公开(公告)号：US11792941B2

公开(公告)日：2023-10-17

申请号：US17460458

申请日：2021-08-30

申请人： ImberaTek LLC

发明人： Risto Tuominen ,  Antti Iihola ,  Petteri Palm

IPC分类号： H05K3/06 ,  H01L21/48 ,  H01L23/13 ,  H01L23/538 ,  H01L23/544 ,  H01L23/00 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H01L21/56 ,  H05K3/20 ,  H05K3/40

CPC分类号： H05K3/064 ,  H01L21/4846 ,  H01L21/56 ,  H01L23/13 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/16 ,  H01L24/24 ,  H01L24/82 ,  H01L24/83 ,  H05K1/183 ,  H05K1/187 ,  H05K1/188 ,  H05K3/284 ,  H05K3/303 ,  H05K3/305 ,  H05K3/321 ,  H01L21/568 ,  H01L24/81 ,  H01L24/90 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/18 ,  H01L2224/24227 ,  H01L2224/293 ,  H01L2224/2929 ,  H01L2224/81121 ,  H01L2224/81132 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/82039 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2224/92144 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/1517 ,  H01L2924/15153 ,  H05K3/205 ,  H05K3/32 ,  H05K3/4069 ,  H05K2201/0355 ,  H05K2201/0969 ,  H05K2201/09563 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0353 ,  H05K2203/063 ,  H05K2203/0723 ,  Y02P70/50 ,  Y10T29/4913 ,  H01L2924/00011 ,  H01L2224/29075 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2224/2929 ,  H01L2924/00014 ,  H01L2224/293 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/00 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/0401 ,  H01L2924/00011 ,  H01L2224/0401

摘要： The present publication discloses a circuit-board structure, including a conductor layer on an insulating material layer, and a conductor pattern on top of the conductor foil. A component is attached to the conductor foil and the conductor pattern, the component embedded at least in part in adhesive which attaches the component to the insulating material layer. A recess is formed in the conductor foil and the insulating material layer, and contact openings are in the insulating material layer at locations of contact areas of the component. Conductor material of the conductor foil is not present outside the conductor pattern, and the conductor foil is located between the conductor pattern and the insulating material layer.

公开(公告)号：US09679188B2

公开(公告)日：2017-06-13

申请号：US14991550

申请日：2016-01-08

申请人： J-METRICS TECHNOLOGY Co., Ltd.

发明人： Wei-Ting Lin

IPC分类号： G06K9/00 ,  H05K3/32 ,  H05K1/18

CPC分类号： G06K9/00053 ,  G06K9/0004 ,  H05K1/181 ,  H05K1/187 ,  H05K3/32 ,  H05K2201/10151 ,  H05K2203/1305

摘要： A fingerprint sensor packaging module includes a light-pervious cover layer, a conductive pattern layer on the light-pervious cover layer, a finger sensing chip on the conductive pattern layer, a circuit board on the light-pervious cover layer, and a package member. The conductive pattern layer includes a plurality of pads. The fingerprint sensing chip is electrically connected to the conductive pattern layer by contacting to the pads. The circuit board is electrically connected to the conductive pattern layer and has a hole and the hole exposes the fingerprint sensing chip. The fingerprint sensing chip is disposed in the hole. The package member disposed in the hole and at least cover the fingerprint sensing chip.

公开(公告)号：US09622354B2

公开(公告)日：2017-04-11

申请号：US14076292

申请日：2013-11-11

申请人： GE Embedded Electronics Oy

发明人： Risto Tuominen ,  Antti Iihola ,  Petteri Palm

IPC分类号： H05K3/30 ,  H05K3/06 ,  H01L21/48 ,  H01L23/13 ,  H05K1/18 ,  H01L23/538 ,  H01L23/544 ,  H01L23/00 ,  H05K3/20 ,  H05K3/28 ,  H05K3/32 ,  H05K3/40

CPC分类号： H05K3/064 ,  H01L21/4846 ,  H01L21/56 ,  H01L21/568 ,  H01L23/13 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/16 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/90 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/18 ,  H01L2224/24227 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81121 ,  H01L2224/81132 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/82039 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2224/92144 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/183 ,  H05K1/187 ,  H05K1/188 ,  H05K3/205 ,  H05K3/284 ,  H05K3/303 ,  H05K3/305 ,  H05K3/32 ,  H05K3/321 ,  H05K3/4069 ,  H05K2201/0355 ,  H05K2201/09563 ,  H05K2201/0969 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0353 ,  H05K2203/063 ,  H05K2203/0723 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2224/29075 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method for manufacturing a circuit-board structure wherein a conductor foil is provided on an insulating material layer, a resist layer is spread on the conductor foil and a recess formed in the conductor foil and insulating material layer. The resist layer is patterned to form a conductor-pattern having openings wherein conductor patterns may be grown. A component is attached to the conductor foil and conductor pattern and conductor material is removed which does not form part of a conductor pattern.

公开(公告)号：US09590154B2

公开(公告)日：2017-03-07

申请号：US14459621

申请日：2014-08-14

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Yasuyoshi Horikawa

IPC分类号： H01L33/60 ,  H01L33/62 ,  H05K1/02 ,  H05K1/18 ,  H01L25/16 ,  H05K1/05

CPC分类号： H01L33/60 ,  H01L24/45 ,  H01L25/167 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0274 ,  H05K1/056 ,  H05K1/187 ,  H05K1/188 ,  H05K2201/0376 ,  H05K2201/10106 ,  H05K2201/10174 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00

摘要： A wiring substrate includes an insulation layer, separated wires formed on a first surface of the insulation layer, a first plating layer formed on a first surface of each of the wires, a reflection layer including a first opening that exposes at least a portion of the first plating layer as a connection pad, and an electronic component mounted on a second surface of each of the wires, which is located on an opposite side of the first surface of each of the wires. The electronic component is embedded in the insulation layer.

摘要翻译： 布线基板包括绝缘层，形成在绝缘层的第一表面上的分离线，形成在每条导线的第一表面上的第一镀层，包括第一开口的反射层，该第一开口暴露至少一部分 第一电镀层作为连接焊盘，以及电子部件，其安装在每个电线的第二表面上，该电子部件位于每个电线的第一表面的相对侧上。 电子部件嵌入绝缘层。

公开(公告)号：US20160366766A1

公开(公告)日：2016-12-15

申请号：US14886581

申请日：2015-10-19

申请人： HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. ,  FuKui Precision Component (Shenzhen) Co., Ltd. ,  Zhen Ding Technology Co., Ltd.

发明人： TZU-CHIEN YEH

IPC分类号： H05K1/18 ,  H05K1/02 ,  H05K3/40 ,  H05K1/03 ,  H05K3/18 ,  H05K3/46 ,  H05K1/11 ,  H05K1/09

CPC分类号： H05K1/184 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/092 ,  H05K1/111 ,  H05K1/115 ,  H05K1/187 ,  H05K3/0097 ,  H05K3/188 ,  H05K3/4038 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/0203 ,  H05K2201/0391 ,  H05K2201/09545 ,  H05K2203/0278 ,  H05K2203/122 ,  H05K2203/1536 ,  Y10T29/49165

摘要： A circuit board includes a core layer, at least one passive component, a first and a second conductive wire layers, at least one contact pad, and a resin packing layer. The core layer defines at least one through hole to receive the passive component. The first and the second conductive wire layers are connected to two opposite surfaces of the core layer. Each contact pad is positioned between and connected to one passive component and the first conductive wire layer. The resin packing layer is filled among the core layer, each passive component, each contact pad, the first and the second conductive wire layers. The resin packing layer can connect the first and the second conductive wire layers to the core layer, and connect the core layer, each passive component, and each contact pads to each other.

摘要翻译： 电路板包括芯层，至少一个无源部件，第一和第二导线层，至少一个接触焊盘和树脂封装层。 芯层限定至少一个通孔以接收无源部件。 第一和第二导线层连接到芯层的两个相对的表面。 每个接触垫位于一个无源部件和第一导电层之间并连接到其上。 在芯层，每个无源部件，每个接触焊盘，第一和第二导线层中填充树脂填充层。 树脂填充层可以将第一和第二导线层连接到芯层，并且将芯层，每个无源部件和每个接触焊盘彼此连接。

公开(公告)号：US20160363974A1

公开(公告)日：2016-12-15

申请号：US15247902

申请日：2016-08-25

申请人： Unimicron Technology Corp.

发明人： Yin-Ju CHEN ,  Ming-Hao WU ,  Cheng-Po YU

IPC分类号： G06F1/20 ,  H01L23/498 ,  H05K1/18 ,  H01L35/30 ,  H05K1/02

CPC分类号： H05K3/4647 ,  G06F1/206 ,  H01L23/12 ,  H01L23/13 ,  H01L23/4275 ,  H01L23/49827 ,  H01L35/30 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15153 ,  H01L2924/15313 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/14 ,  H05K1/181 ,  H05K1/185 ,  H05K1/187 ,  H05K3/36 ,  H05K3/4697 ,  H05K2201/048 ,  H05K2201/10219 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10734

摘要： A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.

摘要翻译： 具有热恢复功能的电路板包括基板，储热装置和热电装置。 储热装置嵌入在基板中并与处理器连接，以与处理器进行热交换。 嵌入在基板中的热电装置包括第一金属结表面和第二金属结表面。 第一金属接合面与蓄热装置连接，与蓄热装置进行热交换。 第二金属结表面与第一金属结表面接合，其中热电装置通过第一金属接合表面和第二金属结表面之间的温度差产生电位。

公开(公告)号：US20160204054A1

公开(公告)日：2016-07-14

申请号：US14686785

申请日：2015-04-15

申请人： Subtron Technology Co., Ltd.

发明人： Chao-Min Wang

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  B32B37/14 ,  B32B37/06

CPC分类号： H05K1/187 ,  B32B2439/00 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49822 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2924/0002 ,  H05K3/007 ,  H01L2924/00

摘要： A manufacturing method of a package carrier is provided. A carrier having a connecting surface is provided. A releasable solder resist layer is formed on the connecting surface of the carrier and completely covers the connecting surface. A substrate having an upper surface and a lower surface opposite to each other is provided. A first patterned solder resist layer is formed on the lower surfaces of the substrate and exposes a portion of the lower surface. The carrier and the substrate are laminated, the releasable solder resist layer directly contacts the first patterned solder resist layer, and the carrier is temporarily bonded to the first patterned solder resist layer through the releasable solder resist layer.

摘要翻译： 提供了一种封装载体的制造方法。 提供具有连接表面的载体。 在载体的连接表面上形成可剥离的阻焊层，并且完全覆盖连接表面。 提供具有彼此相对的上表面和下表面的基板。 第一图案化阻焊层形成在基板的下表面上并暴露下表面的一部分。 载体和基板层叠，可剥离阻焊层直接接触第一图案化阻焊层，载体通过可剥离阻焊层临时接合到第一图案化阻焊层。

公开(公告)号：US08987901B2

公开(公告)日：2015-03-24

申请号：US13685917

申请日：2012-11-27

申请人： Kenji Sasaoka

发明人： Kenji Sasaoka

IPC分类号： H01L23/485 ,  H01L23/498 ,  H01L23/538 ,  H05K1/18 ,  H01L29/66 ,  H01L23/00 ,  H05K3/34 ,  H05K3/46

CPC分类号： H01L23/49861 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/16 ,  H01L29/66007 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81385 ,  H01L2224/81447 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/19041 ,  H05K1/186 ,  H05K1/187 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/4602 ,  H05K3/4614 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/061 ,  H05K2203/063 ,  Y02P70/611 ,  H01L2924/01014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Disclosed is a component built-in wiring board including: a first insulating layer on a second one having laminated at least two insulating layers; a semiconductor chip buried in the second insulating layer, having a terminal pad; a wiring pattern between the first and the second insulating layers, including a mounting land and having a roughened surface facing the second insulating layer; a conductive bump between the terminal pad and the mounting land; a resin between the semiconductor chip and both the first insulating layer and the wiring pattern; a second wiring pattern between the at least two insulating layers; and an interlayer connector between surfaces of the wiring pattern and the second wiring pattern to penetrate partly through the second insulating layer in a layered direction, made of a conductive composition, and having a shape with an axis along the layered direction and a diameter varying in an axial direction.

摘要翻译： 公开了一种部件内置布线板，包括：第一绝缘层，其在第二绝缘层上层压有至少两个绝缘层; 埋入第二绝缘层中的半导体芯片，具有端子焊盘; 所述第一和第二绝缘层之间的布线图案包括安装台面，并且具有面向所述第二绝缘层的粗糙表面; 端子焊盘和安装焊盘之间的导电凸块; 半导体芯片与第一绝缘层和布线图案之间的树脂; 所述至少两个绝缘层之间的第二布线图案; 以及所述布线图案和所述第二布线图案的表面之间的层间连接器，以分层方式部分地穿过所述第二绝缘层，由导电性组合物制成，并且具有沿着所述层叠方向的轴的形状，并且直径在 轴向。

公开(公告)号：US20150034374A1

公开(公告)日：2015-02-05

申请号：US14446475

申请日：2014-07-30

申请人： IBIDEN CO., LTD.

发明人： Keisuke SHIMIZU ,  Yuichi NAKAMURA ,  Tsuyoshi YAMAGUCHI

IPC分类号： H05K1/18 ,  H05K3/40 ,  H05K3/30 ,  H01L23/00 ,  H05K1/09

CPC分类号： H01L24/83 ,  H01L2224/04105 ,  H01L2224/16235 ,  H01L2224/19 ,  H01L2224/27464 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/92244 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/187 ,  H05K3/0097 ,  H05K3/4682 ,  H05K2201/068 ,  H05K2203/0156 ,  H05K2203/1536 ,  Y10T29/302 ,  H01L2924/00 ,  H01L2224/83005

摘要： A printed wiring board includes a first insulation layer, an electronic component built into the first insulation layer, a second insulation layer having a via conductor and formed on a first surface of the first insulation layer, and a conductive film formed on the first insulation layer on the opposite side with respect to the first surface of the first insulation layer such that the conductive film is positioned to face a back surface of the electronic component. The first insulation layer has a coefficient of thermal expansion which is set higher than a coefficient of thermal expansion of the second insulation layer.

摘要翻译： 印刷布线板包括第一绝缘层，内置在第一绝缘层中的电子部件，具有通孔导体并形成在第一绝缘层的第一表面上的第二绝缘层和形成在第一绝缘层上的导电膜 在相对于第一绝缘层的第一表面的相对侧上，使得导电膜定位成面对电子部件的后表面。 第一绝缘层具有设定为高于第二绝缘层的热膨胀系数的热膨胀系数。

公开(公告)号：US08943683B2

公开(公告)日：2015-02-03

申请号：US14052443

申请日：2013-10-11

申请人： Unimicron Technology Corp.

发明人： Tsung-Yuan Chen ,  Ming-Huang Ting

IPC分类号： H05K3/20 ,  H05K3/00 ,  H05K3/40 ,  H01L21/683 ,  H01L23/538 ,  H01L23/00 ,  H05K1/18 ,  H05K3/46

CPC分类号： H05K3/4007 ,  H01L21/6835 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68304 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/2919 ,  H01L2224/321 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81903 ,  H01L2224/83005 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/186 ,  H05K1/187 ,  H05K3/4614 ,  H05K3/4647 ,  H05K2201/10674 ,  H05K2203/063 ,  Y10T29/49124 ,  Y10T29/49128 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/19 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A fabricating method of an embedded package structure includes following steps. First and second boards are combined to form an integrated panel. First and second circuit structures are respectively formed on the first and second boards that are then separated. An embedded element is electrically disposed on the first circuit structure. First and second conductive bumps are respectively formed on a conductive circuit substrate and the second circuit structure. First and second semi-cured films are provided; a laminating process is performed to laminate the first circuit structure on the first board, the first and second semi-cured films, the conductive circuit substrate, and the second circuit structure on the second board. The first and second semi-cured films encapsulate the embedded element. The first and second conductive bumps respectively pierce through the first and second semi-cured films and are electrically connected to the first circuit structure and the conductive circuit substrate, respectively.

摘要翻译： 嵌入式封装结构的制造方法包括以下步骤。 第一和第二板组合形成集成面板。 第一和第二电路结构分别形成在第一和第二板上，然后分离。 嵌入式元件电气地布置在第一电路结构上。 第一和第二导电凸块分别形成在导电电路基板和第二电路结构上。 提供第一和第二半固化膜; 执行层压工艺以将第一板上的第一电路结构，第二和第二半固化膜，导电电路基板和第二电路结构层叠在第二板上。 第一和第二半固化膜封装了嵌入元件。 第一和第二导电凸块分别穿过第一和第二半固化膜，并分别电连接到第一电路结构和导电电路基板。