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公开(公告)号：US20230147071A1
公开(公告)日：2023-05-11
申请号：US17983061
申请日：2022-11-08
Applicant: ERSA GmbH
Inventor： Lothar Endreß , Benedict Fleischmann , Lukas Thanhäuser
CPC classification number: B23K3/085 , B23K1/0016 , H05K3/10 , B23K2101/42
Abstract: A soldering apparatus, in particular a reflow soldering apparatus, for the continuous soldering of printed circuit boards along a transport direction, including a process channel that has a preheating zone, a soldering zone and a cooling zone, and further includes a base body and a cover hood movable between a closed position and an open position, wherein nozzle plates, fan units with fan motors, air ducts that conduct the process gas, filter elements and/or cooling elements are provided in the base body. The soldering apparatus further includes a drawer, which extends along a pull-out direction running transversely to the transport direction, is provided in the base body, with a bottom, a front wall and a rear side. Air ducts for conducting the process gas, at least one replaceable filter element in a filter region and at least one cooling device are provided in the drawer.
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公开(公告)号：US20230143773A1
公开(公告)日：2023-05-11
申请号：US17983689
申请日：2022-11-09
Applicant: ERSA GmbH
Inventor： Lothar Endreß , Benedict Fleishmann , Alexander Diehm
CPC classification number: B23K1/0016 , B23K3/08 , B23K2101/42
Abstract: Soldering apparatus, in particular a reflow soldering apparatus, for the continuous soldering of printed circuit boards along a transport direction, with an entry and an exit for feeding and removing the printed circuit boards, with a process channel including a preheating zone, a soldering zone and/or a cooling zone, and including a main body and at least one cover hood movable between a closed position and an open position, the cover hood enclosing a hood compartment above the process channel in which fan motors are provided. A central suction channel is provided in the hood compartment, in that the first suction elements connected to the suction channel in the hood compartment are provided for the suction of hood compartment air from the hood compartment, in that second suction elements connected to the suction channel in the hood compartment are provided for the suction of process gas from the process channel, and in that a switching device is provided and is configured to switch between an operating mode in which hood compartment air is suctioned via the first suction elements and a cooling mode in which process gas is suctioned via the second suction elements.
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公开(公告)号：US12097575B2
公开(公告)日：2024-09-24
申请号：US17983061
申请日：2022-11-08
Applicant: ERSA GmbH
Inventor： Lothar Endreß , Benedict Fleischmann , Lukas Thanhäuser
IPC: B23K3/00 , B23K1/00 , B23K3/08 , H05K3/10 , B23K101/42
CPC classification number: B23K3/085 , B23K1/0016 , H05K3/10 , B23K2101/42 , H05K2203/1509 , H05K2203/1545
Abstract: A soldering apparatus, in particular a reflow soldering apparatus, for the continuous soldering of printed circuit boards along a transport direction, including a process channel that has a preheating zone, a soldering zone and a cooling zone, and further includes a base body and a cover hood movable between a closed position and an open position, wherein nozzle plates, fan units with fan motors, air ducts that conduct the process gas, filter elements and/or cooling elements are provided in the base body. The soldering apparatus further includes a drawer, which extends along a pull-out direction running transversely to the transport direction, is provided in the base body, with a bottom, a front wall and a rear side. Air ducts for conducting the process gas, at least one replaceable filter element in a filter region and at least one cooling device are provided in the drawer.
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公开(公告)号：US11986899B2
公开(公告)日：2024-05-21
申请号：US17983447
申请日：2022-11-09
Applicant: ERSA GmbH
Inventor： Lothar Endreß , Benedict Fleischmann , Lukas Thanhäuser
CPC classification number: B23K1/012 , H05K3/3494
Abstract: A soldering apparatus, in particular a reflow soldering apparatus, for continuous soldering of printed circuit boards along a transport direction, having a process channel that includes a preheating zone, a soldering zone and a cooling zone, having a base body and a cover hood movable between a closed position and an open position, wherein nozzle plates, fan units with fan motors, air channels carrying the process gas, filter elements and/or cooling elements are provided in the base body. At least one fan unit is arranged in or on the base body laterally next to the process channel in the transport direction, and air channels are arranged and provided in such a manner that process gas is blown into the process channel during operation of the at least one fan unit, with the process gas directed through a filter element provided in a filter region after passing through the process channel, and the filtered process gas drawn in by the at least one fan unit.
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Patent Agency Ranking
公开(公告)号：US20250058393A1
公开(公告)日：2025-02-20
申请号：US18706718
申请日：2022-10-24
Applicant: ERSA GmbH
Inventor： Uwe Hofmann , Lothar Endreß
Abstract: Transport system (34) for transporting soldering material through a soldering apparatus (10), comprising at least one transport track (38, 40) extending in the transport direction (18), wherein the transport track (38, 40) comprises at least two transport rails (42, 44, 46, 48), characterized in that a plurality of coupling elements (72, 120) are provided on at least one transport rail (42, 44, 46), in that the coupling elements (72, 120) comprise guide elements (58, 60, 61) which interact with transverse rods (46) which extend in a transverse direction (54) running transversely to the transport direction (18), and in that the coupling elements (72, 120) each comprise a guide part (100) having the respective guide element (58, 60, 61) and a fastening part (102) fastened to the respective transport rail (42, 44, 46) such that the fastening part (102) can be displaced relative to the guide part (100), so that the distance in the transverse direction (54) between the transport rail (42, 44, 46) and the respective guide part (100) changes.
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公开(公告)号：US12115591B2
公开(公告)日：2024-10-15
申请号：US17983689
申请日：2022-11-09
Applicant: ERSA GmbH
Inventor： Lothar Endreß , Benedict Fleischmann , Alexander Diehm
IPC: B23K3/00 , B23K1/00 , B23K3/08 , B23K101/42
CPC classification number: B23K1/0016 , B23K3/08 , B23K2101/42
Abstract: Soldering apparatus, in particular a reflow soldering apparatus, for the continuous soldering of printed circuit boards along a transport direction, with an entry and an exit for feeding and removing the printed circuit boards, with a process channel including a preheating zone, a soldering zone and/or a cooling zone, and including a main body and at least one cover hood movable between a closed position and an open position, the cover hood enclosing a hood compartment above the process channel in which fan motors are provided. A central suction channel is provided in the hood compartment, in that the first suction elements connected to the suction channel in the hood compartment are provided for the suction of hood compartment air from the hood compartment, in that second suction elements connected to the suction channel in the hood compartment are provided for the suction of process gas from the process channel, and in that a switching device is provided and is configured to switch between an operating mode in which hood compartment air is suctioned via the first suction elements and a cooling mode in which process gas is suctioned via the second suction elements.
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公开(公告)号：US20230147525A1
公开(公告)日：2023-05-11
申请号：US17982621
申请日：2022-11-08
Applicant: ERSA GmbH
Inventor： Alexander Diehm , Lothar Endreß , Uwe Hofmann , Benedict Fleischmann
CPC classification number: B23K3/085 , H05K3/3494 , B23K2101/42
Abstract: Soldering system, in particular a reflow soldering system, for continuous soldering of printed circuit boards along a transport direction, that includes a process channel having a preheating zone, at least one of a soldering zone and a cooling zone, including a main body, at least one covering hood that is pivotable about a hood axis between a closed position, in which the process channel is closed, and an open position, in which the covering hood is open and the process channel is accessible.
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公开(公告)号：US20230144913A1
公开(公告)日：2023-05-11
申请号：US17983760
申请日：2022-11-09
Applicant: ERSA GmbH
Inventor： Lothar Endreß
IPC: B23K37/02 , B65G37/00 , B23K37/047
CPC classification number: B23K37/0211 , B23K37/047 , B65G37/005
Abstract: A transport system for transporting material to be soldered through a soldering apparatus, and soldering apparatus with laterally movable middle support. The transport system for transporting the material to be soldered through the soldering apparatus, includes at least one transport track extending in the transport direction in which the material to be soldered is transportable in a transport plane in the transport direction, wherein the transport track includes two transport bars extending in the transport direction and at least one middle support with a middle bar extending in the transport direction. The middle bar has a revolving conveying means with folding elements, and the conveying means provides a feed in the transport direction and a return counter to the transport direction. The folding elements are displaceable between a support position and a folded position. Further provided is an adjusting device for transverse adjustment of the at least one middle support in a transverse direction running transversely to the transport direction, characterized in that a distance A between an underside of at least one transport bar facing away from the transport plane and the transport plane is smaller than a distance B between an upper side of the at least one middle support facing the transport plane and the transport plane, and that the adjustment device is designed such that the middle support with folding elements is movable in the folded position in the transverse direction underneath the at least one transport bar into a parked position provided laterally next to the transport bar.
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公开(公告)号：US20230141430A1
公开(公告)日：2023-05-11
申请号：US17983447
申请日：2022-11-09
Applicant: ERSA GmbH
Inventor： Lothar Endreß , Benedict Fleischmann , Lukas Thanhäuser
CPC classification number: B23K1/012 , H05K3/3494
Abstract: A soldering apparatus, in particular a reflow soldering apparatus, for continuous soldering of printed circuit boards along a transport direction, having a process channel that includes a preheating zone, a soldering zone and a cooling zone, having a base body and a cover hood movable between a closed position and an open position, wherein nozzle plates, fan units with fan motors, air channels carrying the process gas, filter elements and/or cooling elements are provided in the base body. At least one fan unit is arranged in or on the base body laterally next to the process channel in the transport direction, and air channels are arranged and provided in such a manner that process gas is blown into the process channel during operation of the at least one fan unit, with the process gas directed through a filter element provided in a filter region after passing through the process channel, and the filtered process gas drawn in by the at least one fan unit.
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