公开(公告)号：US20120261832A1

公开(公告)日：2012-10-18

申请号：US13449034

申请日：2012-04-17

申请人： Akihito TAKANO ,  Masahiro SUNOHARA ,  Hideaki SAKAGUCHI ,  Mitsutoshi HIGASHI ,  Kenichi OTA ,  Yuichi SASAJIMA

发明人： Akihito TAKANO ,  Masahiro SUNOHARA ,  Hideaki SAKAGUCHI ,  Mitsutoshi HIGASHI ,  Kenichi OTA ,  Yuichi SASAJIMA

IPC分类号： H01L23/48 ,  H01L21/768 ,  H05K1/03

CPC分类号： H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2924/01322 ,  H05K1/0306 ,  H05K1/162 ,  H01L2924/00

摘要： A wiring board provided with a silicon substrate including a through hole that communicates a first surface and a second surface of the silicon substrate. A capacitor is formed on an insulating film, which is applied to the silicon substrate, on the first surface and a wall surface defining the through hole. A capacitor part of the capacitor includes a first electrode, a dielectric layer, and a second electrode that are sequentially deposited on the insulating film on the first surface and the wall surface of the through hole. A penetration electrode is formed in the through hole covered by the first electrode, the dielectric layer, and the second electrode of the capacitor part.

摘要翻译： 具有硅基板的布线基板，该硅基板包括连通硅基板的第一表面和第二表面的通孔。 电容器形成在施加到硅衬底的绝缘膜上的第一表面和限定通孔的壁表面上。 电容器的电容器部分包括依次沉积在通孔的第一表面和壁表面上的绝缘膜上的第一电极，电介质层和第二电极。 在由电容器部分的第一电极，电介质层和第二电极覆盖的通孔中形成穿透电极。

公开(公告)号：US08212355B2

公开(公告)日：2012-07-03

申请号：US12760419

申请日：2010-04-14

申请人： Masahiro Sunohara ,  Yuichi Taguchi

发明人： Masahiro Sunohara ,  Yuichi Taguchi

IPC分类号： H01L23/488 ,  H01L21/60 ,  H01L21/768 ,  H01L23/48

CPC分类号： H01L23/481 ,  H01L21/6835 ,  H01L21/7682 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/3185 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2221/6835 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05023 ,  H01L2224/05025 ,  H01L2224/05568 ,  H01L2224/13009 ,  H01L2224/13016 ,  H01L2224/13019 ,  H01L2224/13021 ,  H01L2224/13025 ,  H01L2224/13076 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10157 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2224/13099

摘要： A semiconductor package includes a semiconductor device, and a wiring board where the semiconductor device is mounted. The semiconductor device includes a semiconductor substrate, a piercing electrode configured to pierce the semiconductor substrate and electrically connect the wiring board and the semiconductor device, and a ring-shaped concave part provided so as to surround the piercing electrode, the ring-shaped concave part being configured to open to a wiring board side of the semiconductor substrate.

摘要翻译： 半导体封装包括半导体器件和安装半导体器件的布线板。 半导体器件包括半导体衬底，穿孔电极，其被构造成穿透半导体衬底并电连接布线板和半导体器件;以及环形凹部，其设置成围绕穿刺电极，环形凹部 被配置为向半导体衬底的布线板侧开口。

公开(公告)号：US08137497B2

公开(公告)日：2012-03-20

申请号：US12409873

申请日：2009-03-24

申请人： Masahiro Sunohara ,  Kei Murayama ,  Mitsutoshi Higashi ,  Hideaki Sakaguchi

发明人： Masahiro Sunohara ,  Kei Murayama ,  Mitsutoshi Higashi ,  Hideaki Sakaguchi

IPC分类号： B29C37/00

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K3/0052 ,  H05K3/205 ,  H05K3/423 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/10674 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/025 ,  H05K2203/0376 ,  H05K2203/0733 ,  H05K2203/1469 ,  H01L2924/00

摘要： A method includes the steps of providing a first tape base material on a single side of a stiffener substrate, forming, on the stiffener substrate, a cavity for accommodating a semiconductor chip therein, inserting the stiffener substrate in the cavity and providing the stiffener substrate on the first tape base material, sealing the semiconductor chip and the stiffener substrate with a sealing resin, and removing the first tape base material and forming a build-up layer on a tape removing surface.

摘要翻译： 一种方法包括以下步骤：在加强基板的单侧上提供第一带基材，在加强基板上形成用于容纳其中的半导体芯片的空腔，将加强基板插入空腔中并将加强基板设置在 第一带状基材，用密封树脂密封半导体芯片和加强基板，并且去除第一带基材并在带剥离表面上形成堆积层。

公开(公告)号：US08111523B2

公开(公告)日：2012-02-07

申请号：US12360443

申请日：2009-01-27

申请人： Masahiro Sunohara ,  Kei Murayama

发明人： Masahiro Sunohara ,  Kei Murayama

IPC分类号： H05K7/00

CPC分类号： H01H37/52 ,  H01H11/00 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K1/16 ,  H05K3/4092 ,  H05K3/4602 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/09481 ,  H05K2201/10053 ,  H05K2203/308

摘要： A wiring board for use in mounting an electronic component includes a switch element portion interposed in a signal transmission line including a wiring layer linked to an electrode terminal of the electronic component. The switch element portion has such a structure as to change the shape thereof depending on a temperature, and to disconnect the signal transmission line when the temperature exceeds a predetermined temperature. A conductor layer which constitutes a portion of the signal transmission line is formed at the bottom of a cavity formed in an electronic component mounting surface side of the wiring board. One end of the switch element portion is fixedly connected to the wiring layer, and another end thereof is in contact with the conductor layer when the temperature is equal to or lower than the predetermined temperature.

摘要翻译： 用于安装电子部件的布线板包括插入在包括与电子部件的电极端子连接的布线层的信号传输线中的开关元件部。 开关元件部分具有根据温度改变其形状的结构，并且当温度超过预定温度时断开信号传输线。 构成信号传输线的一部分的导体层形成在形成在布线板的电子部件安装表面侧的空腔的底部。 当温度等于或低于预定温度时，开关元件部分的一端固定地连接到布线层，并且另一端与导体层接触。

公开(公告)号：US08100555B2

公开(公告)日：2012-01-24

申请号：US12851722

申请日：2010-08-06

申请人： Mitsutoshi Higashii ,  Kei Murayama ,  Yuichi Taguchi ,  Masahiro Sunohara ,  Akinori Shiraishi

发明人： Mitsutoshi Higashii ,  Kei Murayama ,  Yuichi Taguchi ,  Masahiro Sunohara ,  Akinori Shiraishi

IPC分类号： F21V1/00

CPC分类号： F21V11/16 ,  F21K9/00 ,  F21Y2115/10 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/16225 ,  H01L2924/16195

摘要： It is a lighting apparatus 10 that has a light emitting element 16, a light emitting element housing 15 having a concave portion 28 that accommodates the light emitting element 16, and an optically transparent member 18 that airproofs a space B formed by the concave portion 28 and transmits light emitted from the light emitting element 16. The concave portion 28 is shaped to become wider toward the optically transparent member 18 from the bottom surface 28A of the concave portion 28. The lighting apparatus 10 is provided with a light shielding member 12 for shielding a part of light emitted from the light emitting element 16 is provided on the optically transparent member 18.

摘要翻译： 它是具有发光元件16，具有容纳发光元件16的凹部28的发光元件壳体15的照明装置10以及对由凹部28形成的空间B进行空气隔绝的光学透明构件18 并且透射从发光元件16发射的光。凹部28从凹部28的底面28A朝向光学透明构件18变宽。照明装置10设置有遮光构件12， 屏蔽从发光元件16发射的光的一部分设置在光学透明构件18上。

公开(公告)号：US20110227218A1

公开(公告)日：2011-09-22

申请号：US13116623

申请日：2011-05-26

申请人： Akinori Shiraishi ,  Kei Murayama ,  Yuichi Taguchi ,  Masahiro Sunohara ,  Mitsutoshi Higashi

发明人： Akinori Shiraishi ,  Kei Murayama ,  Yuichi Taguchi ,  Masahiro Sunohara ,  Mitsutoshi Higashi

IPC分类号： H01L23/498

CPC分类号： H01L23/147 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/48 ,  H01L33/486 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2224/85455 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： In a silicon substrate for a package, a through electrode is provided with which a through hole passing through from a bottom surface of a cavity for accommodating a chip of an electronic device to a back surface of the substrate is filled. An end part of the through electrode in the bottom surface side of the cavity has a connection part to a wiring that forms an electric circuit including the chip of the electronic device. The silicon substrate for a package is characterized in that (1) a thin film wiring is included as the wiring and the connection part is reinforced by a conductor connected to the thin film wiring and/or (2) a wire bonding part is included as the wiring and the connection part is formed by wire bonding the end part of the through electrode in the bottom surface side of the cavity.

摘要翻译： 在用于封装的硅衬底中，设置有通孔，其中填充有用于容纳电子器件的芯片的空腔的底表面的通孔到衬底的背面。 在空腔的底面侧的贯通电极的端部具有与形成包括电子器件的芯片的电路的布线的连接部。 用于封装的硅衬底的特征在于，（1）包括薄膜布线作为布线，并且连接部分被连接到薄膜布线的导体加强和/或（2）引线接合部分被包括为 通过在空腔的底面侧引线接合贯通电极的端部而形成布线和连接部。

公开(公告)号：US20110147951A1

公开(公告)日：2011-06-23

申请号：US12958730

申请日：2010-12-02

申请人： Kei MURAYAMA ,  Masahiro Sunohara ,  Akinori Shiraishi ,  Hideaki Sakaguchi

发明人： Kei MURAYAMA ,  Masahiro Sunohara ,  Akinori Shiraishi ,  Hideaki Sakaguchi

IPC分类号： H01L23/498 ,  H05K1/11

CPC分类号： H05K1/116 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K1/113 ,  H05K3/4605 ,  H05K2201/09672 ,  H05K2201/0979 ,  H05K2201/10674 ,  H01L2924/00

摘要： A wiring substrate includes a wiring layer, an insulating layer formed on the wiring layer, a connection pad formed on the insulating layer, and a via conductor formed to penetrate the insulating layer, and connecting the wiring layer and the connection pad, wherein the wiring layer located under the connection pad is formed to have via receiving electrode portion whose area is smaller than an area of the connection pad, and a wiring portion separated from the via receiving electrode portion, in an area corresponding to the connection pad, and the via receiving electrode portion is connected to the connection pad via the via conductor.

摘要翻译： 布线基板包括布线层，形成在布线层上的绝缘层，形成在绝缘层上的连接焊盘和形成为穿透绝缘层的通孔导体，并且连接布线层和连接焊盘，其中布线 形成在连接焊盘下方的具有小于连接焊盘的面积的通孔接收电极部以及与通孔接收电极部分对应于与连接焊盘对应的区域的布线部分，以及通孔 接收电极部分经由通孔导体连接到连接焊盘。

公开(公告)号：US07960820B2

公开(公告)日：2011-06-14

申请号：US12265203

申请日：2008-11-05

申请人： Akinori Shiraishi ,  Kei Murayama ,  Yuichi Taguchi ,  Masahiro Sunohara ,  Mitsutoshi Higashi

发明人： Akinori Shiraishi ,  Kei Murayama ,  Yuichi Taguchi ,  Masahiro Sunohara ,  Mitsutoshi Higashi

IPC分类号： H01L23/14

CPC分类号： H01L33/04 ,  B81B2207/012 ,  B81C1/0023 ,  B81C2203/031 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/167 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48465 ,  H01L2224/4911 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0107 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/20752 ,  H01L2224/05599

摘要： A semiconductor package in which an electronic device chip is provided in a cavity of a silicon substrate stacked product constituted by stacking a plurality of silicon substrates.

摘要翻译： 一种半导体封装件，其中电子器件芯片设置在通过堆叠多个硅衬底而构成的硅衬底堆叠产品的空腔中。

公开(公告)号：US07952191B2

公开(公告)日：2011-05-31

申请号：US12187636

申请日：2008-08-07

申请人： Masahiro Sunohara ,  Mitsutoshi Higashi

发明人： Masahiro Sunohara ,  Mitsutoshi Higashi

IPC分类号： H01L23/34

CPC分类号： H01L23/473 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/00

摘要： A semiconductor device of the present invention includes a wiring substrate, a plurality of semiconductor chips mounted on the wiring substrate, and a radiation plate arranged over a plurality of semiconductor chips, and having a cooling passage to flow water in a horizontal direction to the wiring substrate. A plurality of semiconductor chips are arranged along the cooling passage, and out of the plurality of semiconductor chips, the semiconductor chip arranged on an inflow side of the cooling passage, has a smaller amount of heat generation than the semiconductor chip arranged on an outflow side of the cooling passage. For example, a memory chip is arranged on the inflow side of the cooling passage, and a logic chip is arranged on the outflow side of the cooling passage.

摘要翻译： 本发明的半导体器件包括布线基板，安装在布线基板上的多个半导体芯片和布置在多个半导体芯片上的辐射板，并且具有将水沿水平方向流向布线的冷却通道 基质。 沿着冷却通道布置多个半导体芯片，并且在多个半导体芯片中，布置在冷却通道的流入侧上的半导体芯片的发热量比布置在流出侧的半导体芯片的热量少 的冷却通道。 例如，存储芯片布置在冷却通道的流入侧，逻辑芯片布置在冷却通道的流出侧。

公开(公告)号：US07838897B2

公开(公告)日：2010-11-23

申请号：US11673818

申请日：2007-02-12

申请人： Mitsutoshi Higashi ,  Masahiro Sunohara ,  Yuichi Taguchi ,  Akinori Shiraishi ,  Kei Murayama ,  Naoyuki Koizumi ,  Hideaki Sakaguchi

发明人： Mitsutoshi Higashi ,  Masahiro Sunohara ,  Yuichi Taguchi ,  Akinori Shiraishi ,  Kei Murayama ,  Naoyuki Koizumi ,  Hideaki Sakaguchi

IPC分类号： H01L29/267 ,  H01L29/16

CPC分类号： H01L33/60 ,  H01L33/62 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  Y10T29/49002 ,  Y10T83/04 ,  H01L2224/05599

摘要： The invention provides a light-emitting device 10 including a light-emitting element 12 and a substrate 11 where the light-emitting element 12 is arranged, characterized in that a housing part 28 housing the light-emitting element 12 and having a shape that is tapered upward from the substrate 11 and a metal frame 15 surrounding the light-emitting element 12 and including the side face 28A of the housing part 28 made into a almost mirror-polished surface are provided on the substrate 11.

摘要翻译： 本发明提供一种发光装置10，其包括发光元件12和布置有发光元件12的基板11，其特征在于，容纳发光元件12的壳体部28，其形状为 在基板11上设置有从基板11向上方逐渐变细的金属框架15和包围发光元件12的金属框架15，并且将金属框架15包括在壳体部件28的侧面28A上，该壳体部件28被形成为近似镜面抛光的表面。