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    METHOD OF MANUFACTURING A METAL CLAD LAMINATE
    2.
    发明申请
    METHOD OF MANUFACTURING A METAL CLAD LAMINATE 审中-公开
    制造金属层压板的方法

    公开(公告)号：US20120192417A1

    公开(公告)日：2012-08-02

    申请号：US13424676

    申请日：2012-03-20

    申请人： Myung-Sam KANG

    发明人： Myung-Sam KANG

    IPC分类号： H01K3/10

    CPC分类号： H05K3/0035 ,  B32B15/14 ,  B32B15/20 ,  B32B2038/0076 ,  B32B2250/40 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/076 ,  B32B2311/00 ,  B32B2457/00 ,  B32B2535/00 ,  C25D5/12 ,  C25D5/48 ,  H05K3/0038 ,  H05K3/025 ,  H05K3/421 ,  H05K3/427 ,  H05K2201/0394 ,  H05K2203/0361 ,  H05K2203/1388 ,  Y10T29/49165 ,  Y10T428/1275 ,  Y10T428/12778

    摘要： A method for manufacturing a printed circuit board having a via-on-pad (VOP) structure, the method including: preparing an insulator and a metal clad laminate, the laminate having a metal foil and a barrier layer successively formed on the insulator; processing a via hole in the insulator from an upper surface of the insulator, a bottom of the via hole being shielded by the metal foil; removing the barrier layer so as to expose a surface of the metal foil; forming a seed layer of the metal foil and in the via hole; forming a patterned plating resist on upper and lower surfaces of the laminate, a portion of the metal foil, which shields the bottom of the via hole, and a top of the via hole being open; and forming a via inside the via hole, and forming a pad on a lower side of the via.

    摘要翻译： 一种用于制造具有通孔焊接（VOP）结构的印刷电路板的方法，所述方法包括：制备绝缘体和覆金属层压板，所述层压体具有依次形成在所述绝缘体上的金属箔和阻挡层; 在绝缘体的上表面处理绝缘体中的通孔，通孔的底部被金属箔屏蔽; 去除所述阻挡层以暴露所述金属箔的表面; 在所述通孔中形成所述金属箔的种子层; 在层叠体的上表面和下表面上形成图案化的电镀抗蚀剂，金属箔的一部分，其屏蔽通孔的底部，并且通孔的顶部是打开的; 以及在通孔内形成通孔，并且在通孔的下侧形成垫。

    FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    3.
    发明申请
    FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    FLEX-RIGID接线板及其制造方法

    公开(公告)号：US20110056732A1

    公开(公告)日：2011-03-10

    申请号：US12990821

    申请日：2009-05-01

    申请人： Atsuhiro Uratsuji

    发明人： Atsuhiro Uratsuji

    IPC分类号： H05K1/00 ,  B05D5/12 ,  C25D7/00

    CPC分类号： H05K3/4691 ,  H05K3/0035 ,  H05K3/0055 ,  H05K3/4652 ,  H05K2201/09781 ,  H05K2203/0554 ,  H05K2203/1388

    摘要： Provided are a flex-rigid wiring board in which resin that is easily affected by chemicals can be protected reliably without any increase in the number of manufacturing process steps, and a method for manufacturing the flex-rigid wiring board. The flex-rigid wiring board consists of a flexible section (A) and a rigid section (B). The flexible section (A) includes a base film (24) which is an insulating layer and a sheet of copper foil (26) which is a conductor layer. The rigid section (B) is provided integrally with the flexible section (A) and includes circuit patterns (28, 29). One surface of the base film (24) of the flexible section (A) is entirely covered with the sheet of copper foil (26). The sheet of copper foil (26) is removed by etching during an intermediate process step. At a boundary of the flexible section (A) and the rigid section (B), a portion extending from the removed sheet of copper foil (26) located into the rigid section (B).

    摘要翻译： 提供一种柔性刚性布线板，其中可以可靠地保护容易受化学物质影响的树脂，而不增加制造工艺步骤的数量，以及制造柔性刚性布线板的方法。 柔性电路板由柔性部分（A）和刚性部分（B）组成。 柔性部分（A）包括作为绝缘层的基膜（24）和作为导体层的铜箔片（26）。 刚性部分（B）与柔性部分（A）整体设置并且包括电路图案（28,29）。 柔性部分（A）的基膜（24）的一个表面完全被铜箔片（26）覆盖。 在中间工艺步骤期间通过蚀刻去除铜箔（26）。 在柔性部分（A）和刚性部分（B）的边界处，从去除的位于刚性部分（B）的铜箔片（26）延伸的部分。

    Method of manufacturing copper-clad laminate for VOP application
    4.
    发明授权
    Method of manufacturing copper-clad laminate for VOP application 有权
    制造用于VOP应用的覆铜层压板的方法

    公开(公告)号：US07807215B2

    公开(公告)日：2010-10-05

    申请号：US11524401

    申请日：2006-09-21

    申请人： Jong Jin Lee ,  Young Hwan Shin ,  Jae Min Choi ,  Chang Yul Oh

    发明人： Jong Jin Lee ,  Young Hwan Shin ,  Jae Min Choi ,  Chang Yul Oh

    IPC分类号： B05D5/12 ,  B65B33/00

    CPC分类号： B32B38/04 ,  B32B37/12 ,  B32B2038/047 ,  B32B2311/12 ,  B32B2457/08 ,  H05K3/0035 ,  H05K3/0097 ,  H05K3/025 ,  H05K3/421 ,  H05K2203/0152 ,  H05K2203/1388 ,  H05K2203/1536 ,  Y10T156/1052 ,  Y10T156/1082

    摘要： Disclosed herein is a method of manufacturing a copper-clad laminate for Via-On-Pad application. The pad includes the steps of providing a first copper foil layer and a second copper foil layer, on the first surfaces of which protective layers are formed; placing two sets of a first copper foil layer, an insulating layer and a second copper foil layer above and below an adhesive layer, respectively; removing the protective layers, which have been respectively formed on the second copper foil layers, and parts of the second copper foil layers; forming via holes by removing parts of the insulating layers through the regions from which the parts of the second copper foil layers have been removed, using laser processing; and forming two copper-clad laminates by removing the protective layers, which have been respectively formed on one surface of one first copper foil layer and one surface of the other first copper foil layer, and the adhesive layer.

    摘要翻译： 本文公开了一种制造用于Via-On-Pad应用的覆铜层压板的方法。 该垫包括在形成有保护层的第一表面上提供第一铜箔层和第二铜箔层的步骤; 在粘合剂层上分别放置两组第一铜箔层，绝缘层和第二铜箔层; 去除分别形成在第二铜箔层上的保护层和第二铜箔层的部分; 通过使用激光加工从已除去了第二铜箔层的部分的区域去除绝缘层的一部分来形成通孔; 并且通过去除分别形成在一个第一铜箔层的一个表面和另一个第一铜箔层的一个表面上的保护层和粘合剂层来形成两个覆铜层压板。