminal between the first protrusion and the holder.
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公开(公告)号:US20240339128A1
公开(公告)日:2024-10-10
申请号:US18436535
申请日:2024-02-08
发明人: Ryo OSAMURA , Yuji NAKAGAWA , Tomoyuki MAEDA , Masayuki TAKAGISHI , Naoyuki NARITA , Kosuke KURIHARA
CPC分类号: G11B5/672 , G11B5/656 , G11B2220/235
摘要: According to one embodiment, a magnetic recording medium includes a first magnetic region, a second magnetic region, a third magnetic region, a fourth magnetic region, and a fifth magnetic region. The second magnetic region is provided between the fifth magnetic region and the first magnetic region in a first direction from the fifth magnetic region to the first magnetic region. The third magnetic region is provided between the fifth magnetic region and the second magnetic region in the first direction. The fourth magnetic region is provided between the fifth magnetic region and the third magnetic region in the first direction. A first composition ratio of a first Pt atomic concentration to a first Co atomic concentration in the first magnetic region is higher than a second composition ratio of a second Pt atomic concentration to a second Co atomic concentration in the second magnetic region.
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公开(公告)号:US12113523B2
公开(公告)日:2024-10-08
申请号:US18180439
申请日:2023-03-08
发明人: Takayuki Teraguchi
IPC分类号: H03K17/687
CPC分类号: H03K17/687
摘要: According to an embodiment, an SPnT-type high frequency switch includes a plurality of first MOS transistors, second MOS transistors, and a capacitor. The plurality of first MOS transistors are connected in series between one of a plurality of RF terminals and an RF common terminal. The second MOS transistors have ends each connected to adjacent first MOS transistors among the first MOS transistors. The capacitor is connected between ground and another end of a second MOS transistor having one end connected to another end of a first MOS transistor having one end connected to the one of the RF terminals among the first and second MOS transistors.
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公开(公告)号:US12113126B2
公开(公告)日:2024-10-08
申请号:US17686809
申请日:2022-03-04
发明人: Kaori Fuse , Keiko Kawamura , Takako Motai , Tomoko Matsudai , Yoko Iwakaji
IPC分类号: H01L29/739 , H01L29/868
CPC分类号: H01L29/7397 , H01L29/868
摘要: A semiconductor device includes: a first electrode; a first semiconductor layer of first conductivity type provided on the first electrode; a second semiconductor layer of second conductivity type provided on the first semiconductor layer; a second electrode provided on the second semiconductor layer; a first trench reaching the first semiconductor layer from the second semiconductor layer; a first semiconductor region provided in the second semiconductor layer, the first semiconductor region being in contact with the first trench and the first semiconductor region having a higher concentration of impurities of second conductivity type than the second semiconductor layer; and a first insulating film provided in the second semiconductor layer and the first insulating film being in contact with the first semiconductor region.
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公开(公告)号:US12112779B1
公开(公告)日:2024-10-08
申请号:US18236903
申请日:2023-08-22
发明人: Toru Watanabe
IPC分类号: G11B5/60
CPC分类号: G11B5/607 , G11B5/6011 , G11B5/6029
摘要: According to one embodiment, a magnetic disk device includes a magnetic disk, a magnetic head that includes a write head configured to write data to the magnetic disk, a read head configured to read data from the magnetic disk, and a heater configured to adjust a flying height of the write head, and a controller that includes a first detection unit configured to detect the flying height of the write head, a second detection unit configured to detect a positioning error of the magnetic head with respect to a track of the magnetic disk, and a memory configured to store a first threshold and a second threshold.
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公开(公告)号:US12112502B2
公开(公告)日:2024-10-08
申请号:US17464455
申请日:2021-09-01
发明人: Manabu Nishiyama
CPC分类号: G06T7/74 , G01S13/89 , G06V20/58 , G08G1/166 , H04N23/90 , B60W30/0956 , B60W2420/403 , B60W2554/4029 , G06T2207/30244 , G06T2207/30261
摘要: According to one embodiment, a three-dimensional map estimation apparatus includes a processor that selects an imaging apparatus from a plurality of imaging apparatuses and then estimates a position and orientation for a moving object on which the selected imaging apparatus is mounted based on images captured by the selected imaging apparatus. The processor outputs a first position and orientation estimation result for the moving object based on images from selected imaging apparatuses. The processor calculates a second position and orientation estimation result indicating an estimated position and orientation for the moving object using the first position and orientation estimation result. The processor estimates a three-dimensional map for the surroundings of the moving object based on the second position and orientation estimation result.
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公开(公告)号:US12106773B2
公开(公告)日:2024-10-01
申请号:US18181961
申请日:2023-03-10
发明人: Takuya Mori , Tetsuo Kuribayashi , Kazuo Chokki
CPC分类号: G11B19/045 , G11B5/012 , G11B2220/2516
摘要: According to one embodiment, a magnetic disk device includes a memory and a controller. The memory stores, for a predetermined track on a magnetic disk in the device, a counter, a counter threshold, and weights. The weights are individually set for divided areas of the predetermined track. The weights each have magnitude inversely proportional to a guaranteed number of times of data readout. When writing to an adjacent track of one or more of the divided areas is executed, the controller multiplies a number of times of writing by the weight corresponding to the one or more of the divided areas and adds the number of times of writing to the counter. When a numerical value of the counter reaches the counter threshold, the controller executes refresh to rewrite data in the predetermined track or executes reading for determining whether or not to perform the refresh.
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公开(公告)号:US20240321967A1
公开(公告)日:2024-09-26
申请号:US18364860
申请日:2023-08-03
发明人: Shunsuke ASABA , Hiroshi KONO
IPC分类号: H01L29/16 , H01L29/417 , H01L29/78
CPC分类号: H01L29/1608 , H01L29/41766 , H01L29/7802
摘要: A semiconductor device according to an embodiment includes: a silicon carbide layer having a first face and a second face; first and second gate electrodes; a first silicon carbide region; a second silicon carbide region between the first silicon carbide region and the first face; a third silicon carbide region between the second silicon carbide region and the first face; a fourth silicon carbide region between the third silicon carbide region and the first face; a first electrode; and a second electrode. The first electrode includes a first portion, and the first portion includes a first contact face in contact with the fourth silicon carbide region, a second contact face in contact with the fourth silicon carbide region, a third contact face in contact with the fourth silicon carbide region and the third silicon carbide region, and a fourth contact face in contact with the third silicon carbide region.
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公开(公告)号:US20240321850A1
公开(公告)日:2024-09-26
申请号:US18463789
申请日:2023-09-08
发明人: Yusuke IMAIZUMI , Jia LIU , Yoshinari TAMURA
IPC分类号: H01L25/18 , H01L23/00 , H01L23/495
CPC分类号: H01L25/18 , H01L23/49575 , H01L24/05 , H01L24/06 , H01L24/16 , H01L24/48 , H01L23/3121 , H01L24/32 , H01L24/33 , H01L24/49 , H01L27/01 , H01L2224/05553 , H01L2224/05555 , H01L2224/06181 , H01L2224/16145 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48245 , H01L2224/49175
摘要: According to one embodiment, an isolator includes an isolator module including a first substrate, a first insulating layer in contact with a top surface of the first substrate, a second insulating layer in contact with a bottom surface of the first substrate, a first coil arranged at a same height as the first insulating layer, and a second coil arranged at a same height as the second insulating layer and facing the first coil; a first conductor arranged below the isolator module and electrically connected to a bottom surface of the second coil; and a first chip, wherein the second coil and a top surface of the first chip are electrically connected to each other with the first conductor interposed.
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