发明授权
- 专利标题： Semiconductor package and manufacturing method of the semiconductor package
- 专利标题（中）： 半导体封装的半导体封装和制造方法
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申请号： US12760419申请日： 2010-04-14
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公开(公告)号： US08212355B2公开(公告)日： 2012-07-03
- 发明人: Masahiro Sunohara , Yuichi Taguchi
- 申请人： Masahiro Sunohara , Yuichi Taguchi
- 申请人地址： JP Nagano
- 专利权人： Shinko Electric Industries Co., Ltd.
- 当前专利权人： Shinko Electric Industries Co., Ltd.
- 当前专利权人地址： JP Nagano
- 代理机构： IPUSA, PLLC
- 优先权： JP2009-117921 20090514
- 主分类号： H01L23/488
- IPC分类号： H01L23/488 ; H01L21/60 ; H01L21/768 ; H01L23/48
摘要：
A semiconductor package includes a semiconductor device, and a wiring board where the semiconductor device is mounted. The semiconductor device includes a semiconductor substrate, a piercing electrode configured to pierce the semiconductor substrate and electrically connect the wiring board and the semiconductor device, and a ring-shaped concave part provided so as to surround the piercing electrode, the ring-shaped concave part being configured to open to a wiring board side of the semiconductor substrate.
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