公开(公告)号：US11963306B2

公开(公告)日：2024-04-16

申请号：US16633840

申请日：2018-06-29

申请人： Gebr. Schmid GmbH

发明人： Christian Schmid

IPC分类号： H05K3/06 ,  H01L21/67

CPC分类号： H05K3/068 ,  H01L21/6708 ,  H05K3/064 ,  H05K2203/0165 ,  H05K2203/0169 ,  H05K2203/075 ,  H05K2203/1509 ,  H05K2203/1554 ,  H05K2203/1572

摘要： A method of manufacturing printed circuit boards includes some or all of: chemically or electrically applying metallic layers to a substrate; incorporating bores into the substrate; through-contacting the bores incorporated into the substrate; applying a layer from a photoresist to an electrically conducting layer in a masking step; exposing the photoresist while using an exposure mask in an exposing step; removing exposed or unexposed regions of the layer from the photoresist while in regions laying bare the electrically conducting layer in a developing step; removing the laid-bare regions of the electrically conducting layer in an etching step; cleaning the substrate in a rinsing step; and drying the substrate, wherein the substrate for carrying out the developing step and/or the etching step is set in rotation and a developer solution and/or an etching liquid is applied to the rotating substrate by at least one nozzle.

公开(公告)号：US09889473B2

公开(公告)日：2018-02-13

申请号：US14954392

申请日：2015-11-30

申请人： NAGAOKA SEISAKUSHO CORP.

发明人： Soichi Yanagisawa

IPC分类号： B08B1/02 ,  B08B1/00 ,  B08B5/04 ,  A46B13/00 ,  B08B15/04 ,  H01L21/67 ,  H05K3/00

CPC分类号： B08B1/02 ,  A46B7/08 ,  A46B13/00 ,  A46B13/008 ,  A46B2200/30 ,  B08B1/002 ,  B08B15/04 ,  H01L21/67046 ,  H05K3/00 ,  H05K3/0055 ,  H05K3/26 ,  H05K2203/0257 ,  H05K2203/1509

摘要： An apparatus that cleans end surfaces of a substrate includes: a guide unit including a guide portion that has a channel, through which an end surface of a substrate passes, formed in a front surface thereof; and a brush with a front end whose position is controlled by a rear surface of the guide portion. The channel includes an opening that extends through the guide portion and the front end of the brush contacts an end surface of a substrate passing through the channel via the opening. The guide unit includes a concave portion in which at least the front end of the brush is housed and a suction hole that sucks dust from the concave portion.

公开(公告)号：US09699911B2

公开(公告)日：2017-07-04

申请号：US14477830

申请日：2014-09-04

申请人： Wistron Corporation

发明人： Hao-Chun Hsieh ,  Chang-Lung Chen ,  Sheng-Wen Cheng ,  Pi-Chiang Huang

IPC分类号： H05K3/00 ,  H05K13/00 ,  B66F19/00 ,  H05K1/02

CPC分类号： H05K3/007 ,  B66F19/00 ,  H05K1/0271 ,  H05K13/0061 ,  H05K2201/2027 ,  H05K2203/1509

摘要： A process apparatus capable of pushing a panel-shaped object includes a process apparatus and at least one panel-shaped object. The process apparatus includes a carrying fixture and a separating fixture. The carrying fixture has a top surface and a bottom surface opposite to each other and has at least one positioning pillar. The separating fixture has a pushing portion. The panel-shaped object has at least one positioning hole and is carried on the top surface. The positioning pillar is inserted into the positioning hole to position the panel-shaped object. The pushing portion is adapted to move from the bottom surface toward the top surface and protrude out of the top surface, such that the panel-shaped object is pushed up by the pushing portion to be separated from the carrying fixture. In addition, a process method adapted to the process apparatus capable of pushing a panel-shaped object is also provided.

公开(公告)号：US20170151640A1

公开(公告)日：2017-06-01

申请号：US15336826

申请日：2016-10-28

申请人： HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

发明人： XI-HANG LI ,  BING LIU ,  WEI WU ,  QING-LEI PAN ,  SHI-LI ZHANG ,  YUAN GAO

IPC分类号： B23K37/04 ,  H05K3/34

CPC分类号： B23K37/0443 ,  B23K1/0016 ,  B23K2101/42 ,  H05K3/3436 ,  H05K2203/0169 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/1509 ,  H05K2203/159 ,  Y02P70/613

摘要： A clamping device which uses its own weight to apply pressure during a soldering operation to a solderable part or component for attachment to a circuit board is provided. The clamping device includes a base plate and at least one press block which is configured to be arranged on the base plate and is free to move up or down by gravity relative to the base plate. When the gravitational orientation of the clamping device is correct, the press block moves down relative to the base plate and so presses on the solderable part during soldering.

公开(公告)号：US09206514B2

公开(公告)日：2015-12-08

申请号：US12522745

申请日：2008-01-10

申请人： Peter Philip Andrew Lymn

发明人： Peter Philip Andrew Lymn

IPC分类号： C23F1/08 ,  H05K3/00 ,  H05K3/06 ,  H05K3/22

CPC分类号： C23F1/08 ,  H05K3/0085 ,  H05K3/068 ,  H05K3/227 ,  H05K2203/0746 ,  H05K2203/1509

摘要： Treatment apparatus has up-stream rollers 2 and down-stream rollers 3. Between the rollers are provided a pair of upper and lower treatment zone plates 4,5, spaced by a gap 6 through which sheet material to be treated can be passed. The plates have grooves 9 occupied by strips defining up- and down-stream even slots 14,15 for flow of treatment liquid into the gap 6. The ends of the upper plate 4 are smoothly rounded at 37. When sheet material is fed into the gap flow occurs on top of the sheet and up over the rounded edge of the plate. Then it flows sideways off the top of the plate without flowing over the top of the upper rollers.

摘要翻译： 处理装置具有上游辊2和下游辊3.在辊之间设置有一对上部和下部处理区板4,5，其间隔开间隙6，待处理的片材通过该间隙可以通过。 这些板具有槽9，槽9限定上下游，甚至槽14,15，用于将处理液体流入间隙6.上板4的端部在37处平滑地圆化。当将板材料送入 间隙流在板的顶部发生并且在板的圆形边缘上方。 然后它从板的顶部侧向流动，而不会流过上辊的顶部。

公开(公告)号：US20150351251A1

公开(公告)日：2015-12-03

申请号：US14655046

申请日：2013-12-26

申请人： USHIO DENKI KABUSHIKI KAISHA

发明人： Kenichi HIROSE ,  Hiroki HORIBE ,  Tomoyuki HABU ,  Shinichi ENDO

IPC分类号： H05K3/26

CPC分类号： H05K3/0088 ,  H05K1/0373 ,  H05K3/227 ,  H05K3/26 ,  H05K2201/0209 ,  H05K2203/0285 ,  H05K2203/0292 ,  H05K2203/0743 ,  H05K2203/075 ,  H05K2203/0766 ,  H05K2203/081 ,  H05K2203/087 ,  H05K2203/1509

摘要： Provided are a desmearing method and a desmearing device which are able to reliably remove a smear derived from any of an inorganic substance and an organic substance, and eliminate the need to use a chemical that requires a waste liquid treatment. The desmearing method of the present invention is directed to a desmearing method for a wiring substrate material that is a laminated body of insulating layers made from resin containing a filler and a conductive layer, and includes an ultraviolet irradiation treatment step for irradiating the wiring substrate material with ultraviolet beams with a wavelength of 220 nm or less, and a physical vibration treatment step for applying physical vibrations to the wiring substrate material which has undergone the ultraviolet irradiation treatment step.

摘要翻译： 提供了能够可靠地除去来自任何无机物质和有机物质的污迹的除污方法和除污装置，并且不需要使用需要废液处理的化学品。 本发明的除污方法涉及一种布线基板材料的脱模方法，该布线基板材料是由含有填料和导电层的树脂制成的绝缘层的层叠体，并且包括用于照射布线基板材料的紫外线照射处理步骤 具有波长为220nm以下的紫外线，以及用于对经过紫外线照射处理工序的配线基板材料进行物理振动的物理振动处理工序。

公开(公告)号：US09173334B2

公开(公告)日：2015-10-27

申请号：US13797118

申请日：2013-03-12

申请人： Christophe Cousin

发明人： Christophe Cousin

IPC分类号： B23P19/00 ,  H05K13/00 ,  G03F7/20 ,  H05K3/00

CPC分类号： H05K13/0015 ,  G03F7/2022 ,  H05K3/0082 ,  H05K13/00 ,  H05K13/0069 ,  H05K2203/1509 ,  H05K2203/1563 ,  Y10T29/49124 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53261

摘要： Machine and insolation method for panels for turning a panel and successively insolating its first and second faces. According to the invention, this machine comprises at least one first insolation station (10), and a panel turner (30), having a first face and a second face, the latter comprising a prehension device (53, 54), configured to grip a panel (90), a displacement device, configured to displace the prehension device at least between the first and second insolation stations (10, 20), and a pivoting device, configured to pivot the prehension device (53, 54) and in this way have the panel (90) pivot about a pivoting axis (A) parallel to said panel (90), the turner (30) being configured so that it can grip the panel (90) by any one of its faces and release the panel (90) also by any one of its faces.

摘要翻译： 用于转动面板的面板的机器和日照方法，并且连续地使其第一和第二面的不透明化。 根据本发明，该机器包括至少一个第一隔离站（10）和面板转盘（30），其具有第一面和第二面，后者包括预防装置（53,54），其构造成夹紧 至少在所述第一和第二阳极室（10,20）之间移动所述预防装置的移动装置（90），以及枢转装置，所述枢转装置构造成枢转所述预防装置（53,54），并且在该 所述面板（90）围绕平行于所述面板（90）的枢转轴线（A）枢转，所述转盘（30）构造成使得所述面板（90）能够通过其面中的任何一个夹持所述面板（90）并释放所述面板 （90）也由其任何一个面。

公开(公告)号：US09150969B2

公开(公告)日：2015-10-06

申请号：US14196376

申请日：2014-03-04

申请人： TOKYO ELECTRON LIMITED

发明人： Eiichi Nishimura ,  Fumiko Yamashita ,  Koyumi Sasa

IPC分类号： H01L21/302 ,  C23F4/00 ,  H01L21/02 ,  H01L21/3213 ,  H05K3/02

CPC分类号： C23F4/00 ,  H01L21/02071 ,  H01L21/32136 ,  H05K3/027 ,  H05K2203/087 ,  H05K2203/092 ,  H05K2203/095 ,  H05K2203/1388 ,  H05K2203/1484 ,  H05K2203/1492 ,  H05K2203/1509

摘要： In a method of etching a metal layer of an object to be processed, the metal layer is etched by ion sputtering etching while forming a protective film containing carbon on a surface of a mask of the object. The object is exposed to an oxygen plasma after etching the metal layer. The object is exposed to hexafluoroacetylacetone after exposing the object to the oxygen plasma.

摘要翻译： 在蚀刻待处理物体的金属层的方法中，通过离子溅射蚀刻蚀刻金属层，同时在物体的掩模的表面上形成含有碳的保护膜。 在蚀刻金属层之后，将该物体暴露于氧等离子体。 在将物体暴露于氧等离子体之后，该物体暴露于六氟乙酰丙酮。

公开(公告)号：US20120103521A1

公开(公告)日：2012-05-03

申请号：US13280361

申请日：2011-10-25

申请人： CHIEN-PANG CHENG

发明人： CHIEN-PANG CHENG

IPC分类号： C23F1/08

CPC分类号： C23F1/08 ,  H05K3/068 ,  H05K2203/1509 ,  H05K2203/1545

摘要： An etching apparatus includes a conveyor, a spraying mechanism, a suction mechanism, and a controller. The conveyor is configured for conveying a substrate. The spraying mechanism includes a submersible pump and a number of spraying nozzles. The submersible pump selectively operates at an activated state where the spraying nozzles can spray etchant onto the substrate, or an unactivated state where the spraying nozzles cannot spray etchant. The suction mechanism includes a vacuum pump and a number of suction intakes. The vacuum pump selectively operates at an activated state where the suction intakes can suck up the etchant on the substrate, or an unactivated state where the suction intakes cannot suck up the etchant. The controller controls the pumps to operate alternately, so the vacuum pump is unactivated when the submersible pump is activated and vice versa.

摘要翻译： 蚀刻装置包括输送机，喷射机构，抽吸机构和控制器。 输送机构造成用于输送基底。 喷涂机构包括潜水泵和多个喷嘴。 潜水泵选择性地在激活状态下操作，其中喷嘴可以将蚀刻剂喷涂到基底上，或者喷射喷嘴不能喷涂蚀刻剂的未激活状态。 抽吸机构包括真空泵和多个吸入口。 真空泵选择性地操作在吸入口吸附衬底上的蚀刻剂的活化状态，或者吸入入口不能吸附蚀刻剂的未激活状态。 控制器控制泵交替运行，因此当潜水泵启动时，真空泵未激活，反之亦然。

公开(公告)号：US20120080322A1

公开(公告)日：2012-04-05

申请号：US13320522

申请日：2010-05-12

申请人： Henry Kunze

发明人： Henry Kunze

IPC分类号： H05K3/00 ,  B08B1/02 ,  B01J19/08 ,  B08B3/08

CPC分类号： H05K3/0085 ,  B05C3/09 ,  B05C11/06 ,  C25D7/0621 ,  C25D7/0642 ,  C25D17/00 ,  C25D21/10 ,  H05K2203/0143 ,  H05K2203/0746 ,  H05K2203/1509 ,  H05K2203/1572

摘要： In order to remove treatment liquid (21) from a planar material to be treated (10), which is transported in an assembly for the electrolytic or wet-chemical treatment of the material to be treated (10), or to promote the exchange of material on the surface of the material to be treated (10), a roll with a roll surface (4, 14) is provided. The roll surface (4, 14) is arranged relative to a transport path of the material to be treated (10) so that a gap (8, 18) remains between the roll surface (4, 14) and a useful region of the material to be treated (10) opposing the roll surface (4, 14), which extends over the useful region. The roll is driven rotatably so that at the gap (8, 18) a relative speed is produced between the roll surface (4, 14) and the material to be treated (10).

摘要翻译： 为了将待处理的平面材料（10）中的处理液（21）从用于电解或湿化学处理待处理材料（10）的组件中运输，或促进交换 提供待处理材料（10）的表面上的材料，具有辊表面（4,14）的辊。 辊表面（4,14）相对于待处理材料（10）的输送路径布置，使得间隙（8,18）保留在辊表面（4,14）和材料的有用区域之间 待处理（10）与在有用区域上延伸的辊表面（4,14）相对。 辊可旋转地驱动，使得在间隙（8,18）处，在辊表面（4,14）和待处理材料（10）之间产生相对速度。