公开(公告)号：US09974193B2

公开(公告)日：2018-05-15

申请号：US14871991

申请日：2015-09-30

Applicant: International Business Machines Corporation

Inventor： Dylan J. Boday ,  Joseph Kuczynski ,  Jason T. Wertz ,  Jing Zhang

IPC: H05K3/46 ,  H05K3/38 ,  H05K1/03 ,  B32B15/08 ,  H05K3/02 ,  B32B5/02 ,  B32B7/12 ,  B32B15/20 ,  C08L1/00

CPC classification number: H05K3/4655 ,  B32B5/024 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B2255/06 ,  B32B2255/24 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/202 ,  B32B2307/538 ,  B32B2307/546 ,  B32B2457/08 ,  C08L1/00 ,  H05K1/0366 ,  H05K3/022 ,  H05K3/389 ,  H05K2203/0392 ,  H05K2203/061 ,  H05K2203/122

Abstract: A carbene-coated metal foil is produced by applying an N-heterocyclic carbene (NHC) compound to one or more surfaces of a metal foil (e.g., an electrodeposited copper foil having a surface that is smooth and non-oxidized). The NHC compound contains a matrix-reactive pendant group that includes at least one of a vinyl-, allyl-, acrylic-, methacrylic-, styrenic-, amine-, amide- and epoxy-containing moiety capable of reacting with a base polymer (e.g., a vinyl-containing resin such as a polyphenylene oxide/triallyl-isocyanurate (PPO/TAIC) composition). The NHC compound may be synthesized by, for example, reacting a halogenated imidazolium salt (e.g., 1,3-bis(4-bromo-2,6-dimethylphenyl)-4,5-dihydro-1H-imidazol-3-ium chloride) and an organostannane having a vinyl-containing moiety (e.g., tributyl(vinyl)stannane) in the presence of a palladium catalyst. In some embodiments, an enhanced substrate for a printed circuit board (PCB) is produced by laminating the carbene-coated metal foil to a substrate that includes glass fiber impregnated with the base polymer.

公开(公告)号：US09859201B2

公开(公告)日：2018-01-02

申请号：US14730743

申请日：2015-06-04

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Noriyoshi Shimizu ,  Kiyoshi Oi ,  Yuichiro Shimizu

IPC: H01L23/498 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K3/00

CPC classification number: H01L23/49838 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0306 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/09 ,  H05K1/181 ,  H05K3/0023 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/4644 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2203/061 ,  Y10T29/49167 ,  H01L2924/00

Abstract: A wiring substrate includes a first wiring structure and a second wiring structure stacked thereon. The first wiring structure includes a first insulation layer and a via wiring extending through the first insulation layer. The second wiring structure includes a first wiring layer formed on the first insulation layer and the via wiring, and a first plane layer stacked on the first insulation layer and at least partially grid-shaped in a plan view to define second through holes. A second insulation layer is stacked on the first insulation layer to fill the second through holes and cover the first plane layer and the first wiring layer. The second wiring structure has a higher wiring density than the first wiring structure. The second through holes each include a lower open end and an upper open end having a smaller open width than the lower open end.

公开(公告)号：US20170086307A1

公开(公告)日：2017-03-23

申请号：US15311234

申请日：2015-05-21

Applicant: Schweizer Electronic AG ,  Continental Automotive GmbH

Inventor： GOTTWALD Thomas ,  REISSLÖHNER Bernd ,  RALL Thomas

IPC: H05K3/46 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K3/4644 ,  H05K1/02 ,  H05K1/0203 ,  H05K1/0204 ,  H05K3/0044 ,  H05K3/0058 ,  H05K2201/09036 ,  H05K2201/10416 ,  H05K2203/061 ,  H05K2203/167

Abstract: A method of producing a printed circuit board (10) with a plurality of inlays (21, 22, 23, 24), having the following steps: supplying a plurality of inlays (21, 22, 23, 24), of which at least one inlay has at least one positioning element (21.1, 21.2; 22.1 to 22.7; 23.1, 23.2; 24.1, 24.2); building up a layer sequence from a plurality of printed-circuit-board layers, with at least one recess (14) for accommodating inlays, wherein, prior to the step of the plurality of inlays (21, 22, 23, 24) being inserted, the recess (14) is defined in an uppermost layer (12) by a frame made of non-conductive printed-circuit-board material; inserting the plurality of inlays (21, 22, 23, 24) into the recess (14) defined by the frame; covering the inlays (21, 22, 23, 24) with a non-conductive printed-circuit-board material; laminating the layer sequence, and removing at least the positioning elements (21.1, 21.2; 22.1 to 22.7; 23.1, 23.2; 24.1, 24.2) which establish a conductive contact between neighboring inlays.

公开(公告)号：US20170040678A1

公开(公告)日：2017-02-09

申请号：US15302638

申请日：2015-04-09

Applicant: Massachusetts Institute Of Technology

Inventor： Glenn A. Brigham

IPC: H01Q1/38 ,  H01Q9/04 ,  H01Q1/48 ,  H01Q9/28

CPC classification number: H01Q1/38 ,  H01Q1/48 ,  H01Q9/0421 ,  H01Q9/285 ,  H05K1/0222 ,  H05K1/024 ,  H05K1/165 ,  H05K2201/0116 ,  H05K2201/0187 ,  H05K2201/10098 ,  H05K2203/061

Abstract: An assembly that includes a printed circuit board and a foam dielectric material, and a method of fabricating the assembly is disclosed. The assembly includes at least one layer of a foam dielectric material, which has properties similar to those of air. This layer of foam dielectric material is disposed between a top sublaminate and a bottom sublaminate. The bottom sublaminate may be a traditional printed circuit board, comprising an arbitrary number of layers. The top sublaminate may be a single layer, or may be multiple layers and may include an antenna. The foam dielectric material serves to provide mechanical support for the top sublaminate and the central conductor. The foam dielectric material also provides physical separation between the bottom sublaminate and the antenna.

Abstract translation: 公开了一种包括印刷电路板和泡沫电介质材料的组件，以及制造组件的方法。 该组件包括至少一层泡沫电介质材料，其具有与空气相似的性质。 该泡沫介电材料层设置在顶层和底层之间。 底部层压板可以是传统的印刷电路板，其包括任意数量的层。 顶层亚层可以是单层，或者可以是多层，并且可以包括天线。 泡沫介电材料用于为顶部亚层和中心导体提供机械支撑。 泡沫介电材料还提供底部层压板和天线之间的物理分离。

公开(公告)号：US09437535B2

公开(公告)日：2016-09-06

申请号：US14388349

申请日：2014-01-29

Applicant: PANASONIC CORPORATION

Inventor： Maki Nakamura ,  Suguru Fujita

IPC: H01L23/495 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H01L23/66 ,  H05K3/36 ,  H05K1/14 ,  H05K1/18 ,  H05K3/46

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/15192 ,  H01L2924/1533 ,  H01L2924/18161 ,  H05K1/144 ,  H05K1/186 ,  H05K3/368 ,  H05K3/4614 ,  H05K2201/0379 ,  H05K2201/042 ,  H05K2201/10098 ,  H05K2201/10234 ,  H05K2203/061

Abstract: Provided is a wireless module whose size can be made smaller. The wireless module includes: a first substrate on which an antenna is mounted; a second substrate which opposes the first substrate and on which an electronic component is mounted; and a plurality of electric conductors which connect the first substrate and the second substrate and which transmit a signal between the antenna and the electronic components, wherein the plurality of electric conductors are disposed between the first substrate and the second substrate in series in a substantially vertical direction with respect to mounting surfaces of the first substrate and the second substrate.

Abstract translation: 提供了可以使其尺寸更小的无线模块。 无线模块包括：第一基板，其上安装天线; 第二基板，其与所述第一基板相对并且安装有电子部件; 以及多个电导体，其连接所述第一基板和所述第二基板，并且在所述天线和所述电子部件之间传输信号，其中，所述多个电导体以基本垂直的方式串联设置在所述第一基板和所述第二基板之间 相对于第一基板和第二基板的安装表面的方向。

公开(公告)号：US20160095231A1

公开(公告)日：2016-03-31

申请号：US14603363

申请日：2015-01-23

Applicant: Chien-Hung Wu

Inventor： Chien-Hung Wu

IPC: H05K3/46

CPC classification number: H05K3/4697 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4644 ,  H05K3/465 ,  H05K2203/061 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913

Abstract: A manufacturing method of a multi-layer circuit board having a cavity is provided, including the following steps: a core board is provided, and a through hole is formed penetrating the core board; two build-up structures are bonded to two opposite sides of the core board to foam the multi-layer circuit board, and the two build-up structures cover the through hole; and a portion of one of the two build-up structures corresponding to the through hole is removed to make the through hole communicate with the outside and form the cavity. A multi-layer circuit board having a cavity, manufactured by the aforementioned method, is also provided.

Abstract translation: 提供一种具有空腔的多层电路板的制造方法，包括以下步骤：设置芯板，并且形成穿透芯板的通孔; 两个堆积结构被结合到芯板的两个相对侧以使多层电路板发泡，并且两个堆积结构覆盖通孔; 并且去除与通孔相对应的两个堆积结构中的一个的一部分，以使通孔与外部连通并形成空腔。 还提供了通过上述方法制造的具有空腔的多层电路板。

公开(公告)号：US20160044798A1

公开(公告)日：2016-02-11

申请号：US14886607

申请日：2015-10-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masaki KAWATA ,  Yuki ITO

IPC: H05K3/46 ,  H05K3/30

CPC classification number: H05K3/32 ,  H01L2224/16225 ,  H01L2224/81 ,  H05K1/185 ,  H05K1/186 ,  H05K3/0073 ,  H05K3/306 ,  H05K3/4611 ,  H05K3/4632 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/0129 ,  H05K2203/061 ,  H05K2203/063

Abstract: A method of manufacturing a resin multilayer substrate is provided in which a component (3) is incorporated in a stacked body obtained by stacking a plurality of thermoplastic resin sheets (2). The method includes the steps of: softening a first resin sheet (2a) by heating, and pressing the component (3) against the first resin sheet (2a), thereby fixing the component (3) to the first resin sheet (2a); stacking the first resin sheet (2a) on a second resin sheet (2b) having a through hole (14) receiving the component (3) and a third resin sheet (2c) located adjacent to a lower side of the component (3) such that the component (3) is inserted into the through hole (14) and the lower surface of the component (3) faces the third resin sheet (2c); and performing compression bonding by heating and pressurizing the stacked body including these resin sheets (2).

Abstract translation: 提供一种制造树脂多层基板的方法，其中将组分（3）结合在通过堆叠多个热塑性树脂片（2）而获得的层叠体中。 该方法包括以下步骤：通过加热软化第一树脂片（2a），并将部件（3）压在第一树脂片（2a）上，从而将部件（3）固定到第一树脂片（2a）上。 将第一树脂片（2a）堆叠在具有容纳部件（3）的通孔（14）的第二树脂片（2b）和位于部件（3）的下侧附近的第三树脂片（2c） 组件（3）插入到通孔（14）中，并且部件（3）的下表面面向第三树脂片（2c）; 并通过对包括这些树脂片（2）的层叠体进行加热加压来进行压接。

公开(公告)号：US20160037653A1

公开(公告)日：2016-02-04

申请号：US14699808

申请日：2015-04-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dong Hun KANG ,  Joung Suk LEE

IPC: H05K3/42 ,  H05K3/46 ,  H05K1/11

CPC classification number: H05K3/429 ,  H05K1/0225 ,  H05K1/115 ,  H05K3/445 ,  H05K2201/09509 ,  H05K2203/061

Abstract: There are provided an insulating film, a printed circuit board including the insulating film, and a method of manufacturing the printed circuit board. The insulating film includes a first insulating material; a second insulating material; and a metal thin film disposed between the first insulating material and the second insulating material.

Abstract translation: 提供绝缘膜，包括绝缘膜的印刷电路板以及制造印刷电路板的方法。 绝缘膜包括第一绝缘材料; 第二绝缘材料; 以及设置在所述第一绝缘材料和所述第二绝缘材料之间的金属薄膜。

公开(公告)号：US09247631B2

公开(公告)日：2016-01-26

申请号：US13352553

申请日：2012-01-18

Applicant: Chen-Chuan Chang

Inventor： Chen-Chuan Chang

IPC: H01K3/10 ,  H05K1/02 ,  H01L33/64 ,  H05K3/02 ,  H05K3/40

CPC classification number: H05K1/0204 ,  H01L33/642 ,  H01L33/644 ,  H05K3/022 ,  H05K3/4046 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2203/0323 ,  H05K2203/061 ,  H05K2203/063 ,  Y10T29/49124 ,  Y10T29/49126

Abstract: A method, for fabricating a heat dissipation substrate, includes the steps of: providing a substrate, with the substrate including a metal layer, an insulation layer, and a first conductive layer, with the insulation layer positioned between the metal layer and the first conductive layer, and with the metal layer thicker than the first conductive layer; removing part of the metal layer for forming a metal bulk; providing an adhesive layer including an opening, with the opening corresponding to the metal bulk; providing a second conductive layer; laminating the second conductive layer, the adhesive layer and the substrate; forming a hole in the insulation layer and the first conductive layer, with the hole positioned under the metal bulk; and forming a third conductive layer in the hole.

Abstract translation: 一种用于制造散热基板的方法，包括以下步骤：提供衬底，其中衬底包括金属层，绝缘层和第一导电层，绝缘层位于金属层和第一导电层之间 并且金属层比第一导电层厚; 去除用于形成金属体的金属层的一部分; 提供包括开口的粘合层，所述开口对应于所述金属体; 提供第二导电层; 层叠第二导电层，粘合剂层和基板; 在所述绝缘层和所述第一导电层中形成孔，所述孔位于所述金属体下; 以及在所述孔中形成第三导电层。

公开(公告)号：US09237656B2

公开(公告)日：2016-01-12

申请号：US13721556

申请日：2012-12-20

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Shinnosuke Maeda ,  Tetsuo Suzuki ,  Takuya Hando ,  Atsuhiko Sugimoto ,  Satoshi Hirano ,  Hajime Saiki

IPC: H05K3/10 ,  H05K3/46 ,  H05K3/00

CPC classification number: H05K3/10 ,  H05K3/0035 ,  H05K3/0097 ,  H05K3/4673 ,  H05K3/4682 ,  H05K2203/0156 ,  H05K2203/061 ,  H05K2203/1536 ,  Y10T29/49124 ,  Y10T29/49155

Abstract: Embodiments of the presently-disclosed subject matter include a first laminated structure in which at least one conductor layer and at least one resin insulating layer are alternately formed is formed on a supporting substrate, and a core substrate is formed so as to come into contact with the conductor layer which is the uppermost layer of the first laminated structure. Then, laser light is emitted to the core substrate to form a through hole and a metal layer is formed in the through hole. Then, a second laminated structure including at least one conductor layer and at least one resin insulating layer is formed on the core substrate. At that time, the thickness of the conductor layer which is the uppermost layer of the first laminated structure is greater than that of the other conductor layers.

Abstract translation: 目前公开的主题的实施例包括在支撑基板上形成有至少一个导体层和至少一个树脂绝缘层交替形成的第一层叠结构，并且形成芯基板以与 作为第一层叠结构的最上层的导体层。 然后，将激光发射到芯基板以形成通孔，并且在通孔中形成金属层。 然后，在芯基板上形成包括至少一个导体层和至少一个树脂绝缘层的第二叠层结构。 此时，作为第一层叠结构的最上层的导体层的厚度大于其他导体层的厚度。