公开(公告)号：US20160363974A1

公开(公告)日：2016-12-15

申请号：US15247902

申请日：2016-08-25

申请人： Unimicron Technology Corp.

发明人： Yin-Ju CHEN ,  Ming-Hao WU ,  Cheng-Po YU

IPC分类号： G06F1/20 ,  H01L23/498 ,  H05K1/18 ,  H01L35/30 ,  H05K1/02

CPC分类号： H05K3/4647 ,  G06F1/206 ,  H01L23/12 ,  H01L23/13 ,  H01L23/4275 ,  H01L23/49827 ,  H01L35/30 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15153 ,  H01L2924/15313 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/14 ,  H05K1/181 ,  H05K1/185 ,  H05K1/187 ,  H05K3/36 ,  H05K3/4697 ,  H05K2201/048 ,  H05K2201/10219 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10734

摘要： A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.

摘要翻译： 具有热恢复功能的电路板包括基板，储热装置和热电装置。 储热装置嵌入在基板中并与处理器连接，以与处理器进行热交换。 嵌入在基板中的热电装置包括第一金属结表面和第二金属结表面。 第一金属接合面与蓄热装置连接，与蓄热装置进行热交换。 第二金属结表面与第一金属结表面接合，其中热电装置通过第一金属接合表面和第二金属结表面之间的温度差产生电位。

公开(公告)号：US20150362674A1

公开(公告)日：2015-12-17

申请号：US14490688

申请日：2014-09-19

申请人： Unimicron Technology Corp.

发明人： Yin-Ju CHEN ,  Cheng-Po YU ,  Pei-Chang HUANG

IPC分类号： G02B6/122 ,  G02B6/13

CPC分类号： G02B6/122 ,  G02B6/13 ,  G02B6/4203 ,  G02B6/4231 ,  G02B6/428 ,  Y10T29/49131

摘要： A method for assembling an opto-electronic circuit board is described as follows. A bottom cladding layer, a core layer and a top cladding layer are formed on the base orderly such that a waveguide is completed. A first light-guide hole is formed in a base material, and a light source is disposed on the base material thereby forming an emission component. A second light-guide hole is formed in another base material, and then an optic receiver is disposed on another base material thereby forming a receiver component. A circuit substrate is processed in order to form a first cavity, a second cavity and a third cavity on a first circuit layer of the substrate. The waveguide, the emission component and the receiver component are disposed respectively in the first cavity, the second cavity and the third cavity.

摘要翻译： 光电路基板的组装方法如下所述。 在基底上有序地形成底部包层，芯层和顶部覆层，使得波导完成。 在基材中形成第一导光孔，在基材上设置光源，形成发光成分。 在另一个基材中形成第二导光孔，然后将光接收器设置在另一个基材上，从而形成接收器部件。 处理电路基板以在基板的第一电路层上形成第一空腔，第二空腔和第三空腔。 波导，发射部件和接收器部件分别设置在第一腔体，第二腔体和第三腔体中。

公开(公告)号：US20180116056A1

公开(公告)日：2018-04-26

申请号：US15849624

申请日：2017-12-20

申请人： Unimicron Technology Corp.

发明人： Yin-Ju CHEN ,  Ming-Hao WU ,  Cheng-Po YU

IPC分类号： H05K3/46 ,  H05K1/18 ,  H01L23/12 ,  H01L23/498 ,  H01L35/30 ,  H05K1/02 ,  H05K3/36 ,  G06F1/20 ,  H05K1/14 ,  H05K1/11

CPC分类号： H05K3/4647 ,  G06F1/206 ,  H01L23/12 ,  H01L23/13 ,  H01L23/4275 ,  H01L23/49827 ,  H01L35/30 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15153 ,  H01L2924/15313 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/14 ,  H05K1/181 ,  H05K1/185 ,  H05K1/187 ,  H05K3/36 ,  H05K3/4697 ,  H05K2201/048 ,  H05K2201/10219 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10734

摘要： A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.

公开(公告)号：US20170034925A1

公开(公告)日：2017-02-02

申请号：US15289950

申请日：2016-10-10

申请人： Unimicron Technology Corp.

发明人： Yin-Ju CHEN ,  Ming-Hao WU ,  Cheng-Po YU

IPC分类号： H05K3/46 ,  H05K3/30 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H01L35/30 ,  H05K3/36 ,  H05K3/40 ,  H05K1/02

CPC分类号： H05K3/4647 ,  G06F1/206 ,  H01L23/12 ,  H01L23/13 ,  H01L23/4275 ,  H01L23/49827 ,  H01L35/30 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15153 ,  H01L2924/15313 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/14 ,  H05K1/181 ,  H05K1/185 ,  H05K1/187 ,  H05K3/36 ,  H05K3/4697 ,  H05K2201/048 ,  H05K2201/10219 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10734

摘要： A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.

摘要翻译： 具有热恢复功能的电路板包括基板，储热装置和热电装置。 储热装置嵌入在基板中并与处理器连接，以与处理器进行热交换。 嵌入在基板中的热电装置包括第一金属结表面和第二金属结表面。 第一金属接合面与蓄热装置连接，与蓄热装置进行热交换。 第二金属结表面与第一金属结表面接合，其中热电装置通过第一金属接合表面和第二金属结表面之间的温度差产生电位。

公开(公告)号：US20160316565A1

公开(公告)日：2016-10-27

申请号：US14695057

申请日：2015-04-24

申请人： Unimicron Technology Corp.

发明人： Yin-Ju CHEN ,  Ming-Hao WU ,  Cheng-Po YU

IPC分类号： H05K1/18 ,  H05K1/11 ,  H01L35/30 ,  H05K3/30 ,  H05K3/40 ,  H05K1/02 ,  H05K3/46

CPC分类号： H05K3/4647 ,  G06F1/206 ,  H01L23/12 ,  H01L23/13 ,  H01L23/4275 ,  H01L23/49827 ,  H01L35/30 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15153 ,  H01L2924/15313 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/14 ,  H05K1/181 ,  H05K1/185 ,  H05K1/187 ,  H05K3/36 ,  H05K3/4697 ,  H05K2201/048 ,  H05K2201/10219 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10734

摘要： A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.