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公开(公告)号：US20210047497A1
公开(公告)日：2021-02-18
申请号：US17081446
申请日：2020-10-27
发明人： Hirokazu KOMORI , Junpei TERADA , Hiroyuki SENDAN , Tadahiro YABU , Yukihiro FUKAGAWA , Kenta MURAYAMA , Tomohiro SHIROMARU , Toshio MIYATANI , Masahiro KONDOU , Hiroyuki HAMADA
IPC分类号： C08K3/36 , B29C64/153 , B29C64/314 , B33Y70/00
摘要： A shaping material for a powder bed fusion method, including a powder of a fluororesin, wherein the fluororesin has a D50 of 30 μm or more and 200 μm or less, and the fluororesin has a D10 of 12 μm or more.
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公开(公告)号：US20230265309A1
公开(公告)日：2023-08-24
申请号：US18311305
申请日：2023-05-03
IPC分类号： C09D127/12 , C09D7/47 , C09D7/61 , H05K1/03
CPC分类号： C09D127/12 , C09D7/47 , C09D7/61 , H05K1/0373 , H05K2201/0209 , H05K2201/015
摘要： An aqueous coating material composition containing fluororesin particles (A) that can be melt-molded, further comprising silica particles (B), a non-fluorinated surfactant (C) and water (D), wherein the fluororesin particles (A) have an average particle size of 0.05 to 1000 μm, wherein the silica particles (B) have an average particle size of 0.1 to 20 μm, wherein the fluororesin particles (A) and the silica particles (B) have a blending ratio: Fluororesin particles (A)/Silica particles (B)=10/90 to 90/10 (mass ratio), and wherein a content of fluororesin particles (A) is 15 to 80 mass % relative to 100 mass % of solid content of the coating material. Also disclosed is a coated article including a coating layer formed by applying the aqueous coating material composition.
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公开(公告)号：US20230133748A1
公开(公告)日：2023-05-04
申请号：US18148669
申请日：2022-12-30
IPC分类号： B29C64/30 , B29C64/153 , B33Y10/00 , B33Y40/20 , B33Y80/00
摘要： A three-dimensional shaped object including a fluororesin, wherein the three-dimensional shaped object is a laminate of a layer according to the slice data of the three-dimensional structure. The three-dimensional shaped object has a tensile stress at break of 9 MPa or more, and a tensile elongation at break in the direction perpendicular to the shaped plane of 20% or more. Also disclosed is a method for producing the three-dimensional shaped object.
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公开(公告)号：US20240215161A1
公开(公告)日：2024-06-27
申请号：US18600472
申请日：2024-03-08
发明人： Hirokazu KOMORI , Hiroyuki YOSHIMOTO , Masaji KOMORI , Yuki UEDA , Junpei TERADA
IPC分类号： H05K1/03 , B32B5/02 , B32B15/082 , B32B15/20 , B32B17/10 , B32B27/12 , B32B27/20 , B32B27/32 , C08F214/26 , C08J5/18 , C08K3/36 , C08K7/18
CPC分类号： H05K1/0366 , B32B5/022 , B32B5/024 , B32B15/082 , B32B15/20 , B32B17/10 , B32B27/12 , B32B27/20 , B32B27/322 , C08F214/262 , C08J5/18 , C08K3/36 , C08K7/18 , B32B2262/101 , B32B2264/1021 , B32B2457/08 , C08F2800/10 , C08J2327/18 , H05K2201/015
摘要： A laminate, including a fluororesin sheet; and a base material. The fluororesin sheet including a fluororesin composition containing: a melt moldable fluororesin; and a silica. The fluororesin is a tetrafluoroethylene-perfluoro(alkyl vinyl ether) copolymer and/or a tetrafluoroethylene-hexafluoropropylene copolymer having 25 or more carbonyl group-containing functional groups per 106 main-chain carbon atoms; the silica is a spherical silica; a blending ratio of the spherical silica to a total amount of the fluororesin and the silica is 50% by mass or higher and 70% by mass or lower; the fluororesin composition has a linear expansion coefficient of 100 ppm/° C. or lower and a melt flow rate (MFR) of 1.0 g/10 min or higher and 30 g/10 min or lower. Also disclosed is a substrate for circuits including the fluororesin sheet used as a part in a multilayer structure.
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5.发明公开公开(公告)号：US20240092061A1
公开(公告)日：2024-03-21
申请号：US18495857
申请日：2023-10-27
发明人： Keisuke NAGATO , Kota AONO , Yusuke EBIHARA , Masayuki NAKAO , Yuki UEDA , Shingo OKUNO , Hirokazu KOMORI , Akiyoshi YAMAUCHI , Yosuke KISHIKAWA
CPC分类号： B32B15/08 , B32B15/20 , B32B2307/50 , B32B2311/12 , B32B2398/10
摘要： A joined article including: a resin (1) having a linear expansion coefficient at 30° C. to 200° C. of 17 ppm/° C. or higher and a thickness of 5 to 100 μm; and a metal joined to a surface of the resin (1) and having a thickness of 5 to 50 μm. The resin (1) includes a heat-affected layer that is close to the metal and that occupies 80% or less of the thickness of the resin (1), and the joined article is a dielectric material for a substrate. Also disclosed is a substrate including the joined article and a resin (2) stacked on the joined article.
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公开(公告)号：US20230167269A1
公开(公告)日：2023-06-01
申请号：US18094935
申请日：2023-01-09
发明人： Hirokazu KOMORI , Junpei Terada , Hiroyuki Sendan , Tadahiro Yabu , Yukihiro Fukagawa , Kenta Murayama , Tomohiro Shiromaru , Toshio Miyatani , Masahiro Kondou , Hiroyuki Hamada
IPC分类号： C08K3/36 , B33Y70/00 , B29C64/314 , B29C64/153 , B33Y70/10
CPC分类号： C08K3/36 , B29C64/153 , B29C64/314 , B33Y70/00 , B33Y70/10 , B29K2027/18
摘要： A molded body which is formed from a shaping material containing a fluororesin powder. The fluororesin powder has a D50 of 30 µm or more and 200 µm or less and a D10 of 12 µm or more. Also disclosed is a method for forming a molded body from a shaping material containing the fluororesin powder, the method including controlling the temperature of the fluororesin powder; and irradiating the fluororesin powder with a laser at the controlled temperature to fuse the same.
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公开(公告)号：US20220135767A1
公开(公告)日：2022-05-05
申请号：US17575695
申请日：2022-01-14
发明人： Hirofumi MUKAE , Hirokazu KOMORI , Masaji KOMORI , Hideki KONO , Ayane NAKAUE
IPC分类号： C08K3/38 , C08F214/26 , H05K1/03 , B32B15/082 , B32B27/20 , B32B27/30
摘要： A resin composition for a circuit board, containing a melt-fabricable fluororesin and a particulate boron nitride. The particulate boron nitride has a ratio (b)/(a) of 1.0 or higher, wherein (a) represents a proportion of particles having a particle size of 14.6 to 20.6 μm and (b) represents a proportion of particles having a particle size of 24.6 to 29.4 μm. Also disclosed is a molded article for a circuit board obtained from the resin composition, a laminate for a circuit board including a metal layer (A1) and a layer (B) obtained from the resin composition, and a circuit board including a metal layer (A2) and a layer (B) obtained from the resin composition.
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公开(公告)号：US20210345485A1
公开(公告)日：2021-11-04
申请号：US17279629
申请日：2019-12-24
发明人： Hirokazu KOMORI , Hiroyuki YOSHIMOTO , Masaji KOMORI , Yuki UEDA , Junpei TERADA
IPC分类号： H05K1/03 , B32B27/32 , B32B27/20 , B32B15/082 , B32B15/20 , B32B5/02 , B32B27/12 , C08F214/26 , C08K3/36 , C08K7/18 , C08J5/18
摘要： A fluororesin composition containing a melt moldable fluororesin and a silica, wherein the fluororesin has 25 or more carbonyl group-containing functional groups per 106 main-chain carbon atoms; the silica is a spherical silica; and the fluororesin composition has a linear expansion coefficient of 100 ppm/° C. or lower. Also disclosed is a fluororesin sheet including the fluororesin composition, a laminate including a copper foil layer and a layer including the fluororesin composition and a substrate for circuits including a copper foil layer and a layer including the fluororesin composition.
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公开(公告)号：US20170231088A1
公开(公告)日：2017-08-10
申请号：US15501949
申请日：2015-08-05
CPC分类号： H05K1/036 , B32B7/02 , B32B7/04 , B32B7/06 , B32B15/08 , B32B15/082 , B32B15/20 , B32B27/08 , B32B27/12 , B32B27/16 , B32B27/20 , B32B27/285 , B32B27/30 , B32B27/304 , B32B27/32 , B32B27/322 , B32B2250/03 , B32B2250/04 , B32B2250/05 , B32B2250/40 , B32B2255/06 , B32B2255/205 , B32B2262/101 , B32B2264/101 , B32B2264/102 , B32B2264/107 , B32B2307/204 , B32B2307/30 , B32B2307/306 , B32B2307/408 , B32B2307/538 , B32B2307/732 , B32B2307/734 , B32B2307/748 , B32B2457/00 , H05K1/034 , H05K1/09 , H05K3/06 , H05K3/381 , H05K3/4644 , H05K2201/015 , H05K2203/097
摘要： Provided is a double-sided circuit substrate being a laminate of: a composite material comprising a fluorine resin and a glass cloth; and a copper foil having a two-dimensional roughness Ra in a mat surface (a surface that comes in contact with the resin) of less than 0.2 μm. Ideally, a surface of the fluorine resin has an O content of at least 1.0%, as observed using ESCA.
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公开(公告)号：US20230363090A1
公开(公告)日：2023-11-09
申请号：US18353471
申请日：2023-07-17
发明人： Hirokazu KOMORI , Tatsuya Higuchi , Kenzo Takahashi , Masahiko Kawamura , Koji Yokotani , Junpei Terada , Nobuyuki Komatsu
CPC分类号： H05K1/0326 , C08J5/18 , C08J5/121 , C08J2327/18 , C08J2327/24 , H05K2201/0355 , H05K2201/015
摘要： A fluororesin film including a fluorine-containing composition, wherein the oxygen element percentage as measured when heat treatment is performed at 180° C. for 3 minutes and then the state of one or both surfaces of the film is observed by scanning X-ray photoelectron spectroscopy (XPS/ESCA) is 1.35 atom % or more, and an absolute value of the rate of dimensional change in MD and TD before and after heat treatment as measured when the film is heat-treated at 180° C. for 10 minutes and then cooled to room temperature is 2% or less. Also disclosed is a copper-clad laminate, including copper foil and the fluororesin film; a substrate for circuit, including the copper-clad laminate; and a method for producing the copper-clad laminate.
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