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公开(公告)号：US12115591B2
公开(公告)日：2024-10-15
申请号：US17983689
申请日：2022-11-09
申请人： ERSA GmbH
IPC分类号： B23K3/00 , B23K1/00 , B23K3/08 , B23K101/42
CPC分类号： B23K1/0016 , B23K3/08 , B23K2101/42
摘要： Soldering apparatus, in particular a reflow soldering apparatus, for the continuous soldering of printed circuit boards along a transport direction, with an entry and an exit for feeding and removing the printed circuit boards, with a process channel including a preheating zone, a soldering zone and/or a cooling zone, and including a main body and at least one cover hood movable between a closed position and an open position, the cover hood enclosing a hood compartment above the process channel in which fan motors are provided. A central suction channel is provided in the hood compartment, in that the first suction elements connected to the suction channel in the hood compartment are provided for the suction of hood compartment air from the hood compartment, in that second suction elements connected to the suction channel in the hood compartment are provided for the suction of process gas from the process channel, and in that a switching device is provided and is configured to switch between an operating mode in which hood compartment air is suctioned via the first suction elements and a cooling mode in which process gas is suctioned via the second suction elements.
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公开(公告)号：US20230405701A1
公开(公告)日：2023-12-21
申请号：US18037353
申请日：2021-11-15
申请人： ERSA GmbH
发明人： Timon Ahlgrimm , Klaus Rosenberger
CPC分类号： B23K3/0478 , B23K1/0016 , B23K3/033 , B23K3/08
摘要： A network and a method for operating a network is provided. The network includes one or more soldering systems provided in the network, and the soldering systems each include at least one soldering apparatus for soldering electronic components, a user interface for outputting target-soldering-information to a user; and a way for determining actual soldering information. The network includes at least one input device for inputting and/or specifying work information, and
a control unit which is designed to identify soldering systems provided in the network; create soldering tasks with target-soldering-information from the work information depending on the identified soldering systems and assign the tasks to the relevant soldering system; and process the actual soldering information of the relevant soldering system with the associated target-soldering-information of the relevant soldering system.-
公开(公告)号：US20230147525A1
公开(公告)日：2023-05-11
申请号：US17982621
申请日：2022-11-08
申请人： ERSA GmbH
CPC分类号： B23K3/085 , H05K3/3494 , B23K2101/42
摘要： Soldering system, in particular a reflow soldering system, for continuous soldering of printed circuit boards along a transport direction, that includes a process channel having a preheating zone, at least one of a soldering zone and a cooling zone, including a main body, at least one covering hood that is pivotable about a hood axis between a closed position, in which the process channel is closed, and an open position, in which the covering hood is open and the process channel is accessible.
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公开(公告)号：US20230137203A1
公开(公告)日：2023-05-04
申请号：US17980267
申请日：2022-11-03
申请人： ERSA GmbH
摘要： Press-in machine for pressing electrical, electronic, mechanical and/or electromechanical components into a substrate, in particular into a circuit board or carrier board, including a lower tool, which for pressing-is in contact against the underside of the substrate, an upper tool, which with an upper pressing unit for pressing-in the component can be moved against the component along the z-axis toward the substrate, and a changing unit for automatically changing the lower or upper tool. The changing unit includes a magazine in which a plurality of tools can be deposited, one or more tool-holders, a tool being provided in or on each of the tool-holders, a displacement unit with which the respective tool holder can be moved along a displacement direction out of the magazine and into a pressing receptacle of a pressing unit, and a locking device, with which the respective tool-holder can be locked in the pressing receptacle.
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公开(公告)号：US11623291B2
公开(公告)日：2023-04-11
申请号：US17474762
申请日：2021-09-14
申请人： ERSA GmbH
发明人： Sven Proppert , Theresa Christ
摘要： Selective soldering system for selective wave soldering of circuit boards, including a solder pot, a solder nozzle which can be detachably arranged on the solder pot, wherein the solder nozzle has a nozzle base and a nozzle neck, wherein at the free end of the nozzle neck a nozzle opening is provided, the solder pot being arranged on a moving unit, which can be moved along an x and y axis in a horizontal plane and along a z axis in the vertical direction, and a control unit for controlling the moving unit.
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公开(公告)号：US20220355423A1
公开(公告)日：2022-11-10
申请号：US17735704
申请日：2022-05-03
申请人： ERSA GmbH
发明人： Markus Sendelbach
摘要： Moving unit for moving two soldering assemblies connected by means of a coupling device, soldering system for selective wave soldering of circuit boards with such a moving unit, and associated method.
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公开(公告)号：US11458558B2
公开(公告)日：2022-10-04
申请号：US16977240
申请日：2019-03-01
申请人： ERSA GmbH
发明人： Alexander Leisering
摘要： The invention relates to a soldering nozzle for the simultaneous selective wave soldering of at least two spaced-apart rows of solder joints in a soldering installation, with a base portion which can be arranged on a nozzle plate, and with a wave portion which forms the solder wave during operation and which has a peripheral wall having a free upper side, and with at least one separating strip which can be inserted into the wave portion and which can be wetted with solder, wherein the at least one separating strip is formed as a frameless separating strip. The invention also relates to a soldering installation having a nozzle plate and having at least one soldering nozzle.
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公开(公告)号：US20220295643A1
公开(公告)日：2022-09-15
申请号：US17763454
申请日：2020-08-27
申请人： ERSA GmbH
摘要： The invention concerns a reflow soldering machine for continuously soldering of soldering goods in a process channel along a process direction, whereby the process channel comprises at least one pre-heating zone, at least one soldering zone, and at least one cooling zone, whereby the soldering zone comprises a pressure chamber comprising one base part and one cover part opposite the base part and that can be raised when the reflow soldering machine is operating, wherein the process channel can be covered by at least one covering hood that can be opened, and wherein the cover part is motion-coupled to the covering hood in such a way that when the covering hood is opened, the cover part is also taken along by the covering hood.
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9.发明申请METHOD AND CLEANING SYSTEM FOR CLEANING THE PROCESS GAS IN SOLDERING INSTALLATIONS 有权用于清洁焊接过程中的工艺气体的方法和清洁系统公开(公告)号：US20140127108A1
公开(公告)日：2014-05-08
申请号：US14067899
申请日：2013-10-30
申请人： ERSA GmbH
发明人： Viktoria Rawinski
CPC分类号： B23K3/08 , B01D53/72 , B01D53/82 , B01D2251/306 , B01D2251/404 , B01D2251/70 , B01D2257/70
摘要： The invention relates to a method for cleaning the process gas in soldering installation and solder suction systems, in particular for reducing the abietic acid in the process gas, wherein the process gas to be cleaned is conducted through a cleaning system which contains one or more of the following compounds (cleaning compounds): a) carboxylic acids with reducing properties, namely oxalic acid, formic acid, citric acid and/or ascorbic acid: b) metal compounds of higher oxidation states, namely manganates, permanganates, chromates and/or dichromates; c) alcohols which can be convened into the carboxylic acids mentioned in a) by means of oxidation; d) basic lime compounds.
摘要翻译： 本发明涉及一种用于在焊接装置和焊料抽吸系统中清洁工艺气体的方法，特别是用于减少工艺气体中的松散酸，其中待清洁的工艺气体通过清洁系统进行，该清洁系统包含一个或多个 以下化合物（清洁化合物）：a）具有降低性能的羧酸，即草酸，甲酸，柠檬酸和/或抗坏血酸：b）较高氧化态的金属化合物，即锰酸盐，高锰酸盐，铬酸盐和/或重铬酸盐 ; c）通过氧化可以在a）中提到的羧酸中的醇; d）碱性石灰化合物。
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10.发明公开公开(公告)号：US20240250488A1
公开(公告)日：2024-07-25
申请号：US18419916
申请日：2024-01-23
申请人： ERSA GmbH
发明人： Timon Ahlgrimm
CPC分类号： H01R43/0242 , H05K13/0817
摘要： A method for heating a substrate (12) and/or an electronic component (14) arranged on the substrate (12) for desoldering and/or soldering the component (14) by a soldering device (10) with an energy dissipation (E), a device position (P), and/or a device acceleration (a). The soldering device (10) heats a soldering point (20) on the substrate (12) and/or on the component (14) by heat conduction, heat radiation, and/or heat convection, and has a first energy dissipation (E), a first device position (Px,y,z), and/or a first device acceleration (ax,y,z). The soldering device (10) moves towards and/or away from the soldering point (20), has a second energy dissipation (E), a second device position (Px,y,z), and/or a second device acceleration (ax,y,z). The state of the soldering point (20), the substrate (12), and/or the component (14) depends on time series of the energy dissipation (E), the device position (Px,y,z), and/or the device acceleration (ax,y,z).
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