公开(公告)号：US20240206062A1

公开(公告)日：2024-06-20

申请号：US18565613

申请日：2022-06-27

申请人： Lotte Energy Materials Corporation

发明人： Chang Yol YANG ,  Won Jin BEOM ,  Hyung Cheol KIM ,  Kideok SONG

IPC分类号： H05K1/09 ,  H05K3/06

CPC分类号： H05K1/09 ,  H05K3/062 ,  H05K2201/0338 ,  H05K2201/0344 ,  H05K2201/0355 ,  H05K2203/0323 ,  H05K2203/0353 ,  H05K2203/0384

摘要： Disclosed are an ultra-thin copper foil with a carrier foil and a method for manufacturing an embedded substrate by using the same, the ultra-thin copper foil with a carrier foil including: a carrier foil; a non-etching release layer on the carrier foil; a first ultra-thin copper foil layer on the non-etching release layer; an etch stop layer on the first ultra-thin copper foil layer; and a second ultra-thin copper foil layer on the etch stop layer.

公开(公告)号：US20240130048A1

公开(公告)日：2024-04-18

申请号：US17800289

申请日：2022-04-29

申请人： Honor Device Co., Ltd.

发明人： Xiaoyong Dong

IPC分类号： H05K3/30 ,  H05K1/02 ,  H05K1/05 ,  H05K1/11 ,  H05K3/10

CPC分类号： H05K3/301 ,  H05K1/0219 ,  H05K1/05 ,  H05K1/11 ,  H05K3/103 ,  H05K2201/0355 ,  H05K2201/10121 ,  H05K2201/10386

摘要： This application relates to the field of electronic technologies, and in particular, to an electronic device. A camera assembly may be supported, and a charging path or a high-current path may be shortened, so that an impedance can be reduced, efficiency can be improved, and power consumption can be prevented from being increased. An electronic device is provided, including a circuit board and a camera assembly, where the circuit board has a mounting hole extending through the circuit board in a thickness direction, and the mounting hole includes a first end and a second end oppositely arranged along the thickness direction of the circuit board; and the camera assembly includes a first part arranged in the mounting hole and a second part extending out from the first end of the mounting hole, and the first part includes a camera substrate assembly; and a support member, arranged on the circuit board and at the mounting hole, where the first part is arranged on the support member, the support member includes at least one conductive sheet, the at least one conductive sheet is further coupled to a metal wiring of the circuit board, and the at least one conductive sheet is insulated from the camera substrate assembly.

公开(公告)号：USRE49929E1

公开(公告)日：2024-04-16

申请号：US17528405

申请日：2021-11-17

申请人： Sumitomo Electric Industries, Ltd. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

发明人： Shingo Kaimori ,  Masaaki Yamauchi ,  Kentaro Okamoto ,  Satoshi Kiya ,  Kazuo Murata

IPC分类号： H05K1/03 ,  B32B15/08 ,  B32B15/082 ,  B32B15/20 ,  B32B27/20 ,  B32B27/30 ,  H05K1/02 ,  H05K1/09 ,  H05K3/00 ,  H05K3/38

CPC分类号： H05K1/0373 ,  B32B15/08 ,  B32B15/082 ,  B32B15/20 ,  B32B27/20 ,  B32B27/30 ,  H05K1/0271 ,  H05K1/03 ,  H05K1/034 ,  H05K1/09 ,  H05K3/0055 ,  H05K3/381 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/029 ,  H05K2201/0355 ,  H05K2201/068 ,  H05K2203/1194

摘要： A first embodiment of a substrate for a high-frequency printed wiring board according to the present disclosure is directed to a substrate for a high-frequency printed wiring board, the substrate including: a dielectric layer including a fluororesin and an inorganic filler; and a copper foil layered on at least one surface of the dielectric layer, wherein a surface of the copper foil at the dielectric layer side has a maximum height roughness (Rz) of less than or equal to 2 μm, and a ratio of the number of inorganic atoms of the inorganic filler to the number of fluorine atoms of the fluororesin in a superficial region of the dielectric layer at the copper foil side is less than or equal to 0.08.

公开(公告)号：US20240040697A1

公开(公告)日：2024-02-01

申请号：US18103729

申请日：2023-01-31

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Jin Young Choi

IPC分类号： H05K1/11

CPC分类号： H05K1/113 ,  H05K2201/09563 ,  H05K2201/0355

摘要： A printed circuit board includes an insulating layer having first and second surfaces opposite to each other with respect to a first direction; a via hole penetrating a region between the first and second surfaces; a first conductor layer including a first contact portion in contact with the first surface and a first non-contact portion protruding from the first contact portion and disposed on the via hole with respect to a second direction perpendicular to the first direction; and a metal layer filling the via hole.

公开(公告)号：US20230363090A1

公开(公告)日：2023-11-09

申请号：US18353471

申请日：2023-07-17

申请人： DAIKIN INDUSTRIES, LTD.

发明人： Hirokazu KOMORI ,  Tatsuya Higuchi ,  Kenzo Takahashi ,  Masahiko Kawamura ,  Koji Yokotani ,  Junpei Terada ,  Nobuyuki Komatsu

IPC分类号： H05K1/03 ,  C08J5/18 ,  C08J5/12

CPC分类号： H05K1/0326 ,  C08J5/18 ,  C08J5/121 ,  C08J2327/18 ,  C08J2327/24 ,  H05K2201/0355 ,  H05K2201/015

摘要： A fluororesin film including a fluorine-containing composition, wherein the oxygen element percentage as measured when heat treatment is performed at 180° C. for 3 minutes and then the state of one or both surfaces of the film is observed by scanning X-ray photoelectron spectroscopy (XPS/ESCA) is 1.35 atom % or more, and an absolute value of the rate of dimensional change in MD and TD before and after heat treatment as measured when the film is heat-treated at 180° C. for 10 minutes and then cooled to room temperature is 2% or less. Also disclosed is a copper-clad laminate, including copper foil and the fluororesin film; a substrate for circuit, including the copper-clad laminate; and a method for producing the copper-clad laminate.

公开(公告)号：US20230363089A1

公开(公告)日：2023-11-09

申请号：US18190181

申请日：2023-03-27

申请人： Wistron NeWeb Corporation

发明人： Li-Kai KUO ,  Ching-Wen CHEN

IPC分类号： H05K1/03 ,  H05K1/02

CPC分类号： H05K1/032 ,  H05K1/028 ,  H05K2201/0355 ,  H05K2201/10098

摘要： A flexible printed circuit and an antenna structure are provided. The flexible printed circuit has a main body part and a bending part and includes a substrate, two copper foil layers, and two coverlays. The substrate includes a first surface and a second surface, and one surface of each of the two copper foil layers is disposed on the first surface and the second surface of the substrate, respectively. Each of the two coverlays is disposed on another surface of each of the two copper foil layers. Each of the two coverlays includes at least two coverlay holes, and the at least two coverlay holes penetrate through the coverlay and are disposed on the main body part.

公开(公告)号：US11792941B2

公开(公告)日：2023-10-17

申请号：US17460458

申请日：2021-08-30

申请人： ImberaTek LLC

发明人： Risto Tuominen ,  Antti Iihola ,  Petteri Palm

IPC分类号： H05K3/06 ,  H01L21/48 ,  H01L23/13 ,  H01L23/538 ,  H01L23/544 ,  H01L23/00 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H01L21/56 ,  H05K3/20 ,  H05K3/40

CPC分类号： H05K3/064 ,  H01L21/4846 ,  H01L21/56 ,  H01L23/13 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/16 ,  H01L24/24 ,  H01L24/82 ,  H01L24/83 ,  H05K1/183 ,  H05K1/187 ,  H05K1/188 ,  H05K3/284 ,  H05K3/303 ,  H05K3/305 ,  H05K3/321 ,  H01L21/568 ,  H01L24/81 ,  H01L24/90 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/18 ,  H01L2224/24227 ,  H01L2224/293 ,  H01L2224/2929 ,  H01L2224/81121 ,  H01L2224/81132 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/82039 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2224/92144 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/1517 ,  H01L2924/15153 ,  H05K3/205 ,  H05K3/32 ,  H05K3/4069 ,  H05K2201/0355 ,  H05K2201/0969 ,  H05K2201/09563 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0353 ,  H05K2203/063 ,  H05K2203/0723 ,  Y02P70/50 ,  Y10T29/4913 ,  H01L2924/00011 ,  H01L2224/29075 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2224/2929 ,  H01L2924/00014 ,  H01L2224/293 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/00 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/0401 ,  H01L2924/00011 ,  H01L2224/0401

摘要： The present publication discloses a circuit-board structure, including a conductor layer on an insulating material layer, and a conductor pattern on top of the conductor foil. A component is attached to the conductor foil and the conductor pattern, the component embedded at least in part in adhesive which attaches the component to the insulating material layer. A recess is formed in the conductor foil and the insulating material layer, and contact openings are in the insulating material layer at locations of contact areas of the component. Conductor material of the conductor foil is not present outside the conductor pattern, and the conductor foil is located between the conductor pattern and the insulating material layer.

公开(公告)号：US11760871B2

公开(公告)日：2023-09-19

申请号：US17285659

申请日：2019-10-09

申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.

发明人： Yoshihiro Nakazumi ,  Kentaro Takano

IPC分类号： B32B3/10 ,  C08L63/00 ,  B32B5/02 ,  B32B15/14 ,  B32B15/20 ,  H05K1/03 ,  H05K1/05 ,  C08J5/24

CPC分类号： C08L63/00 ,  B32B5/024 ,  B32B15/14 ,  B32B15/20 ,  C08J5/244 ,  C08J5/249 ,  H05K1/0373 ,  H05K1/056 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2457/08 ,  C08J2363/00 ,  C08J2439/04 ,  C08J2463/00 ,  C08J2465/00 ,  C08L2203/20 ,  C08L2205/035 ,  H05K2201/0355

摘要： A thermosetting resin composition containing a thermosetting resin (A), boron nitride (B), and a dispersant (C) with a pH of 8 or higher.

公开(公告)号：US20230171887A1

公开(公告)日：2023-06-01

申请号：US17921024

申请日：2021-04-28

申请人： Rogers Germany GmbH

发明人： Tilo Welker ,  Karsten Schmidt ,  Stefan Britting

IPC分类号： H05K1/03 ,  H05K3/38 ,  C04B37/02

CPC分类号： H05K1/0306 ,  H05K3/388 ,  C04B37/026 ,  C04B37/021 ,  H05K2201/0355 ,  C04B2237/407

摘要： A support substrate (1), in particular a metal-ceramic substrate, as a support for electric components, comprising: —at least one metal layer (10) and—an insulating element (30), in particular a ceramic element, a glass element, a glass ceramic element, and/or a high temperature-resistant plastic element. The at least one metal layer (10) and the insulating element (30) extend along a main extension plane (HSE) and are arranged one over the other in a stacking direction (S) running perpendicularly to the main extension plane (HSE), wherein in a completed support substrate (1), a binding layer (12) is formed between the at least one metal layer (10) and the insulating element (30), and an adhesive layer (13) of the binding layer (12) has a surface resistance which is greater than 5 Ohm/sq.

公开(公告)号：US11659651B2

公开(公告)日：2023-05-23

申请号：US17719584

申请日：2022-04-13

申请人： Hitachi Astemo, Ltd.

发明人： Kazuo Maruyama

IPC分类号： H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00

CPC分类号： H05K1/0271 ,  H05K1/0306 ,  H05K1/116 ,  H05K3/0067 ,  H05K3/0094 ,  H05K2201/029 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0959

摘要： The casing of an electronic control device includes a casing-side contact surface in contact with the end of a printed-circuit board. A cover includes a cover-side contact surface holding the end of the printed-circuit board together with the casing-side contact surface by being in contact with the end of the printed-circuit board. In the printed-circuit board, a held portion held between the casing-side contact surface and the cover-side contact surface is provided with a through-hole via.